• Korean Journal of Materials Research
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• v.5 no.1
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• pp.42-54
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• 1995

$Ta_2O_5$ thin film IS a promising material for the high dielectrics of ULSI DRAM. In this study, $Ta_2O_5$ thin film was grown on p-type( 100) Si wafer by thermal metal organic chemical vapo deposition ( MCCVD) method and the effect of operating varialbles including substrate temperature( $T_s$), bubbler temperature( $T_ \sigma$), reactor pressure( P ) was investigated in detail. $Ta_2O_5$ thin film were analyzed by SEM, XRD, XPS, FT-IR, AES, TEM and AFM. In addition, the effect of various anneal methods was examined and compared. Anneal methods were furnace annealing( FA) and rapid thermal annealing( RTA) in $N_{2}$ or $O_{2}$ ambients. Growth rate was evidently classified into two different regimes. : (1) surface reaction rate-limited reglme in the range of $T_s$=300 ~ $400 ^{\circ}C$ and (2: mass transport-limited regime in the range of $T_s$=400 ~ $450^{\circ}C$.It was found that the effective activation energies were 18.46kcal/mol and 1.9kcal/mol, respectively. As the bubbler temperature increases, the growth rate became maximum at $T_ \sigma$=$140^{\circ}C$. With increasing pressure, the growth rate became maximum at P=3torr but the refractive index which is close to the bulk value of 2.1 was obtained in the range of 0.1 ~ 1 torr. Good step coverage of 85. 71% was obtained at $T_s$=$400 ^{\circ}C$ and sticking coefficient was 0.06 by comparison with Monte Carlo simulation result. From the results of AES, FT-IR and E M , the degree of SiO, formation at the interface between Si and TazO, was larger in the order of FA-$O_{2}$ > RTA-$O_{2}$, FA-$N_{2}$ > RTA-$N_{2}$. However, the $N_{2}$ ambient annealing resulted in more severe Weficiency in the $Ta_2O_5$ thin film than the TEX>$O_{2}$ ambient.

• Journal of the Korean Magnetics Society
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• v.4 no.2
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• pp.126-129
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• 1994

In order to invetigate the effect of Pr additive on the magnetostriction of amorphous Fe-B alloys, amorphous $Fe_{86-x}B_{14}Pr_{x}(2{\leq}x{\leq}8\;at.%)$ alloys were prepared by a rapid solidification process. As the Pr content increased in the as-prepared amorphous $Fe_{84}B_{14}Pr_{2}$ alloy annealed at $300^{\circ}C$ for 2 hr increased to 70 ppm. Ac power loss and permeability$(f=50\;kHz,\;B_{m}=0.1\;T)$ of the annealed amorphous $Fe_{84}B_{14}Pr_{2}$ alloy were 15 W/kg and $5.5{\times}10^{3}$, respectively.

• Journal of the Korean Society for Heat Treatment
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• v.22 no.5
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• pp.275-281
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• 2009

The microstructure of copper films prepared by a sputtering apparatus, which was fabricated to enhance the shadowing effect, was investigated by scanning electron microscopy. Black copper films were deposited on copper wires at an Ar pressure of 10 Pa. The black films had an extremely porous structure composed of separated columns. This structure is quite similar to that of black titanium films prepared by cylindrical magnetron sputtering. These results suggest that the porous structure composed of separated columns is easily formed for metal films by enhancing the shadowing effect.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2003.11a
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• pp.88-93
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• 2003

무전해 Ni-P와 Sn의 반응 및 Ni-P의 결정화에 대한 P 함량의 영향을 세 가지 다른 조성의 Ni-P (P 4.6, 9, 13 $wt.\%$)를 이용하여 연구하였다. $300^{\circ}C$까지 열처리한 모든 시편에서 $Ni_3Sn_4$ intermetallic compound (IMC)가 생성되었고 이들 시편을 $450^{\circ}C$까지 열처리한 경우 Sn 두께가 $0.5{\mu}m$로 작을 때 $Ni_3Sn_4$가 모두 $Ni_3Sn_2$로 변화하였다. nanocrystal인 Ni-4.6P는 Ni (111) texture를 유지하며 결정화되었고 Sn과의 반응시 형성되는 $Ni_3Sn_4$ IMC 또한 비정질인 Ni-9P, Ni-13P 경우보다 강한 (111) texture를 가짐이 확인되었다. Ni-P 막의 P 함량이 작은 경우 $Ni_3Sn_4$ IMC는 두껍고 조밀하게 형성되는 반면 P-rich layer 두께는 작아졌다.

• Journal of Welding and Joining
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• v.5 no.3
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• pp.28-37
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• 1987

To clarify the debonding phenomena of clad steel, the effect of thermal treatment (temperature, holding time) on the interfacial strength of clad steel was preliminarily investigated. From this study, it was confirmed that the interfacial strength of clad steel was deteriorated by thermal treatment and the amount of strength deteriorated, depending on the condition of thermal treatment, could be evaluated by the following equation. ${\sigma}_{ HT}/{\sigma}_{i}/=A_{0}-A\;exp(-Q/RT)log(t/t_{0})$ This equation implies that temperature has a far strong effect on strength deterioration than tiem. The deterioration of interfacial strength of clad steel after thermal treatment may be derived from the thermal stress caused by the difference in thermal expansion coefficient between component materials and microstructural change along the interface.

• Journal of the Korean Society for Heat Treatment
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• v.5 no.1
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• pp.32-40
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• 1992

This content is a part of the results of the study on the development of the vacuum carburizing technology. In this study the vacuum carburizing furnace being used was the furnace that developed through the joint project between KIMM and Kyung-Pook Heat Treating Co. from June 1988 to Nov. 1990. And the used carburizing gas was the propane gas and the introducing methods of the gas applied two methods such as pulse and constant pressure. By this study we established the basis of the furnace manufacturing technology and of the processing technology in the vacuum carburizing. Above all in this work there are notable meanings in a viewpoint of the foremost research in home. Hereafter, we are going to industrialize the vacuum carburizing technology by improving the results of the present work and by developing the process for the mass production.

• Journal of the Korean Society for Heat Treatment
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• v.13 no.5
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• pp.303-308
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• 2000

The ring gears of automobile parts are manufactured generally process chart of which is as follows : forging ${\rightarrow}$ annealing or normalizing ${\rightarrow}$ rough machining ${\rightarrow}$ hardening(Quenching-Tempering or carburizing process) ${\rightarrow}$ finish machining. Isothermal annealing process after forging is most effective in the side of improvment of machinability. On this study we selected two kinds of steel;SCM415, SCM435 of most universal and investigated microstructures to find out most suitable condition of heat treatment in proportion continuous cooling and isothermal annealing. As the cooling rate is $5^{\circ}C$ per minute in continuous cooling process, martensite and bainite are coexisted with ferrite and pearlite in SCM435 steel. If the cooling rate is slower than $5^{\circ}C$ per minute, microstructure were only ferrite and pearlite but formation of band structure can't be avoid. On the other hand, microstructure is only ferrite and pearlite regardless of cooling rate because carbon content of SCM415 steel is low. Moreover formation of band structure isn't exposed by faster cooling rate. Most optimal temperature of the isothermal annealing is from $650^{\circ}C$ to $680^{\circ}C$ in SCM435 steel. When holding time is 60 minute with $650^{\circ}C$, the identical ferrite and pearlite microstructures can be obtained.

• Proceedings of the Korean Vacuum Society Conference
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• 2012.02a
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• pp.156-157
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• 2012

단일 셀에서 비휘발성 및 고속의 휘발성 메모리를 모두 구동할 수 있는 다기능 메모리는 모바일 기기 및 embedded 장치의 폭발적인 성장에 있어 그 중요성이 커지고 있다. 따라서 최근 이러한 fusion기술을 응용한 unified RAM (URAM)과 같은 다기능 메모리의 연구가 주목 받고 있다. 이러한 다목적 메모리는 주로 silicon on insulator (SOI)기반의 1T-DRAM과 SONOS기술 기반의 비휘발성 메모리의 조합으로 이루어진다. 하지만 이런 다기능 메모리는 주로 단결정기반의 SOI wafer 위에서 구현되기 때문에 값이 비싸고 사용범위도 제한되어 있다. 따라서 이러한 다기능메모리를 다결정 실리콘을 이용하여 제작한다면 기판에 자유롭게 메모리 적용이 가능하고 추후 3차원 적층형 소자의 구현도 가능하기 때문에 다결정실리콘 기반의 메모리 구현은 필수적이라고 할 수 있겠다. 본 연구에서는 다결정실리콘을 이용한 channel recessed구조의 다기능메모리를 제작하였으며 각 1T-DRAM 및 NVM동작에 따른 memory 특성을 살펴보았다. 실험에 사용된 기판은 상부 비정질실리콘 100 nm, 매몰산화층 200 nm의 SOI구조의 기판을 이용하였으며 고상결정화 방법을 이용하여 $600^{\circ}C$ 24시간 열처리를 통해 결정화 시켰다. N+ poly Si을 이용하여 source/drain을 제작하였으며 RIE시스템을 이용하여 recessed channel을 형성하였다. 상부 ONO게이트 절연막은 rf sputter를 이용하여 각각 5/10/5 nm 증착하였다. $950^{\circ}C$ N2/O2 분위기에서 30초간 급속열처리를 진행하여 source/drain을 활성화 하였다. 계면상태 개선을 위해 $450^{\circ}C$ 2% H2/N2 분위기에서 30분간 열처리를 진행하였다. 제작된 Poly Si MFM에서 2.3V, 350mV/dec의 문턱전압과 subthreshold swing을 확인할 수 있었다. Nonvolatile memory mode는 FN tunneling, high-speed 1T-DRAM mode에서는 impact ionization을 이용하여 쓰기/소거 작업을 실시하였다. NVM 모드의 경우 약 2V의 memory window를 확보할 수 있었으며 $85^{\circ}C$에서의 retention 측정시에도 10년 후 약 0.9V의 memory window를 확보할 수 있었다. 1T-DRAM 모드의 경우에는 약 $30{\mu}s$의 retention과 $5{\mu}A$의 sensing margin을 확보할 수 있었다. 차후 engineered tunnel barrier기술이나 엑시머레이저를 이용한 결정화 방법을 적용한다면 device의 특성향상을 기대할 수 있을 것이다. 본 논문에서는 다결정실리콘을 이용한 다기능메모리를 제작 및 메모리 특성을 평가하였다. 제작된 소자의 단일 셀 내에서 NVM동작과 1T-DRAM동작이 모두 가능한 것을 확인할 수 있었다. 다결정실리콘의 특성상 단결정 SOI기반의 다기능 메모리에 비해 낮은 특성을 보여주었으나 이는 결정화방법, high-k절연막 적용 및 engineered tunnel barrier를 적용함으로써 해결 가능하다고 생각된다. 또한 sputter를 이용하여 저온증착된 O/N/O layer에서의 P/E특성을 확인함으로써 glass위에서의 MFM구현의 가능성도 확인할 수 있었으며, 차후 system on panel (SOP)적용도 가능할 것이라고 생각된다.

• Journal of the Korean Society for Heat Treatment
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• v.32 no.5
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• pp.212-223
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• 2019

This study is to investigate the relationship between microstructural factors and tensile properties after aging heat treatment of the 15-5PH stainless steel at the temperature range of $450^{\circ}C$, $500^{\circ}C$ and $550^{\circ}C$ for various time. For the aging time of 2 hours, hardness showed maximum at $450^{\circ}C$ and then decreased with increasing aging temperature. While, hardness decreased gradually during aging $450^{\circ}C$, $500^{\circ}C$ and $550^{\circ}C$ from 1 hour to 5 hours but the hardness nearly unchanged until the 100 hours after 5 hours aging. When aging at $450^{\circ}C$, Cu atoms preferentially aggregated at the prior austenite grain boundaries and martensite lath boundaries, and Cu concentration at those boundaries was nearly unchanged even after aging for 100 hours. Therefore it was suggested that the coherency is still maintained after 100 hours aging at $450^{\circ}C$. Aging at $500^{\circ}C$ and $550^{\circ}C$ results in an increase in the concentration of Ni at the martensite lath boundaries and prior austenite grain boundaries, resulting in the formation of reversed austenite. Especially, when aged at $550^{\circ}C$ for 100 hours, the concentration of Ni remarkably increased at those boundaries, and thus the microstructure of herring bone shape was appeared. Considering the migration of Ni atom to the lath boundaries and prior austenite grain boundaries, Ni atoms contributed greatly to the formation of reversed austenite. On the other hand, it was found that Cu atoms hardly moving to those boundaries may not be contributed to the formation of reversed austenite. When aging at $450^{\circ}C$, the coarsening of the precipitated Cu atoms proceeded very slowly with increasing aging time, therefore the decrease in strengths were small but the reduction area was considerably increased due to the softening of the matrix. At the aging temperature of $500^{\circ}C$ and $550^{\circ}C$, the strengths decreased and the elongation and reduction area increased due to the appearance of the reversed austenite. Especially, the increase of reduction area was remarkable.

• Journal of Korean Society of Forest Science
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• v.43 no.1
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• pp.31-34
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• 1979

In this study, enzymatic hydrolysis of the substrate of the waste wood of Cortinellus edodes was investigated using crude cellulase preparation of Trichoderma viride Pers. ex. Fr. SANK 16374. The crude cellulase was produced by the submerged culture process and produced in the culture fluid was salted out quantitatively by the use of ammonium sulfate. Reducing sugar was determined by the dinitrosalisylic acid (DNS) method. 1. The chemical composition of the waste wood was crude protein 2.26%, c. fat 2.57%, c. fibre 44.60%, c. ash 5.58% and lignin 13.62%. In amino acid composition, no cystine and methionine was showed, but trace amount of Vitamin A, $B_1$, and $B_2$, niacine and chloride were detected. (Table 1) 2. As heat treatment of the substrate was found to produce the highest reducing sugar yield being reacted for 48hr. with T.v cellulase, the substrate was heated to $190{\pm}5^{\circ}C$. for 45 min. either before or immediately after milling. 3. The substrate heated and ball milled at $190{\pm}5^{\circ}C$. for 45 min. the reducing sugar yield reached to 11.5%. 4. The substrate without any treatment was found to produce the highest reducing sugar yield being reacted 72hr. with T. v cellulase, the reducing sugar yield reached to 10.1%. 5. The rate of reducing sugar per each treated substrate was decreased by the order of the substrated, heated and then ball milled at $190{\pm}5^{\circ}C$. for 45 min. (11.5%)> without any treatment (10.1)> ball milled and heated at $190{\pm}5^{\circ}C$. for 45 min. (6.9%). 6. Saccharification of waste wood has been shown to be possible by heat treated and milling the substrate in contact with cellulase. And it is likely to be recommended that the waste wood may be valuable for raw materials of saccharification.