• Journal of the Microelectronics and Packaging Society
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• v.26 no.3
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• pp.1-6
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• 2019

Wettability is an important factor to decide solderability of solder, flux, other soldering-related materials and soldering conditions. The wettability also affects the reliability of solder joint. Wetting balance test is a good method for quantitatively measuring wettability between solder and substrate. The wetting balance test is easy to reproduce the wetting experiment and to measure the wetting time and force. And this test provides wetting curve to calculate the surface tension of the molten solder. Development of new solder has been continued in accordance with various and harsh environment in the electronics industry. In this paper, the principle of wetting balance test and recent research issues including nano-composite solder are explained.

• Journal of Welding and Joining
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• v.16 no.6
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• pp.77-85
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• 1998

Effects of non-cleaning and cleaning fluxes on the wetting properties and defects at flow soldered joints were investigated. Non-cleaning flux (R-type of 3.3% solid content) and cleaning flux (RMA-type of 15% solid content) were used. Wetting test was accomplished by wetting balance method with changing surface state of wetting specimen, CU. Sn-37%Pb solder was used for wetting test and flow soldering. As experimental results, the wetting time for vertical force from the surface tension being zero was mainly affected by surface state of the wetting specimen. Non-cleaning flux had a good wettability compared with cleaning flux. In case of non-cleaning flux, conveyor speed had a great affection to defects of bridge, icicle, and poor solder.

• Journal of the Microelectronics and Packaging Society
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• v.24 no.2
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• pp.1-9
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• 2017

Recently, there has been a continuous researches on solders having sophisticated and improved performance due to demand for high-density and miniaturization of electronics, and development of solder for automotive electronics which can be used in harsh environment. When developing a new solder alloy, there is a wettability of solder on substrate for things to consider, and the wetting balance test is one of the methods for measuring that one. In this paper, the wetting balance test is introduced, and the calculus of the surface tension of solder and the contact angle between solder and substrate using wetting curve obtained is introduced too. In detail, the principle and test method of the wetting balance test, the introduction of the parameters with important meaning in the wetting curve, the method of calculating the contact angle as well as the surface tension of the solder using the shape of the solder meniscus.

• Journal of the Microelectronics and Packaging Society
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• v.7 no.2
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• pp.47-53
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• 2000

The fluxless wetting properties of TSM-coated glass substrate were evaluated by the wetting balance method. We could estimate the wettability of the TSM with new parameters obtained from the wetting balance test for one side-coated specimen. It was more effective in wetting to use Cu as a wetting layer and Au as a protection layer than to use Au itself as a wetting layer. The SnSb solder showed better wettability than SnAg, SnBi, and SnIn solders. The contact angle of the one side-coated glass substrate to the Pb-free solders could be calculated from the farce balance equation by measuring the static force and the tilt angle.

• Journal of the Korean Ceramic Society
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• v.19 no.1
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• pp.24-34
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• 1982

The effect of the several variables on wetting of AISIB1113 steel by molten glass was studied by Sessible-drop method. Experimental variables were temperature, firing atmospheres, Fe2O3 addition to the sealing glass and steel surface conditions. The degree of wetting in terms of contact angles between molten glass and metal tested at different test conditions was analyzed by using Young's equation. The results showed that contact angles in H2 atmosphere in the glass metal systems were high but in N2 atmosphere, were small for studied glass metal systems. Especially, when the glass drop was in contact with oxidized steel in N2 atmosphere, The best adherence with contact angle of approximately 9°was obtained. In the case of Fe2O3 addition in glass contact angles subtantially increased due to the increase of surface tension of glass. Wetting phenomena were also discussed under the basis of these experimental results.

• Journal of the Korean institute of surface engineering
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• v.35 no.2
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• pp.129-137
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• 2002

The purpose of solderability assessment is to predict the effectiveness of soldering process. It is important for companies pursuing zero defects manufacturing because poor solderability is the major cause of two third of soldering failures. The most versatile solderability method is wetting balance method. However, there exist so many indices for wettability in the wetting balance test e.g. time to reach 2/3 values of maximum wetting force, tine to reach zero wetting force, maximum withdrawal force. In this study, three solderability assessment methods, which were the maximum withdrawal force, the wetting balance and the dynamic contact angle (DCA), were evaluated by comparing each other. The wetting balance technique measures the solderability by recording the forces exerted from the specimen after being dipped into the molten solder. Then the force at equilibrium state can be used to calculate a contact angle, which is known as static contact angles. The DCA measures contact angles occurred during advancing and withdrawing of the specimen and the contact angles are known as dynamic contact angles. The maximum withdrawal force uses the maximum force during withdrawal movement and then a contact angle can be calculated. In this study, the maximum withdrawal force method was found to be an objective index for measuring the solderability and the experiment results indicated good agreement between the maximum withdrawal force and the wetting balance method.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2011.05a
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• pp.184-185
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• 2011

In this study, in order to obtain a high reflectivity for the LED lead frame, tin dip coating and tin plating were conducted respectively, and wettability of LED lead frame with tin solder also was tested by wetting balance tester. A Cu sheet was plated in Cu brighten electroplating bath and followed by immersion in a Sn electro-less plating bath [1]. On the other hand, in the dip coating process, a Cu sheet was dipped into molten tin. In the progress of wetting test, besides wetting balance curve, the maximum measured force($F_m$), the maximum withdrawal force($F_w$) and zero-cross time($t_0$) were obtained in various temperatures. With the maximum withdrawal force, the surface tension was calculated at different temperatures. The Cu sheet plated with bright Cu and Sn show a silver bright property while that of Cu dipped with Sn possessed a high reflectance density of 1.34GAM at $270^{\circ}C$.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.18 no.7
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• pp.483-489
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• 2017

The purpose of this study was to propose useful suggestions for enhancing reliability to determine the resistance against surface wetting, KS K 0590, by an imaging process. We validated the standard spray test rating chart for determining quantification standard using JAVA script-based imaging process program. All of the acquired images were processed with the image software, Image J (NIH, Nethesda, MD, USA). The study results are as follows. We established the surface area measurement-based quantitative criteria for determining resistance to surface wetting. The standard spray test rating chart was converted into a numerical standard which leads easy-to-determine ratings. We also validated the procedure for imaging treatment by analyzing quantitative data. We introduced the fluorescence image for determining ratings by enabling threshold settings and binary image conversion as an optimal imaging process. It is expected that imaging-based determination for resistant to surface wetting will serve as an accurate and reliable method for KS K 0590.

• Journal of the Society of Disaster Information
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• v.18 no.3
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• pp.581-588
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• 2022

Purpose: This study is about offering ways of improving existing technical standards in order to propose how to deal with coal deep-seated fire and to increase effectiveness of wetting agent. Method: This study conducts infiltration experiment using eight tons of coal, three types of wetting agents and fire water. And this study analyzes domestic and international technical standards, overseas experimental cases. Result: It is found that two findings are identified; one is fire water cannot infiltrate into the coal due to high level of surface tension, and the other is three types of wetting agent can infiltrate into the coal to the depth of 5~25cm. Also, domestic wetting agent technical standards include measuring surface tension only and testing wood on extinguishing capacity test. On the other hand, this study found that deep-seated fire experiment using cotton, B-class fire test using heptane are used from abroad. Besides it is analyze that capillary rise test, sink test, contact angle measurement are conducted to increase effectiveness of wetting agent at the U.S. Bureau of Mines. Conclusion: Based on standards and cases of U.S. NFPA and Bureau of Mines, this study suggests that domestic technical standards should include adding a new test standard which measures infiltration directly.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.26 no.3
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• pp.448-457
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• 2002

Heat treatment such as quenching of a high-temperature cylinder is being used on steel to produce high strength levels. Especially, the mist cooling with the high and uniform surface heat flux rate s expected to contribute for better products. The experimental mist cooling curve is produced for better understanding, and two distinct heat transfer regions are recognized from the cooling curve produced. It is shown that the liquid film evaporation dominated region follows the film boiling-dominated region as decreasing the temperature of test cylinder by mist flow. Based on the intuitive view from some previous investigations, a simplified model with some assumptions is introduced to explain the mist cooling curve, and it is shown that the estimation agrees well with our experimental data. In the meanwhile, it is known that the wetting temperature, at which surface heat flux rate is a maximum, increases with mass flow rate ratio of water to air ($\varkappa$ < 10). However, based on our experimental data, it is explained that there exists a critical mass flow rate ratio, at which the wetting temperature is maximum, in the range of 3 < $\varkappa$ < 130. Also, it is described that despite of the same value of $\varkappa$, the wetting temperature may increase with mist velocity.