• Elastomers and Composites
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• v.35 no.4
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• pp.296-302
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• 2000

The surfaces of injection and pressure-molded sheets of poly(ethylene-covulylacetate)(EVA) foams used for shoe mid-sole were treated with low temperature plasma to improve adhesion with a water-based polyurethane adhesives. Several experimental variables were considered, such as radio frequency power, treating time, type of gas. gas flow, and distance between electrode and sample. The modificated surface by plasma treatment were characterized using contact angle meter, scanning electron microscopy(SEM), universal testing machine(UTM). Adhesion was tested by T-peel tests of treated EVA foams/polyurethane adhesive joints. The treatment in the low temperature plasma produced a noticeable decrease in contact angle. The peel strength of EVA foams treated with plasma was increased with plasma treating time, and gas flow.

• Journal of Adhesion and Interface
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• v.5 no.4
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• pp.1-8
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• 2004

UV-curable pressure sensitive adhesives were prepared by blending acrylic copolymer, copolymerized with butyl acrylate, acrylic acid and methyl methacrylate by solution polymerization, and trimethylolpropane triacrylate. The PSAs were evaluated by adhesion strength with varying UV dose, and also glass transition temperature ($T_g$) of PSAs were measured. When exposed on UV irradiation, the PSAs showed the decreased adhesion strength and increased $T_g$. And following UV irradiation, the PSAs did not leave any residue on wafer after peel off PSA.

• Journal of the Korean institute of surface engineering
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• v.29 no.3
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• pp.157-162
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• 1996

The effects of microstructural change on the adhesion strength between Cu/Cr film and polyimide have been studied. Cr films (50 nm thick) and Cu films (500 or 1000 nm thick) were deposited on polyimide by DC magnetron sputtering. During Cu deposition the Ar pressure was 5 or 100 mtorr. The microstructure was observed by SEM and the adhesion was measured by T-peel test. Plastic deformation of peeled metal strips was characterized quantitatively by using XRD technique. The film in which Cu is deposited at 100 mtorr has higher adhesion strength than the film in which Cu is deposited at 5 mtorr. And in the film with same deposition pressure of 100 mtorr, the adhesion strength is increased as the deposited thickness increases from 500 to 1000 nm. The adhesion change of Cu/Cr can be interpreted as the difference in plastic deformation.

• Journal of Dental Rehabilitation and Applied Science
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• v.16 no.2
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• pp.123-132
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• 2000

The field of maxillofacial prosthetics is concerned with the prosthetic reconstruction of missing head and neck tissue. Currently, facial prostheses are usually applied in cases of defects caused by the surgical removal of tumors or congenital defects. While silicone has been most widely used for the reconstruction of missing maxillofacial defects, it does not have ideal physical properties. Therefore, bonding a thin polyurethane sheet to silicone prostheses was recommended. In this case skin adhesives were used for the retention of maxillofacial prostheses. But retention of devices has always been problematic. The contributions of implants can be made to solve these problems. Implants have reduced the need for adhesive use, simplifying cleaning procedures and thus extending the life of the prostheses. For implant-retained prostheses, retentive matrix is necessary to hold attachments and/or magnets. The retentive matrix is usually fabricated with autopolymerizing acrylic resin or visible light- polymerized resin. The purpose of this study was to compare the adhesion-in-peel force of silicone adhesive to autopolymerizing acrylic resin and polyurethane sheet with two different surface textures : pumice polish only or retention groove, and three surface primers : Dow corning 1205 primer or Dow corning S-2260 primer or FactorII A-304 primer, and two polymerization methods : room temperature or dry heat oven. The t-peel bond strength of specimens was determined as described in ASTM Standard D1876-72. The results were statistically analyzed using the ANOVA test, multiple range test and t-test The results were as follows. 1. The t-peel bond strength of A-304 primer was the highest and statistically higher than that of S-2260(p<0.05). 2. The t-peel bond strength of specimens with retention groove was statistically higher than that of specimens polished with pumice(p<0.05). 3. The t-peel bond strength of specimens polymerized in dry heat oven was statistically higher than that of specimens in room temperature(p<0.01).

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2004.07a
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• pp.78-81
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• 2004

In this paper, the effect of adhesion properties of semiconductive-insulating interface layer of silicone rubber on electrical properties was investigated. Surface structure and adhesion of semiconductive silicon rubber by surface asperity was obtained from SEM and T-peel test. In addition, ac breakdown test was carried out for elucidating the change of electrical property by roughness treatment. From the results, Adhesive strength of semiconductive-insulation interface was increased with surface asperity. Dielectric breakdown strength by surface asperity decreased than initial Specimen, but increased from Sand Paper #1200. According to the adhesional strength data unevenness and void formed on the silicone rubber interface expand the surface area and result in improvement of adhesion. Before treatment Sand Paper #1200, dielectric breakdown strength was decreased by unevenness and void which are causing to have electric field mitigation small. After the treatment, the effect of adhesion increased dielectric breakdown strength. It is found that ac dielectric breakdown strength was increased with improving the adhesion between the semiconductive and insulating interface.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.19 no.2
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• pp.153-157
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• 2006

In this work, the effects of plasma treatment on surface properties of semiconductive silicone rubber were investigated in terms of X-ray photoelectron spectroscopy (XPS) and contact angles, The adhesion characteristics of semiconductive-insulating interface layer of silicone rubber were studied by measuring the T-peel strengths, The results of the chemical analysis showed that C-H bonds were broken due to plasma discharge and Silica-like bonds(SiOx, x=3${\~}$4) increased, It is thought that semiconductive silicone rubber surfaces treated with plasma discharge led to an increase in oxygen-containing functional groups, resulting in improving the degree of adhesion of the semiconductive-insulating interface layer of silicone rubber. However, the oxygen plama for 20 minute produces a damaged oxidized semiconductive silicone rubber layer, which acts as a weak layer producing a decrease in T-peel strength, These results are probably due to the modifications of surface functional groups or polar component of surface free energy of the semiconductive silicone rubber.

• Textile Coloration and Finishing
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• v.17 no.6 s.85
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• pp.36-41
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• 2005

The effects of low temperature plasma treatment on the properties of three types of foams, polyurethane(PU), injection phylon(IP), and phylon(PH) that used for footwear mid-sole were examined. The change of surface properties of foams were characterized by electron scanning microscope, contact angle measurement, and universal testing machine. Adhesion was tested by T-peel tests of plasma treated foams/polyurethane adhesive joints. The contact angle of three types of foams were decreased dramatically with the plasma treatment time, specifically noticeable in the case of phylon(Ph). It has shown the relationship with the contact angle of phylon(PH) and the distance between electrode and samples. The peel strength of foams were increased with the increase of plasma treatment time.

• Journal of Welding and Joining
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• v.31 no.5
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• pp.71-76
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• 2013

The effect of zirconate having - NH functional group on the T-peel and lap shear strength of $CaCO_3$ containing structural epoxy adhesive for car body assembly was investigated. Curing behavior of epoxy adhesive samples were investigated by differential scanning calorimeter (DSC) techniques. The addition of zirconate up to 7.5 phr did not affect the curing mechanism of epoxy adhesive. While the small amount of zirconate addition less than 1.1 phr increased the cross-linking density, the excess addition of zirconate resulted in the increase of uncross-linked impurity. From the increase of T-peel and lap shear strength and the change of fracture mode from the adhesive failure to the mixed one, it was considered that the small addition of zirconate was effective in improving the adhesion strength of epoxy adhesive to the adherend and inorganic filler surfaces. The formation of uncross-linked impurity with the excess addition of zirconate was considered to decrease the joint strength by decreasing the cohesive strength of the cured epoxy.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.18 no.5
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• pp.450-456
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• 2005

In this paper, the effect of adhesion properties of semiconductive-insulating interface layer of silicone rubber on electrical properties was investigated. The modifications produced on the silicone surface by oxygen plasma were accessed using ATR-FTIR, contact angle and Surface Roughness Tester. Adhesion was obtained from T-peel tests of semiconductive layer haying different treatment durations. In addition, ac breakdown test was carried out for elucidating the change of electrical property with duration of plasma treatment. From the results, the treatment in the oxygen plasma produced a noticeable increase in surface energy, which can be mainly ascribed to the creation of O-H and C=O. It is observed that adhesion performance was determined by surface energy and roughness level of silicone surface. It is found that at dielectric strength was increased with improving the adhesion between the semiconductive and insulating interface.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2005.07a
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• pp.232-233
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• 2005

The Surface of semi-conductive silicone rubber was treated by oxygen plasma to improve adhesion and electric performance in joints between insulating and semi-conductive silicone materials. Surface characterizations were assessed using contact angle measurement and Fourier transform infrared spectroscope (FTIR). Adhesion level was understood from T-peel tests between plasma treated semi-conductive and insulating material. Electrical breakdown strength was measured to understand the charge of electrical performance. From the results, the oxygen plasma treatment produces a significant increase in function group of containing oxygen which can be mainly ascribed to the creation of carbonyl groups on the silicone surface from the strength were improved. Therefore it is concluded then plasma treatment leads to decrease voids originating form poor adhesive, and the improve the adhesion in silicone interface. So we could obtain higher electrical design level of silicone material used for electrical apparatus using oxygen plasma treatment.