• Journal of the Korean Society for Heat Treatment
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• v.34 no.6
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• pp.272-280
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• 2021

The influence of acetylene flow rates on the carburizing behavior of an AISI 4115 steel in 1 ton-class mass production-type vacuum carburizing furnace has been studied through microstructure, carbon concentration, hardness analyses. The AISI 4115 steels were carburized with various flow rates (20, 32.7, 60 l/min) and locations in the furnace (top, center, bottom) at 950℃. The acetylene flow rate played an important role in controlling the carburizing properties of carburized samples, such as effective case depth and uniformity carburizing according to location in the furnace. At an acetylene flow rate of 20 l/min, the carburized samples had a shallow average hardened layer (0.645 mm) compared to the target hardening depth (1 mm) due to low carbon flux and spatial uniformity of carburization (17.8%) in the furnace. At a flow rate of 60 l/min, the carburized samples showed an average hardened layer (1.449 mm) deeper than the target hardening depth and had the spatial uniformity of carburization (98.8%). In particular, at a flow rate of 32.7 l/min, the carburized samples had an average hardened layer (1.13 mm) close to the target hardening depth and had the highest carburizing uniformity (99.1%). As a result, an appropriate flow rate of 32.7 l/min was derived to satisfy the target hardening depth and to have spatial uniform hardened layer in the furnace.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.15 no.2
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• pp.118-124
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• 2016

In this study, experiments are conducted to improve spray coating uniformity by using second and third electrodes based on the electrospray atomization mechanism. The uniformity of fabricated thin films can be improved by adjusting the design of the second electrode. The implementation of the second electrode with an elongated hole and a bending angle of $90^{\circ}$ results in highly uniform films. In addition, induced area to substrate is increased by lowering the applied voltage using the third electrode with a round rod shape. A linear correlation between applied voltage and induced area is confirmed. Thin film thickness and surface roughness are measured after the fabrication of thin films through the electrospray process. It is confirmed that a thin film is formed having an average thickness of 273.44 nm, a thickness uniformity of less than 10%, and a surface roughness of 3 nm.

• Journal of Electrical Engineering and Technology
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• v.3 no.2
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• pp.271-275
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• 2008

The MAM(Megasonic Agitated Module) has been fabricated for improving the characteristics of wet etching. The characteristics of the MAM are investigated during the wet etching with and without megasonic agitation in this paper. The adoption of the MAM has improved the characteristics of wet etching, such as the etch rate, etch uniformity, and surface roughness. Especially, the etching uniformity on the entire wafer was less than ${\pm}1%$ in both cases of Si and glass. Generally, the initial root-mean-square roughness($R_{rms}$) of the single crystal silicon was 0.23nm. Roughnesses of 566nm and 66nm have been achieved with magnetic stirring and ultrasonic agitation, respectively, by some researchers. In this paper, the roughness of the etched Si surface is less than 60 nm. Wet etching of silicon with megasonic agitation can maintain nearly the original surface roughness during etching. The results verified that megasonic agitation is an effective way to improve etching characteristics of the etch rate, etch uniformity, and surface roughness and that the developed micromachining system is suitable for the fabrication of devices with complex structures.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2004.10a
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• pp.1353-1356
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• 2004

In recent year, OLED(organic light emitted display) is used as the next generation device of FPD. OLED have been replacing the flat panel display device such as LCD, STN-LCD and TFT because this device is more efficient, economic and simple than those FPD devices, and this need not backlight system for visualization. The performance and efficiency of OLED is related with surface defect of ITO coated glass substrate. The typical surface defect of glass substrate is nonuniformity and bad surface roughness. ITO coated glass substrate is destroied for inspection about surface roughness and non-uniformity. Generally detection of the defects in the surface for ITO coated glass substrate is dependent on operator's experience. In this research, relationship between working parameter and surface non-uniformity is studied using regression analysis.

• Agribusiness and Information Management
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• v.6 no.1
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• pp.37-44
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• 2014

This study was conducted to evaluate light intensity and uniformity of two SMD (surface-mount device) type LEDs for protected crop production. A low-power (0.1 W) and a high-power (1 W) LEDs were selected and the intensity and uniformity was evaluated at different vertical (height) and horizontal (distance) intervals. When the horizontal interval of the LED bar was fixed, the light intensity increased and the uniformity decreased as the height decreased. At the 30~40 cm heights, 20~30% of the area showed $200{\pm}20{\mu}molm^{-2}s^{-1}$. As the horizontal distance of the LED bars increased, while the uniformity increased as well, the light intensity decreased. At the distances of 6~10 cm, 17~23% of the area showed $200{\pm}20{\mu}molm^{-2}s^{-1}$. When the LED bars were added to the sides, the light intensity and uniformity were generally improved. Results showed that the light intensity and uniformity depended on the height and interval of the LED bulbs; therefore, optimum arrangement for the crops interested should be determined through experiments.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2009.05a
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• pp.232-232
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• 2009

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.06a
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• pp.58-58
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• 2009

Uniformity related issues in chemical mechanical polishing (CMP) are within wafer non-uniformity (WIWNU), wafer to wafer non-uniformity (WTWNU), planarity and dishing/erosion. Here, the WIWNU that originates from spatial distribution of independent variables such as temperature, sliding distance, down force and material removal rate (MRR) during CMP, relies to spatial dependency. Among various sources of spatial irregularity, hardness and modulus of pad and surface roughness in sources for pad uniformity are great, especially. So, we investigated the spatial variation of pad surface characteristics using pad measuring system (PMS) and roughness measuring system. Reduced peak height ($R_{pk}$) of roughness parameter shows a strong correlation with the removal rate, and the distribution of relative sliding distance onwafer during polishing has an effect on the variation of $R_{pk}$ and WIWNU. Also, the results of pad wear profile thorough developed pad profiler well coincides with the kinematical simulation of conditioning, and it can contribute for the enhancement of WIWNU in CMP process.

• Restorative Dentistry and Endodontics
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• v.20 no.1
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• pp.303-315
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• 1995

An adequate and homogeneous cure of light-activated restroative material is very important for improvement of marginal adaptation and prevention of marginal leakage, secondary caries and pulpal irritation as well as expressing natural physical property of that material. The purpose of this study was to evaluate the change of surface hardness and cure uniformity of light-activated glass ionomer cements. Restorative(Fuji II LC, Vitremer) and lining(Baseline VLC, Vitrebond) light-activated glass ionomer cements were investigated for this study. The surface hardness of the top and bottom surfaces and cure uniformity of each 1mm, 1.5mm, 2mm, 2.5mm & 3mm in the thickness of specimen were measured immediately, at 1 hour, 24 hours and 1 week after light activation. The surface hardness change and cure uniformity of all the specimens were measured by Knoop hardness tester. The results were as follows. 1. The surface hardness of top and bottom surfaces in all groups increased with time(p<0.01). 2. Both top and bottom surfaces hardness of Vitrebond group measured immediately after light-activation were significantly lower than those of the other groups(p<0.01). 3. The surface hardness of top and bottom surfaces of restorative light -activated glass ionomer cements was higher than those of lining materials at 1 week(p<0.10). 4. Surface hardness of Vitremer group decreased as the specimen thickness increased, except top and bottom surfaces hardness of the specimen at 1 week(p<0.01). There was no significant difference in the surface hardness of Fuji II LC with changes in the thickness except bottom surface hardness of specimen at 24 hours and 1 week (p>0.05). 5. Surface hardness of Vitrebond group significantly decreased as the specimen thickness increased(p<0.01). There was no significant difference in the surface hardness of Baseline VLC group with changes in the thickness except bottom surface hardness of specimen measured immediately after light -activation(p>0.05). 6. The hardness ratio of top against bottom surface in all groups decreased with time(p<0.05). 7. There was no significant difference in the hardness ratio of top against bottom surface with changes of the thickness except Vitrebond group, 24 hours and 1 week of Vitremer group and 1 week of Baseline VLC group (p>0.05). These results suggest that surface hardness of restorative ligh-activated glass ionomer cements were highter than those of lining light-activated materials. In all groups, the surface hardness and cure uniformity continuously increased with time.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.14 no.6
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• pp.236-243
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• 2004

The oxide etching process was characterized in a magnetically enhanced reactive ion etching (MERIE) reactor with a $CHF_3CF_4$ gas chemistry. A statistical experimental design plus one center point was used to characterize relationships between process factors and etch response. The etch response modeled are etch rate, etch selectivity to TiN and uniformity. Etching uniformity was improved with increasing $CF_4$ flow ratio, increasing source power, and increasing pressure depending on source power. Characterization of via etching in $CHF_3CF_4$ MERIE using neural networks was successfully executed giving to highly valuable information about etching mechanism and optimum etching condition. It was found that etching uniformity was closely related to surface polymerization, DC bias, TiN and uniformity.

• Journal of the Korean Society for Precision Engineering
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• v.22 no.4
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• pp.44-51
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• 2005

In this paper, a new polishing head with the variable pressure structure was studied to improve the planarization uniformity of the conventional template-metal head. Metal surface waviness and slurry distribution on the pad have been known to affect the polishing uniformity even in the synchronized quill and platen velocities. A polishing head with silicon rubber sheet was used to get a curved pressure distribution. In the experiment, the vertical deflection behavior on the pad was characterized with back pressure in the air chamber. Quill force increased linearly with backpressure. However, backpressure under a quill force made the upward movements of the quill. In the wafer polishing experiments, polishing rate and polishing thickness distribution were severely changed with backpressure. The best uniformity was observed with the standard deviation off.5％ level of average polishing removal 215nm at backpressure 12.1kPa.