• 소성∙가공
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• 제11권7호
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• pp.601-607
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• 2002

Optically transparent materials such as fused silica, quartz and crystal have become important in the filed of optics and optoelectronics. Laser ablation continues to grow as an important technique for micromachining and surface modification of various materials, because many problems caused by direct contact between tools and workpiece can be avoided. Especially, laser ablation with excimer lasers enables fine micromachining of transparent materials such as fused silica, quartz and crystal, etc. In this study, laser-induced wet etching of fused silica in organic solution was conducted. KrF excimer laser was used as a light source and acetone solution of pyrene was used as etchant. Changing the number of laser pulses, micro holes of various depths are fabricated.

• 대한기계학회논문집A
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• 제30권8호
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• pp.957-964
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• 2006

As the requirement of LCD products which are large screen and have high brightness increases, the role of light guide panel (LGP) of which micro-features diffuse the light uniformly on surface is getting important. In general, there are many errors in machining like machine tool errors process error, setup error and etc. The amount of setup error in general machining is not so big in comparison with the others, so it is mostly neglected. But, especially in v-groove micromachining, setup error has a significant effect on micro-features. Low quality product and high cost are resulted from setup error. In v-groove micromachining, to confirm the effect of setup error, it is identified and then setup error synthesis model is derived from analysis of tool and workpiece setup. In addition, to predict the micro-features affected by setup error and enhance the production efficiency, the setup condition satisfying the tolerance of micro-features is geometrically analyzed and presented.

• 센서학회지
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• 제9권3호
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• pp.233-241
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• 2000

본 연구에서는 동일한 테스트 구조물을 사용하여 현재 다결정실리콘 표면 미세가공 기술에서 널리 사용되고 있는 여러 가지 점착 방지법들의 성능을 비교하였다. 테스트 구조물로는 다양한 폭과 길이를 갖는 일반적인 cantilever와 dimple, antistiction tip, plate를 가지는 cantilever를 사용하였으며 구조물 형태에 따른 점착 방지 결과를 관찰하였다. 희생층 제거 후 구조물과 기판의 점착을 결정하는 건조과정에서는 증발법과 승화건조법을 사용하였다. 증발법에서는 methanol, IPA, DI water 등을 여러 최종 세척액으로 사용하여 표면장력과 세척 온도에 따른 점착 방지 결과를 비교하였다. 승화건조법에서는 중간 세척액으로 methanol을 사용하였다. 그리고 동일한 실험조건으로 stress gradient가 있는 동일한 구조물을 사용하여 stress gradient에 의한 점착 방지 결과를 관찰하였다. 결론적으로 승화건조법이 여러 가지 증발법보다 우수한 결과를 보여주었고 다결정 실리콘 표면 미세가공 기술로 미세 구조물을 부양시킬 때 승화건조법이 가장 우수한 방법이라고 사료된다.

• 대한전자공학회논문지SD
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• 제41권8호
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• pp.37-44
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• 2004

본 논문에서는 RF 부품 수동소자 중 가장 기본적인 요소가 되는 전송선로를 DAML(Dtelectric-supported Airbridge Microstrip Line) 형태의 새로운 구조로 제안하였으며, DAMS(Micro Electro Mechanical System) 기술 중 표면 마이크로머싱닝(surface micromachining) 기법을 이용하여 구현하였다. 제안된 구조는 마이크로스트립 라인(microstrip line)의 응용 형태로서 기존의 신호선(signal line)과 ground 사이에 유전체 지지대(dielectric post)를 사용하였고, 신호선을 공중으로 띄우면서 넓은 범위의 임피던스에서 유전체 손실(dielectric loss)을 최소화하였다. 본 논문에서 제작된 전송선로는 10 ㎛의 신호선의 높이와 10 ㎛ × 10 ㎛의 지지대(Post) 면적과 9 ㎛의 지지대(post)의 높이와 5 mm의 길이로 제작되었다. 50 GHz에서 일반적인 마이크로스티립(microstrip) 전송선의 손실이 약 7.5 dB/cm 이상 되는 것과 비교하여 본 논문에서 제안한 구조에서는 50 GHz에서 전송선의 손실이 약 1.1 dB/cm가 되는 것을 얻었다.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2004년도 하계학술대회 논문집 C
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• pp.2134-2136
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• 2004

A microcantilever-based biosensor with piezoresistor has been fabricated using surface micromachining technique, which is cost effective and simplifies a fabrication procedure. To evaluate the characteristics of the cantilever, the cystamine terminated with thiol was covalently immobilized on the gold-coated side of the cantilever and glutaraldehyde that would be bonded with amine group in the cystamine was injected subsequently. This process was characterized by measuring the deflection of the cantilever in real time monitoring. Using a piezoresistive read-out and a well-known optical beam deflection method as well carried out the measurement of deflection.

• 대한전기학회논문지:전기물성ㆍ응용부문C
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• 제51권12호
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• pp.597-600
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• 2002

Film Bulk Acoustic wave Resonator (FBAR) using thin piezoelectric films can be made as monolithic integrated devices with compatibility to semiconductor process, leading to small size and low cost, high Q RF circuit elements with wide applications in communications area. This paper presents a MMIC compatible suspended FBAR using surface micromachining. Membrane is composed $Si_3N_4SiO_2Si _3N_4$ multi layer and air gap is about 50${\mu}{\textrm}{m}$. Firstly, We perform one dimensional simulation applying transmission line theorem to verify resonance characteristic of the FBAR. Process of the FBAR is used MEMS technology. Fabricated FBAR resonate at 2.4GHz, $K^2_{eff}$ and Q are 4.1% and 1100.

• 대한기계학회논문집A
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• 제20권5호
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• pp.1363-1371
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• 1996

This paper presents the design, fabrication, and testing of polysilicon electrostatic microactuators that resonate in the direction parallel to the silicon susbstrates. A set of six different designs has been developed using a theoretical model and design formulae developed for the mocroactuators. Microactuator prototypes are fabricated from a 2.1 $\mu{m}$-thick LPCVD polysilicon film, using a 4-mask surface-micromachining process. The prototypes are tested under a d.c. bias voltage of 45V with an a.c. drive voltage amplitude of 20 v.Measured resorant frequencies are in the ranges of 40-60 kHz, showing a good agreement to their theoretical estimates within error bounds of .$\pm$.5%. Important issues inthe design and microfabrication of the microactuators are discussed, together with potential applicaitons of the key technology involved.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2003년도 춘계학술대회 논문집
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• pp.1215-1219
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• 2003

Light Guide Panel(LGP) is a key part of backlight unit(BLU) which transforms line-light of lamp to surface-light. Dot pattern is formed on the injected LGP surface by screen printing. This dot pattern is composed of several ten thousands micro dots of diameter 150-180$\mu\textrm{m}$ or so. The dot patterning by screen printing causes low productivity and low performance of TFT-LCD. This research develops the micromachining technology for LGP mould which could form micro dot pattern by injection molding, removing the existing screen printing process.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2006년도 심포지엄 논문집 정보 및 제어부문
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• pp.327-329
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• 2006

In this paper, the cutting qualities by laser dicing and fracture strength of a silicon die is investigated. Laser micromachining is the non-contact process using thermal ablation and evaporation mechanisms. By these mechanisms, debris is generated and stick on the surface of wafer, which is the problem to apply laser dicing to semiconductor manufacture process. Unlike mechanical sawing using diamond blade, chipping on the surface and crack on the back side of wafer isn't made by laser dicing. Die strength by laser dicing is measured via the three-point bend test and is compared with the die strength by mechanical sawing. As a results, die strength by laser dicing shows a decrease of 50% in compared with die strength by mechanical sawing.

• KIEE International Transactions on Electrophysics and Applications
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• 제5C권6호
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• pp.270-275
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• 2005

In order for the application of the in-vivo endoscopic biopsy, a micromirror which can be driven at a low voltage is required. In this paper, a two-step micromirror composed of bottom electrodes, moving plate and top mirror plate is proposed. Because an electrical wiring of two plates are separated, they can be actuated separately. Therefore, an intermediate moving plate plays an important role in reducing the driving voltage in half. The designed device was fabricated by the surface micromachining. Maximum rotation angle of $6.3^{\circ}$ was obtained by applying DC 48V, while a conventional one-step mirror pulled down at DC 120V. The designed structure can be used in microphotonic applications requiring low driving voltage.