• 마이크로전자및패키징학회지
• /
• 제8권2호
• /
• pp.43-48
• /
• 2001

Economical consumption of energy, longer life of lamps, higher lighting comfort and new aesthetic of illumination is subject of numerous research and development works. The halogen lamps are an example of positive solution some of above mentioned problems. The electronic transformers are more frequent used for their supply. In comparison with conventional transformers they have less weight, less volume and 60% less power losses. Their advantages are particular visible, when the hybrid technique is applied. The paper presents the results of engineering research and development works carried out in Private Institute of Electronic Engineering, in R. & D. Center for Hybrid Microelectronics and Resistors and in Technical School of Communications in Krakow, in the field of the design and exploitation tests of hybrid converters 220V AC /12V DC (electronic transformers) and electronic ballasts destined for the supply of halogen lamps 20W to 150W and fluorescent lamps respectively. To perform the converters, thick film technology and surface mount technology were used. For the protection of converter electronic circuit the thick film temperature sensor and transistors were applied. Moreover the paper presents the base application circuits of elaborated converters, their technical parameters and exploitation results. The development perspectives of such domain of hybrid circuits are also discussed.

• 한국응용과학기술학회지
• /
• 제25권4호
• /
• pp.485-494
• /
• 2008

The acrylic coating emulsions were prepared by the emulsion polymerization to protect the surface of steel plate from the corrosion chemicals like acid, base and salt water. MMA(methyl methacrylate), styrene, BA(butyl acrylate), and 2-HEMA(2-hydroxyethyl methacrylate) were used as monomer. KPS(potassium persulfate) and SBS(sodium bisulfite) as redox initiator and SDBS(sodium dodecylbenzene sulfonate) as emulsifier were used on the emulsion polymerization reaction. The most stable in-situ coating was obtained when 10% of MMA was added. Both particle size and quantity in emulsion were decreased as increasing the mount of SDBS. the most stable prepared coating emulsion with polyisocyanate crosslinker showed very high anticorrosion properties on the coated steel layer to salt water, whereas no significant improvement of anticorrosion property to acdic and basic condition it showed.

• 한국마이크로전자및패키징학회:학술대회논문집
• /
• 한국마이크로전자및패키징학회 2001년도 Proceedings of 6th International Joint Symposium on Microeletronics and Packaging
• /
• pp.57-65
• /
• 2001

Economical consumption of energy, longer life of lamps, higher lighting comfort and new aesthetic of illumination is subject of numerous research and development works. The halogen lamps are an example of positive solution some of above mentioned problems. The electronic transformers are more frequent used for their supply. In comparison with conventional transformers they have less weight, less volume and 60% less power tosses. Their advantages are particular visible, when the hybrid technique is applied. The paper presents the results of engineering research and development works carried out ill Private Institute of Electronic Engineering, in R. & D. Center for Hybrid Microelectronics and Resistors and in Technical School of Communications in Krakow, in the field of the design and exploitation tests of hybrid converters 220V AC /12V DC (electronic transformers) and electronic ballasts destined for the supply of halogen lamps 20W to 150W and fluorescent lamps respectively. To perform the converters, thick film technology and surface mount technology were used. For the protection of converter electronic circuit the thick film temperature sensor and transistors were applied. Moreover the paper presents the base application circuits of elaborated converters, their technical parameters and exploitation results. The development perspectives of hybrid domain of hybrid circuits are also discussed.

• 한국컴퓨터정보학회논문지
• /
• 제27권11호
• /
• pp.115-121
• /
• 2022

표면실장기술(SMT)에서 솔더 크림을 바르는 장비인 스크린 프린터는 패드가 작아지면서 도포 불량이 많이 발생한다. 이를 해결하기 위해 최근에는 젯 프린터를 사용하고 있다. 그런데 젯 프린터 헤드에 적용하는 밸브의 끝단 노즐을 깨끗하게 청소하지 않으면 과납이나 오도포가 발생한다. 이를 방지하기 위해서는 노즐을 주기적으로 청소해줘야 한다. 본 논문에서는 젯 프린터의 안정적인 솔더 크림 도포를 위하여 기존 기술보다 더욱 안정적으로 청소하는 방법을 제시하였다. 이 방법은 35mm 폭의 무진천을 재단하여 롤 형태로 감아 놓고, 반대쪽에 DC 기어드 모터로 회전시켜 닦는다. 그 결과 약 2,000회 도팅 주기로 청소를 했을 때 노즐 표면에 솔더 페이스트가 남지 않고 잘 닦이는 것을 확인하였다.

• 한국산학기술학회논문지
• /
• 제16권12호
• /
• pp.8306-8313
• /
• 2015

개방형 전류측정기는 DC 모터 콘트롤러, AC 가변 콘트롤러, UPS(Uninterruptible Power System)에 주로 사용되며 최근 신재생 에너지의 성장과 전력망의 스마트 그리드화로 인하여 활용성이 점차 확대되고 있다. 이러한 신재생 에너지의 성장으로 관련 핵심기술의 보유여부가 중요해지고 있으며 대부분 수입에 의존하고 있는 개방형 전류측정기의 국산화 및 관련 기술의 확보를 필요로 한다. 본 논문에서는 일반 산업용 개방형 전류측정기의 제작과정과 특성을 측정한 결과를 기술하였다. 개방형 전류측정기를 구성하는 C형 철심의 공극자장분포 해석 및 형상 설계, 홀센서의 선정 및 특성시험, 정전류 전원공급회로와 신호처리회로의 회로설계 과정을 기술하며 DIP(Dual In-line Package) type과 SMD (Surface Mount Device) type의 100A급 개방형 전류측정기를 제작하고 특성을 측정했다. 제작된 전류측정기로 0~100A 범위에서 통전 실험을 실시한 했고 직류전류와 60Hz의 교류전류에서 특성을 측정한 결과 정밀도 오차 2% 이내, 선형도 오차 2% 이내의 성능을 만족하였다. 또한 부 특성 온도계수를 갖는 NTC(Negative Temperature Coefficient) 서미스터를 이용한 온도보상회로를 사용하여 $-35{\sim}100^{\circ}C$의 범위에서 온도보상 효과를 확인하였다.

• 한국전기전자재료학회논문지
• /
• 제23권6호
• /
• pp.481-486
• /
• 2010

ENIG (electroless Ni immersion gold) is one of surface finishing which has been most widely used in fine pitch SMT (surface mount technology) and BGA (ball grid array) packaging process. The reliability for package bondability is mainly affected by interfacial reaction between solder and surface finishing. Since the behavior of IMC (intermetallic compound), or the interfacial reaction between Ni and solder, affects to some product reliabilities such as solderability and bondability, understanding behavior of IMC should be important issue. Thus, we studied the properties of ENIG with P contents (9 wt% and 13 wt%), where the P contents is one of main factors in formation of IMC layer. The effect of P content was discussed using the results obtained from FE-SEM(field-emission scanning electron microscope), EPMA(electron probe micro analyzer), EDS(energy dispersive spectroscopy) and Dual-FIB(focused ion beam). Especially, we observed needle type irregular IMC layer with decreasing Ni contents under high P contents (13 wt%). Also, we found how IMC layer affects to bondability with forming continuous Kirkendall voids and thick P-rich layer.

• 한국표면공학회:학술대회논문집
• /
• 한국표면공학회 2017년도 춘계학술대회 논문집
• /
• pp.159-159
• /
• 2017

Ti-6Al-4V alloy have been used for dental implant because of its excellent biocompatibility, corrosion resistance, and mechanical properties. However, the integration of such implant in bone was not in good condition to achieve improved osseointergraiton. For solving this problem, calcium phosphate (CaP) has been applied as coating materials on Ti alloy implants for hard tissue applications because its chemical similarity to the inorganic component of human bone, capability of conducting bone formation and strong affinity to the surrounding bone tissue. Various metallic elements are known to play an important role in the bone formation and also affect bone mineral characteristics. Especially, Zn is essential for the growth of the human and Zn coating has a major impact on the improvement of corrosion resistance. Plasma electrolytic oxidation (PEO) is a promising technology to produce porous and firmly adherent inorganic Zn containing TiO2(Zn-TiO2)coatings on Ti surface, and the a mount of Zn introduced in to the coatings can be optimized by altering the electrolyte composition. In this study, effect of Zn content on the corrosion behavior of Ti-6Al-4V alloy after plasma electrolytic oxidation were studied by SEM, EDS, XRD, AC impedance, and potentiodynamic polarization test. The potentiodynamic polarization and AC impedance tests for corrosion behaviors were carried out in 0.9% NaCl solution at similar body temperature using a potentiostat with a scan rate of 1.67 mV/s and potential range from -1500 mV to +2000 mV. Also, AC impedance was performed at frequencies ranging from 10 MHz to 100 kHz for corrosion resistance.

• 한국표면공학회:학술대회논문집
• /
• 한국표면공학회 2016년도 추계학술대회 논문집
• /
• pp.120-120
• /
• 2016

Ti-6Al-4V alloy have been used for dental implant because of its excellent biocompatibility, corrosion resistance, and mechanical properties. However, the integration of such implant in bone was not in good condition to achieve improved osseointergraiton. For solving this problem, calcium phosphate (CaP) has been applied as coating materials on Ti alloy implants for hard tissue applications because its chemical similarity to the inorganic component of human bone, capability of conducting bone formation and strong affinity to the surrounding bone tissue. Various metallic elements, such as strontium (Sr), magnesium (Mg), zinc (Zn), sodium (Na), silicon (Si), silver (Ag), and yttrium (Y) are known to play an important role in the bone formation and also affect bone mineral characteristics, such as crystallinity, degradation behavior, and mechanical properties. Especially, Zn is essential for the growth of the human and Zn coating has a major impact on the improvement of corrosion resistance. Plasma electrolytic oxidation (PEO) is a promising technology to produce porous and firmly adherent inorganic Zn containing $TiO_2(Zn-TiO_2)$coatings on Ti surface, and the a mount of Zn introduced in to the coatings can be optimized by altering the electrolyte composition. In this study, corrosion behavior of Ti-6Al-4V alloy after plasma electrolytic oxidation in solutions containing Ca, P and Zn were studied by scanning electron microscopy (SEM), AC impedance, and potentiodynamic polarization test. A series of $Zn-TiO_2$ coatings are produced on Ti dental implant using PEO, with the substitution degree, respectively, at 0, 5, 10 and 20%. The potentiodynamic polarization and AC impedance tests for corrosion behaviors were carried out in 0.9% NaCl solution at similar body temperature using a potentiostat with a scan rate of 1.67mV/s and potential range from -1500mV to +2000mV. Also, AC impedance was performed at frequencies ranging from 10MHz to 100kHz for corrosion resistance.

• 마이크로전자및패키징학회지
• /
• 제8권2호
• /
• pp.37-42
• /
• 2001

The BGA package has been the area array package of choice for several years. Recently, the transition has been to finer pitch configurations called Chip Scale Packages (CSP). Several of these package types are available at 0.5 mm pitch. requiring surface mount assemblers to evaluate and optimize various elements of the assembly process. This presentation describes the issues associated with making the transition from BGA to CSP assembly. Areas addressed will include the accuracy of pick and place equipment, printed wiring board lines and spaces, PWB vias, in-circuit test issues, solder paste printing, moisture related factors, rework and reliability. The transition to 0.5 mm pitch requires careful evaluation of the board design, solder paste selection, stencil design and component placement accuracy. At this pitch, ball and board pad diameters can be as small as 0.25 mm and 0.20 mm respectively. Drilled interstitial vias are no longer possible and higher ball count packages require micro-via board technology. The transition to CSP requires careful evaluation of these issues. Normal paste registration and BGA component tolerances can no longer achieve the required process levels and higher accuracy pick and place machines need to be implemented. This presentation will examine the optimization of these critical assembly operations, contrast the challenges at 0.5 mm and also look at the continuation of the process to incorporate smaller pitch flip chip devices.

• 제어로봇시스템학회논문지
• /
• 제21권8호
• /
• pp.788-793
• /
• 2015

This paper proposes a path planning algorithm to reduce the inspection time of AOI (Automatic Optical Inspection) machines for SMT (Surface Mount Technology) in-line system. Since the field-of-view of the camera attached at the machine is much less than the entire inspection region of board, the inspection region should be clustered to many groups. The image acquisition time depends on the number of groups, and camera moving time depends on the sequence of visiting the groups. The acquired image is processed while the camera moves to the next position, but it may be delayed if the group includes many components to be inspected. The inspection delay has influence on the overall job time of the machine. In this paper, we newly considers the inspection delay time for path planning of the inspection machine. The unified approach using genetic algorithm is applied to generates the groups and visiting sequence simultaneously. The chromosome, crossover operator, and mutation operator is proposed to develop the genetic algorithm. The experimental results are presented to verify the usefulness of the proposed method.