• Journal of the Microelectronics and Packaging Society
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• v.29 no.2
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• pp.43-48
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• 2022

Effect of temperature/humidity (T/H) treatment conditions on the peel strength of screen-printed Ag/polyimide (PI) structures was evaluated by peeling PI films in 90° peel test. Initial peel strength was 25.99±1.47 gf/mm, and then decreased to 6.05±0.54 gf/mm after 500 h at 85℃/85% relative humidity T/H condition. And, the peeled locus was changed from Ag/PI interface to shallow cohesive inside PI near interface. X-ray photoelectron spectroscopy analysis on the peeled surfaces showed that the long-term moisture penetration into the Ag/PI interface during T/H treatment led to hydrolytic degradation of PI to form weak boundary layer inside PI near Ag/PI interface, which are responsible for large decrease in peel strength.

• Journal of Surface Science and Engineering
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• v.29 no.5
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• pp.379-385
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• 1996

Adhesion of Cu/Cr and Cu/$Cu_xCr_{1-x}$ thin films onto polyimide substrates has been studied. For an adhesion layer, Cr or Cu-Cr alloy films were deposited onto polyimide using DC magnetron sputtering machine. Then Cu was sputter-deposited and finally, Cu was electroplated. Adhesion was evaluated using $90^{\circ}C$ peel test or T-peel test. Plastic deformation of the peeled metal layer was qualitatively measured using XRD technique. It is confirmed that high interfacial fracture energy and large plastic deformation are important to enhance the peel adhesion strength. High peel strength is obtained when the interface is strongly bonded. More ductile film has higher peel strength. In Cu-Cr alloy films, opposite effects of the Cr addition in the alloy film on the peel strength are operative: a beneficial effect of strong interfacial bonding and a negative effect of smaller plastic deformation.

• Transactions of the Korean Society of Automotive Engineers
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• v.6 no.6
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• pp.166-173
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• 1998

The evaluation of joint fatigue strength of light weight materials for an electrical vehicle body has been performed through T-peel joint tests with the design parameters such as joint style, adherend type, adherend thickness, adhesive thickness, and various adhesives. Fatigue strength was evaluated through 5-Hz, tension-tension, load controlled test with the zero stress ratio. It was observed that the fatigue strength of the joint increases with the increase of the adherend thickness. With the increase of the adhesive thickness, however, the fatigue strength of the joint increases insignificantly. An aluminum-FRP adherend combination shows much higher fatigue strength than an aluminum-aluminum adherend combination. The results of fatigue tests were found to be consistent with those of static tests.

• Korean Journal of Metals and Materials
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• v.47 no.10
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• pp.675-680
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• 2009

Effects of $85^{\circ}C/85%$ Temperature/Humidity (T/H) treatment conditions on the peel strength of an electroless-plated Ni/polyimide system were investigated from a $180^{\circ}$ peel test. Peel strength between electroless-plated Ni and polyimide monotonically decreased from $37.4{\pm}5.6g/mm$ to $22.0{\pm}2.7g/mm$ for variation of T/H treatment time from 0 to 1000 hrs. The interfacial bonding mechanism between Ni and polyimide appears to be closely related to Ni-O bonding at the Ni/polyimide interface. The decrease in peel strength due to T/H treatment appears to be related to polyimide degradation due to moisture penetration through the interface and the bulk polyimide itself.

• Journal of Welding and Joining
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• v.33 no.4
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• pp.44-49
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• 2015

The structural epoxy adhesive used in car body assembly needs the highest level of joint mechanical strength under lap shear, T-peel and impact peel conditions. In this study, the effect of nano functionalized block copolymer addition on the impact peel strength of epoxy adhesive was investigated. DSC analysis showed that the addition of nano functionalized block copolymer did not affect the curing reaction of epoxy adhesive. From single lap shear test, it was found out that the addition of nano functionalized block copolymer slightly decreased the cohesive strength of cured adhesive layer. The addition of nano functionalized block copolymer showed beneficial effect on T-peel strength by changing the adhesive failure mode to the mixed mode. However, the addition of nano functionalized block copolymer just decreased the room temperature impact peel strength. It was considered that the addition of nano functionalized block copolymer could have effect on disturbing the crack propagation only for the case of slow strain rate.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.33 no.5
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• pp.474-481
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• 2009

Fracture models and criteria of adhesive with two parameters, namely $G_C$ and ${\sigma}_{max}$, have been developed to describe the fracture process of adhesive joints. Cohesive zone model(CZM) is a representative two parameter failure criteria approach. In CZM, ${\sigma}_{max}$ is a critical, limiting maximum value of the stress in the damage zone ahead of the crack and is assumed to have some physical significance in adhesive failure. Based on CZM and finite element analysis method, the relationship between fracture load and adhesive properties, as $G_{IC)$ and $({\sigma}_{max})_I$, was investigated in adhesively bonded joint tensile test and T-peel test. The two parameters in tensile mode loading were evaluated by using the relationship. The value of $G_{\IC}$ evaluated by proposed method showed close agreement with analytical solution for tapered double cantilever beam(TDCB) test which proposed in an ASTM standard.

• Bulletin of the Korean Chemical Society
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• v.28 no.2
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• pp.188-192
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• 2007

In this work, the effects of chemical treatment of polyimide films were studied by FT-IR, X-ray photoelectron spectroscopy (XPS), atomic force microscopy (AFM) and contact angles. The adhesion characteristics of the films were also investigated in the peel strengths of polyimide/aluminum films. The increases of surface functional groups of KOH-treated polyimide films were greatly correlated with the polar component of surface free energy. The peel strength of polyimides to metal substrate was also greatly enhanced by increasing the KOH treatment time, which can be attributed to the formation of polar functional groups on the polyimide surfaces, resulting in enhancement of the work of adhesion between polymer film and metal plate.

• Journal of Surface Science and Engineering
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• v.26 no.6
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• pp.327-333
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• 1993

The effect of heat treatment on the adhesion between Cu-18wt% Cr film and polyimide has been studied by using T-peel test, AES, and XRD. Cu-18wt% Cr alloy and pure Cu films were sputter deposited onto pol-yimide. Cu was electroplated before and after heat treatment at $400^{\circ}C$ for 0.5 hr and 2 hrs respectively. The adhesion of metal film onto polyimide was considerably good before heat treatment, but heat treatment re-duced the peel adhesion strength in all specimens. The reduction in adhesion in adhesion strength values in the specimens which were plated after heat treatment was mainly due to Cr-O rich pahse formed in the metal/polyimide in-terface. In the specimens which were heat treated after plating, the enhanced ductility in the metal films con-tributes the peel adhesion strength by increasing the amount of deformation in metal strips.

• Transactions of the Korean Society of Automotive Engineers
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• v.8 no.1
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• pp.183-190
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• 2000

The objective of this work is to develop a criterion for predicting the failure strength of the joints bonded by ductile adhesives. To obtain a criterion, first, fracture tests were carried out for T-peel joint and Single-lap joint with widely differing joints geometries. Then using the fracture loads obtained at tests, the finite element analysis were performed, in which the stresses in the adhesive bonds were calculated in great detail. After examining four epoxy adhesives, it is concluded that the fracture of adhesively bonded joint occurs when the maximum of the ratio of the mean to effective stresses exceeds a constant value which can be determined from analysis and test for each adhesive.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2018.06a
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• pp.42.2-42.2
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• 2018

신도시 및 대규모 도시 개발이 진행됨에 따라 안정적이고 효율적인 전력 공급을 위해 다수의 지상 배전함이 설치되고 있으며, 이에 따라 불법 광고물 및 스티커의 부착으로 인한 문제가 발생하고 있다. 이를 해결하기 위하여 여러 기관 및 산업체에서는 부착 방지용 코팅 도료 및 시트에 대하여 다양한 연구개발을 진행하고 있으며, 현장에 적용 된 다수의 제품이 존재한다. 하지만 현재 대부분의 제품들은 약 1년 정도의 시간이 지나면 부착 방지 기능을 상실하며, 도료와 기판 또는 시트와 기판 사이의 박리가 일어나 도시의 미관을 더욱 해치는 결과를 초래하고 있다. 이러한 원인으로는 부착력(Peel resistance, N/cm)을 측정하는 기존의 제시된 방법(KS T 1028, Peel test)으로는 정확한 측정이 어렵기 때문에 제품 선별에 어려움이 있다. 일반 기판의 경우 규격에서 요구하는 각도($90^{\circ}$, $180^{\circ}$)가 잘 유지되어 정밀한 부착력 측정이 가능하지만, 저점착 기능성 코팅소재(Anti-adhesion coating)의 경우 부착 자체가 어렵기 때문에 요구 각도를 유지하기 어려워 정밀한 측정을 할 수 없다. 이러한 문제점들을 해결하고자 압입자(Probe)를 이용한 새로운 평가 장치와 방법(Tack test)을 개발 및 제시하였다. 평가 지표로는 최대 점착력(Adhesive force, N), 최대 점착력일 때 점착제가 늘어난 총 길이(Extension of adhesive, mm), 탈착 에너지(Energy, J)가 있으며, 인가하는 힘(N)이 커질수록, 탈착 속도(Velocity)가 빨라질수록 평가 지표 모두 값이 상승하는 경향성을 보인다. 각 시험방법(Peel test, Tack test)에 대한 테이프류 점착제와 기판과의 결합이 끊어지는(Debonding, 탈착) 메커니즘(Mechanism)은 점착제 기공(Cavity)의 형성, 결합이 끊어지는 힘(Debonding force, N), 힘의 평형(Force balance)로 설명 가능하며, 상호간의 관계성을 도출한다. 이와 같은 평가 지표를 활용하여 저점착 기능성 코팅소재에 대해 정밀한 평가를 하는 것으로, 향후 개발될 다양한 제품에 대한 성능 분별력을 높이고, 현장에 적용 될 제품들의 성능을 끌어 올려 기존에 발생한 다양한 문제점들을 해결 할 수 있다.