• Journal of the Microelectronics and Packaging Society
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• v.13 no.1 s.38
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• pp.1-5
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• 2006

We prepared 80 nm-thick TiSix on each 70 nm-thick amorphous silicon and polysilicon substrate using an RF sputtering with $TiSi_2$ target. TiSix composite silicide layers were stabilized by rapid thermal annealing(RTA) of $800^{\circ}C$ for 20 seconds. Line width of $0.5{\mu}m$ patterns were embodied by photolithography and dry etching process, then each additional annealing process at $750^{\circ}C\;and\;850^{\circ}C$ for 3 hours was executed. We investigated the change of sheet resistance with a four-point probe, and cross sectional microstructure with a field emission scanning electron microscope(FE-SEM) and transmission electron microscope(TEM), respectively. We observe an abrupt change of resistivity and voids at the silicide surface due to interdiffusion of silicide and composite titanium silicide in the amorphous substrates with additional $850^{\circ}C$ annealing. Our result implies that the electrical resistance of composite titanium silicide may be tunned by employing appropriate substrates and annealing condition.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2018.06a
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• pp.102-102
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• 2018

Electronic industry had required the finer size and the higher performance of the device. Therefore, 3-D die stacking technology such as TSV (through silicon via) and micro-bump had been used. Moreover, by the development of the 3-D die stacking technology, 3-D structure such as chip to chip (c2c) and chip to wafer (c2w) had become practicable. These technologies led to the appearance of HBM (high bandwidth memory). HBM was type of the memory, which is composed of several stacked layers of the memory chips. Each memory chips were connected by TSV and micro-bump. Thus, HBM had lower RC delay and higher performance of data processing than the conventional memory. Moreover, due to the development of the IT industry such as, AI (artificial intelligence), IOT (internet of things), and VR (virtual reality), the lower pitch size and the higher density were required to micro-electronics. Particularly, to obtain the fine pitch, some of the method such as copper pillar, nickel diffusion barrier, and tin-silver or tin-silver-copper based bump had been utillized. TCB (thermal compression bonding) and reflow process (thermal aging) were conventional method to bond between tin-silver or tin-silver-copper caps in the temperature range of 200 to 300 degrees. However, because of tin overflow which caused by higher operating temperature than melting point of Tin ($232^{\circ}C$), there would be the danger of bump bridge failure in fine-pitch bonding. Furthermore, regulating the phase of IMC (intermetallic compound) which was located between nickel diffusion barrier and bump, had a lot of problems. For example, an excess of kirkendall void which provides site of brittle fracture occurs at IMC layer after reflow process. The essential solution to reduce the difficulty of bump bonding process is copper to copper direct bonding below $300^{\circ}C$. In this study, in order to improve the problem of bump bonding process, copper to copper direct bonding was performed below $300^{\circ}C$. The driving force of bonding was the self-annealing properties of electrodeposited Cu with high defect density. The self-annealing property originated in high defect density and non-equilibrium grain boundaries at the triple junction. The electrodeposited Cu at high current density and low bath temperature was fabricated by electroplating on copper deposited silicon wafer. The copper-copper bonding experiments was conducted using thermal pressing machine. The condition of investigation such as thermal parameter and pressure parameter were varied to acquire proper bonded specimens. The bonded interface was characterized by SEM (scanning electron microscope) and OM (optical microscope). The density of grain boundary and defects were examined by TEM (transmission electron microscopy).

• Journal of the Korean Vacuum Society
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• v.17 no.4
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• pp.365-373
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• 2008

We have succeeded in synthesizing vertically aligned thin multi-walled carbon nanotubes (VA thin-MWCNTs) by a catalytic chemical vapor deposition (CCVD) method onto Fe/Al thin film deposited on a Si wafers using an optimum amount of hydrogen sulfide ($H_2S$) additive. Scanning electron microscope (SEM) images revealed that the as-synthesized CNT arrays were vertically well-oriented perpendicular to the substrate with relatively uniform length. Transmission electron microscope (TEM) observations indicated that the as-grown CNTs were nearly catalyst-free thin-MWCNTs with small outer diameters of less than 10nm. The average wall number is about 5. We suggested a possible growth mechanism of the VA thin-MWCNT arrays. The VA thin-MWCNTs showed a low turn-on electric field of about $1.1\;V/{\mu}m$ at a current density of $0.1\;{\mu}A/cm^2$ and a high emission current density about $2.5\;mA/cm^2$ at a bias field of $2.7\;V/{\mu}m$. Moreover, the VA thin-MWCNTs presented better field emission stability without degradation over 20 hours (h) at the emission current density of about $1\;mA/cm^2$.

• Applied Microscopy
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• v.23 no.2
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• pp.27-40
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• 1993

This study was taken to examine the light microscopic and ultrastructural changes of gill and kidney of female tilapia{Oreochromis niloticus) adapted in 0%o, 10%o, 20%o, and 30%o salt concentrations, respectively, by light, scanning and transmission electron microscope. The results obtained in these experiments were summarized as follows: Gill chloride cell hyperplasia, gill lamellar epithelial separation, kidney glomerular shrinkage, blood congestion in kidneys and deposition of hyalin droplets in kidney glomeruli, tubules were the histological alterations in Oreochromis niloticus. Incidence and severity of gill chloride cell hyperplasia rapidly increased together with increase of salinity, and the number of chloride cells in gill lamellae rapidly increased in response to high external NaCl concentrations. The ultrastructure by scanning electron microscope(SEM) indicated that the gill secondary lamella of tilapia(Oreochromis niloticus) exposed to seawater, were characterized by rough convoluted surfaces during the adaptation. Transmission electron microscopy(TEM) indicated that mitochondria in chloride cells exposed to seawater, were both large and elongate and contained well-developed cristae. TEM also showed the increased chloride cells exposed to seawater. The presence of two mitochondria-rich cell types is discussed with regard to their possible role in the hypoosmoregulatory changes which occur during seawater-adaptation. Most Oreochromis niloticus adapted in seawater had an occasional glomerulus completely filling Bowman's capsule in kidney, and glomerular shrinkage was occurred higher in kidney tissues of individuals living in 10%o, 20%o, 30%o of seawater than in those living in 0%o of freshwater, and blood congestion was occurred severer in kidney tissues of individuals living 20%o, 30%o of seawater than in those living in 10%o of seawater. There were decreases in the glomerular area and the nuclear area in the main segments of the nephron, and that the nuclear areas of the nephron cells in seawater-adapted tilapia were of smaller size than those from freshwater-adapted fish. Our findings demonstrated that Oreochromis niloticus tolerated moderately saline environment and the increased body weight living in 30%o was relatively higher than that living in 10%o in spite of histopathological changes.

• Polymer(Korea)
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• v.39 no.1
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• pp.88-98
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• 2015

4-Amino-N-hexadecylbenzamide-graphene sheets (AHB-GSs), used in the preparation of the polyimide (PI) nanocomposite films, were synthesized by mixing a dispersion of graphite oxide with a solution of the ammonium salt of AHB. The atomic force microscope image of functionalized-GS on mica and a profile plot revealed the average thickness of AHB-GS to be ~3.21 nm. PI films were synthesized by reacting 4,4'-biphthalic anhydride and bis(4-aminophenyl) sulfide. PI nanocomposite films containing various contents of AHB-GS over the range of 0-10 wt% were synthesized using the solution intercalation method. The PI nanocomposite films under different thermal imidization temperatures, 250 and $350^{\circ}C$, were examined. The graphenes, for the most part, were well dispersed in the polymer matrix despite some agglomeration. However, micrometer-scale particles were not detected. The average thickness of the particles was <10 nm, as revealed from the transmission electron microscope images. Only a small amount of AHB-GS was required to improve the gas barrier, and electrical conductivity. In contrast, the glass transition and initial decomposition temperatures of the PI hybrid films continued to decrease with increasing content of AHB-GS up to 10 wt%. In general, the properties of the PI hybrid films heat treated at $350^{\circ}C$ were better than those of films heat treated at $250^{\circ}C$.

• Korean Journal of Materials Research
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• v.11 no.12
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• pp.1042-1046
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• 2001

Co-22%Cr alloy films are promising for high-density perpendicular magnetic recording media with their perpendicular anisotropy and large coercivity of 3000 Oe. We observed that a self organized nano structure(SONS) of fine ferromagnetic Co-enriched phase and paramagnetic Cr-enriched phase appears inside the grain of Co-Cr magnetic alloy thin films at the elevated substrate temperature after do-sputtering. We prepared 1000 $\AA$-thick Co-22%Cr films on 2000 $\AA$- SiO$_2$/Si(100) substrates at the deposition rate of 100 $\AA$/min with substrate temperatures of 3$0^{\circ}C$, 10$0^{\circ}C$, 15$0^{\circ}C$, 20$0^{\circ}C$, 30$0^{\circ}C$, and 40$0^{\circ}C$, respectively. We employed a vibrating sample magnetometer(VSM) to measure the B-H loops showing the saturation magnetifation, coercivity, remanence in in- plane and out- of- plane modes. In- plane coercivity, perpendicular coercivity, and perpendicular remanence increased as substrate temperature increased, how-ever they decreased after 30$0^{\circ}C$ slowly. Transmission electron microscope (TEM) characterization revealed that the self organized nano structure (SONS) appears at the elevated substrate temperature, which forms fine Co-enriched phases inside a grain, then it eventually affect the perpendicular magnetic property. Our results imply that we may tune the perpendicular magnetic properties with SONS obtained at appropriate substrate temperature.

• Proceedings of the Korean Vacuum Society Conference
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• 2016.02a
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• pp.279.1-279.1
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• 2016

박막 트랜지스터 (thin film transistor, TFT)는 고밀도, 대면적화로 높은 전자의 이동도가 요구되면서, 비정질 실리콘 (a-Si)에서 다결정 실리콘 (poly-Si) TFT 로 연구되었다. 이에 따라 비정질 실리콘에서 결정질 실리콘으로의 상변화에 대한 결정화 연구가 활발히 진행되었다. 또한, 박막 태양전지 분야에서도 유리기판 위에 비정질 층을 증착한 후에 열처리를 통해 상변화하는 고상 결정화 (solid-phase crystallization, SPC) 기술을 적용하여, CSG (thin-film crystalline silicon on glass) 태양전지를 보고하였다. 이러한 비정질 실리콘 층의 결정화 기술을 결정질 실리콘 태양전지 에미터 형성 공정에 적용하고자 한다. 이 때, 플라즈마화학증착 (Plasma-enhanced chemical vapor deposition, PECVD) 장비로 증착된 비정질 실리콘 층의 열처리를 통한 결정화 정도가 중요한 요소이다. 따라서, 비정질 실리콘 층의 결정화에 영향을 주는 인자에 대해 연구하였다. 비정질 실리콘 증착 조건(H2 가스 비율, 도펀트 유무), 실리콘 기판의 결정방향, 열처리 온도에 따른 결정화 정도를 엘립소미터(elipsometer), 투과전자현미경 (transmission electron microscope, TEM), 적외선 분광기 (Fourier Transform Infrared, FT-IR) 측정을 통하여 비교 하였다. 이를 기반으로 결정화 온도에 따른 비정질 실리콘의 결정화를 위한 활성화 에너지를 계산하였다. 비정질 실리콘 증착 조건 보다 기판의 결정방향이 결정화 정도에 크게 영향을 미치는 것으로 확인하였다.

• Journal of Life Science
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• v.12 no.6
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• pp.803-811
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• 2002

The present study was carried out for research and development of natural antimicrobial from extract of Stachys sieboldii MIQ against food borne bacteria. The hexane extract of Stachys sieboldii MIQ at 250$\mu\textrm{g}$/$m\ell$ per disc showed 15 ~ 20 mm inhibition zone against gram positive and gram negative barteria. Minimum inhibitory concentration (MIC) of hexane extract was 250${\mu}g$/$m\ell$against Bacillus cereus, 250~500${\mu}g$/$m\ell$against Listeria monocytogenes, 500${\mu}g$/$m\ell$ against Staphylococcus aureus, Psedomonas aeruginosa. Observation by transmission electron microscope, showed that disruption of the cell wall assumed to be due to the bactericidal activity. In addition, the membrane integrity of the sensitive cells was disrupted by exposure to Stachys sieboldii MIQ extract on the D-$\beta$-galatosidase activity as substrate of O-nitrophenol-$\beta$-D-galacto-pyranoside. The hexane extract of Stachys sieboldii MIQ was very stable on the pH and thermal stability.

• Journal of Soil and Groundwater Environment
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• v.25 no.1
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• pp.95-105
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• 2020

In this study, iron nanoparticles impregnated hydrochar (FeNPs@HC) was synthesized using lignocellulosic waste and simple one-pot synthetic method. During hydrothermal carbonization (HTC) process, the mixture of lignocellulosic waste and ferric nitrate (0.1~0.5 M) as a precursor of iron nanoparticles was added and heated to 220℃ for 3 h in a teflon sealed autoclave, followed by calcination at 600℃ in N₂ atmosphere for 1 h. For the characterization of the as-prepared materials, X-ray diffraction (XRD), cation exchange capacity (CEC), fourier transform infrared spectrometer (FT-IR), Brunauer-Emmett-Teller (BET), transmission electron microscope (TEM), Energy Dispersive X-ray Spectroscopy (EDS) were used. The change of Fe(III) concentration in the feedstock influenced characteristics of produced FeNPs@HC and removal efficiency towards As(V) and Pb(II). According to the Langmuir isotherm test, maximum As(V) and Pb(II) adsorption capacity of Fe_0.25NPs@HC were found to be 11.81 and 116.28 mg/g respectively. The results of this study suggest that FeNPs@HC can be potentially used as an adsorbent or soil amendment for remediation of groundwater or soil contaminated with arsenic and cation heavy metals.

• Proceedings of the Korean Vacuum Society Conference
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• 2013.02a
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• pp.409-409
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• 2013

최근, 집적 소자의 미세화에 따라 늘어난 배선 신호 지연 및 상호 간섭, 그리고 소비 전력의 증가는 초고집적 소자 성능 개선에 한계를 가져온다. 이에 따라 기존의 알루미늄(Al)/실리콘 절연 산화막은 구리(Cu)/저유전율 박막(low-k)으로 대체되고 있고, 이는 소자 성능 개선에 큰 영향을 미친다. 그러나 Cu는 Si과 low-k 내부로 확산이 빠르게 일어나 소자의 비저항을 높이고, 누설 전류를 일으키는 등 소자의 성능을 저하시킬 수 있는 문제점을 가지고 있다. 이러한 Cu의 확산을 막기 위하여 Ta, TaN 등과 같은 확산방지막에 대한 연구가 활발히 진행되어 왔으나, 배선 공정의 집적화와 low-k 대체에 따른 공정 및 신뢰성 문제로 인해 새로운 확산방지막의 개발이 필요하게 되었다. 이를 위해, 본 연구에서는 Cu-V 합금을 사용하여 low-k 기판 위에 확산방지막을 자가 형성 시키는 공정에 대한 연구를 진행하였다. 다양한 low-k 기판에서 열처리조건에 따른 Cu-V 합금의 특성을 확인하기 위해 4-point probe를 통한 비저항 평가와 XRD (X-ray diffraction) 분석이 이뤄졌다. 또한, TEM (transmission electron microscope)을 이용하여 $300^{\circ}C$에서 1 시간 동안 열처리를 거쳐 자가형성된 V-based interlayer가 low-k와 Cu의 계면에서 균일하게 형성된 것을 확인하였다. 형성된 V-based interlayer의 barrier 특성을 평가하고자 Cu-V합금/low-k/Si 구조와 Cu/low-k/Si 구조의 leakage current를 비교 분석하였다. Cu/low-k/Si 구조는 비교적 낮은 온도에서 leakage current가 급격히 증가하는 양상을 보였으나, Cu-V 합금/low-k/Si 구조는 $550^{\circ}C$의 thermal stress 에서도 leakage current의 변화가 거의 없었다. 이러한 결과를 바탕으로 열처리를 통해 자가형성된 V-based interlayer의 Cu/low-k 간 확산방지막으로서 가능성을 검증하였다.