• Resources Recycling
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• v.16 no.1 s.75
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• pp.59-67
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• 2007

Recovery of acids from the waste etching solution of containing acetic, nitric and hydrofluoric acid discharged from silicon wafer manufacturing process has been attempted by using solvent extraction method. EHA(2-Ethylhexlalcohol) for acetic acid and TBP(Tri-butly Phosphate) for nitric and hydrofluoric acid as a extraction agent was used to the experiment to obtain the process design data in separation procedure. From the experimental data and McCabe-Thiele diagram analysis, we obtained the optimum conditions of phase ratio(O/A) and stages to separate each acid sequently from the mixed acids. The recovery yield was obtained above 90% for acetic acid from the acid mixtures, 90% for nitric acid from acetic acid extraction raffinate and then above 67% for hydrofluoric acid from final extraction raffinate.

• Proceedings of the Korean Institute of Resources Recycling Conference
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• 2006.05a
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• pp.47-55
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• 2006

Recovery of acids from the waste etching solution of containing nitric, hydrofluoric and acetic acid discharged from silicon wafer manufacturing process has been attempted by using solvent extraction method. With EHA (2-Ethylhexlalcohol) for acetic acid and TBP(Tri-butly Phosphate) for nitic and hydrofluoric acid as extraction agent was carried on experiment to obtain the process design data in separation procedure. From the McCabe-Thiele diagram analysis, we obtained the optimum conditions of phase ratio(O/A) and stages to separate the each acid sequently from the mixture acids. The recovery yield was obtained 90% above for acetic acid from the acid mixtures, 90% above for nitric acid from acetic acid extraction raffinate and then 67% above for hydrofluoric acid from final extraction raffinate.