• 마이크로전자및패키징학회지
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• 제26권3호
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• pp.1-6
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• 2019

Wettability is an important factor to decide solderability of solder, flux, other soldering-related materials and soldering conditions. The wettability also affects the reliability of solder joint. Wetting balance test is a good method for quantitatively measuring wettability between solder and substrate. The wetting balance test is easy to reproduce the wetting experiment and to measure the wetting time and force. And this test provides wetting curve to calculate the surface tension of the molten solder. Development of new solder has been continued in accordance with various and harsh environment in the electronics industry. In this paper, the principle of wetting balance test and recent research issues including nano-composite solder are explained.

• Journal of Welding and Joining
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• 제16권6호
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• pp.77-85
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• 1998

Effects of non-cleaning and cleaning fluxes on the wetting properties and defects at flow soldered joints were investigated. Non-cleaning flux (R-type of 3.3% solid content) and cleaning flux (RMA-type of 15% solid content) were used. Wetting test was accomplished by wetting balance method with changing surface state of wetting specimen, CU. Sn-37%Pb solder was used for wetting test and flow soldering. As experimental results, the wetting time for vertical force from the surface tension being zero was mainly affected by surface state of the wetting specimen. Non-cleaning flux had a good wettability compared with cleaning flux. In case of non-cleaning flux, conveyor speed had a great affection to defects of bridge, icicle, and poor solder.

• 마이크로전자및패키징학회지
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• 제24권2호
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• pp.1-9
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• 2017

Recently, there has been a continuous researches on solders having sophisticated and improved performance due to demand for high-density and miniaturization of electronics, and development of solder for automotive electronics which can be used in harsh environment. When developing a new solder alloy, there is a wettability of solder on substrate for things to consider, and the wetting balance test is one of the methods for measuring that one. In this paper, the wetting balance test is introduced, and the calculus of the surface tension of solder and the contact angle between solder and substrate using wetting curve obtained is introduced too. In detail, the principle and test method of the wetting balance test, the introduction of the parameters with important meaning in the wetting curve, the method of calculating the contact angle as well as the surface tension of the solder using the shape of the solder meniscus.

• 마이크로전자및패키징학회지
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• 제7권2호
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• pp.47-53
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• 2000

TSM(Top Surface Metallurgy)이 증착된 유리기판의 Pb-free 솔더에 대한 젖음성을 무플럭스하에서 wetting balance법으로 평가하였다. TSM 층의 젖음성을 단면 증착시편의 wetting balance법으로부터 도출된 새로운 젖음성 지수들로 평가할 수 있었다. 유리기판의 TSM층으로는, Cu를 젖음층으로 하고 Au를 Cu의 산화 방지 층으로 사용하는 경우가 Au 자체를 젖음층으로 사용하는 경우보다 우수하였다. SnSb 솔더는 SnAg, SnBi, SnIn 솔더보다 TSM층에 대한 젖음특성이 우수하였다. 유리기판에 단면 증착된 TSM과 Pb-free솔더의 접촉각을 $F_{s}$와 기울어짐각을 측정하고, 메니스커스의 정적 상태에서 힘의 평형으로부터 유도된 식을 이용하여 계산할 수 있었다.

• 한국세라믹학회지
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• 제19권1호
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• pp.24-34
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• 1982

The effect of the several variables on wetting of AISIB1113 steel by molten glass was studied by Sessible-drop method. Experimental variables were temperature, firing atmospheres, Fe2O3 addition to the sealing glass and steel surface conditions. The degree of wetting in terms of contact angles between molten glass and metal tested at different test conditions was analyzed by using Young's equation. The results showed that contact angles in H2 atmosphere in the glass metal systems were high but in N2 atmosphere, were small for studied glass metal systems. Especially, when the glass drop was in contact with oxidized steel in N2 atmosphere, The best adherence with contact angle of approximately 9°was obtained. In the case of Fe2O3 addition in glass contact angles subtantially increased due to the increase of surface tension of glass. Wetting phenomena were also discussed under the basis of these experimental results.

• 한국표면공학회지
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• 제35권2호
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• pp.129-137
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• 2002

The purpose of solderability assessment is to predict the effectiveness of soldering process. It is important for companies pursuing zero defects manufacturing because poor solderability is the major cause of two third of soldering failures. The most versatile solderability method is wetting balance method. However, there exist so many indices for wettability in the wetting balance test e.g. time to reach 2/3 values of maximum wetting force, tine to reach zero wetting force, maximum withdrawal force. In this study, three solderability assessment methods, which were the maximum withdrawal force, the wetting balance and the dynamic contact angle (DCA), were evaluated by comparing each other. The wetting balance technique measures the solderability by recording the forces exerted from the specimen after being dipped into the molten solder. Then the force at equilibrium state can be used to calculate a contact angle, which is known as static contact angles. The DCA measures contact angles occurred during advancing and withdrawing of the specimen and the contact angles are known as dynamic contact angles. The maximum withdrawal force uses the maximum force during withdrawal movement and then a contact angle can be calculated. In this study, the maximum withdrawal force method was found to be an objective index for measuring the solderability and the experiment results indicated good agreement between the maximum withdrawal force and the wetting balance method.

• 한국표면공학회:학술대회논문집
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• 한국표면공학회 2011년도 춘계학술대회 및 Fine pattern PCB 표면 처리 기술 워크샵
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• pp.184-185
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• 2011

In this study, in order to obtain a high reflectivity for the LED lead frame, tin dip coating and tin plating were conducted respectively, and wettability of LED lead frame with tin solder also was tested by wetting balance tester. A Cu sheet was plated in Cu brighten electroplating bath and followed by immersion in a Sn electro-less plating bath [1]. On the other hand, in the dip coating process, a Cu sheet was dipped into molten tin. In the progress of wetting test, besides wetting balance curve, the maximum measured force($F_m$), the maximum withdrawal force($F_w$) and zero-cross time($t_0$) were obtained in various temperatures. With the maximum withdrawal force, the surface tension was calculated at different temperatures. The Cu sheet plated with bright Cu and Sn show a silver bright property while that of Cu dipped with Sn possessed a high reflectance density of 1.34GAM at $270^{\circ}C$.

• 한국산학기술학회논문지
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• 제18권7호
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• pp.483-489
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• 2017

본 연구의 목적은 직물의 발수도 판정 (KS K 0590) 시 이미징 기반의 판별을 통해서 측정 신뢰도를 향상하는 것으로 한다. 이를 수행하기 위하여 가장 먼저 우리는 Java 기반의 이미지 처리 프로그램을 통해서 발수도 판정 표준표를 정량화하였다. 이때 모든 이미지의 처리과정은 미 국립보건원(NIH)에서 개발한 오픈 소프트웨어인 Image J를 사용하였다. 발수도 판정 표준표(standard spray test rating)에 대한 이미지 처리과정은 면적 측정 기법을 통해서 수행하였으며, 이를 통해서 정량화한 결과, 습윤 면적비 수치를 기반으로 하는 손쉬운 판정기준을 확보 할 수 있었다. 또한 실제 직물에 있어서 이미징 기반의 발수도 판정을 도입하기 위한 최적화 처리기법을 도출하기 위하여 형광물질을 사용하였다. 형광 이미지를 도입하여 문턱값 (Threshold) 조절과 2치이미지 (Binary Image) 변환 등의 과정을 통해서 발수도 판정을 위한 데이터 처리과정을 진행하였다. 본 연구의 결과물은 향후 직물의 발수도 판정 (KS K 0590)에 있어서 기존의 정성적인 분석법에서 탈피하여 정량적인 측정 신뢰도 향상을 위한 방안으로 적용할 수 있으리라 판단된다.

• 한국재난정보학회 논문집
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• 제18권3호
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• pp.581-588
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• 2022

연구목적: 본 연구에서는 석탄 심부 화재 발생 시 대응과 침윤소화약제의 실효성 확대를 위한 기술기준 개선방안을 제시하고자 하였다. 연구방법: 석탄 8톤과 침윤소화약제 3종, 소화용수를 활용하여 침투 실험을 수행하고, 국내·외 기술기준 및 해외 사례를 분석하였다. 연구결과: 소화용수는 높은 표면장력으로 인해 석탄 심부로 침투하지 못하였고, 침윤소화약제는 5~25cm 깊이까지 침투되었다. 국내 기술기준은 침투성에 대한 간접 측정 방식인 표면장력만 언급되어있고, 소화능력시험도 목재를 활용하는 것으로 확인되었다. 반면 해외에서는 면직물을 활용한 심부 화재 실험, 헵탄을 이용한 B급 화재 실험이 있는 것을 확인하였다. 그 외, 미 광산국에서는 모세관 상승 시험, 침전시험, 접촉각 측정이 있는 것으로 분석되었다. 결론: 미국 NFPA 및 광산국의 기준과 사례를 토대로 국내 기술기준도 침투성을 직접적으로 측정할 수 있는 기준을 추가하여 실효성을 확대할 필요가 있을 것으로 사료된다.

• 대한기계학회논문집B
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• 제26권3호
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• pp.448-457
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• 2002

Heat treatment such as quenching of a high-temperature cylinder is being used on steel to produce high strength levels. Especially, the mist cooling with the high and uniform surface heat flux rate s expected to contribute for better products. The experimental mist cooling curve is produced for better understanding, and two distinct heat transfer regions are recognized from the cooling curve produced. It is shown that the liquid film evaporation dominated region follows the film boiling-dominated region as decreasing the temperature of test cylinder by mist flow. Based on the intuitive view from some previous investigations, a simplified model with some assumptions is introduced to explain the mist cooling curve, and it is shown that the estimation agrees well with our experimental data. In the meanwhile, it is known that the wetting temperature, at which surface heat flux rate is a maximum, increases with mass flow rate ratio of water to air ($\varkappa$ < 10). However, based on our experimental data, it is explained that there exists a critical mass flow rate ratio, at which the wetting temperature is maximum, in the range of 3 < $\varkappa$ < 130. Also, it is described that despite of the same value of $\varkappa$, the wetting temperature may increase with mist velocity.