• JSTS:Journal of Semiconductor Technology and Science
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• v.3 no.1
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• pp.21-26
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• 2003

4H-SiC Schottky rectifiers were exposed to pure Ar discharges in a planar coil Inductively Coupled Plasma system, as a function of source power, of chuck power and process pressure. The reverse breakdown voltage ($V_B$) decreased as a result of plasma exposure due to the creation of surface defects associated with the ion bombardment. The magnitude of the decrease was a function of both ion flux and ion energy. The forward turn-on voltage ($V_F$), on-state resistance ($R_{ON}$) and diode ideality factor (n) all increased after plasma exposure. The changes in all of the rectifier parameters were minimized at low power, high pressure plasma conditions.

• Laser Solutions
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• v.14 no.4
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• pp.14-20
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• 2011

The advantage of using lasers for through silicon via (TSV) drilling is that they allow higher flexibility during manufacturing because vacuums, lithography, and masks are not required; furthermore, the lasers can be applied to metal and dielectric layers other than silicon. However, conventional nanosecond lasers have disadvantages including that they can cause heat affection around the target area. In contrast, the use of a picosecond laser enables the precise generation of TSVs with a smaller heat affected zone. In this study, a comparison of the thermal and crystallographic defect around laser-drilled holes when using a picosecond laser beam with varing a fluence and repetition rate was conducted. Notably, the higher fluence and repetition rate picosecond laser process increased the experimentally recast layer, surface debris, and dislocation around the hole better than the high fluence and repetition rate. These findings suggest that even the picosecond laser has a heat accumulation effect under high fluence and short pulse interval conditions. To eliminate these defects under the high speed process, the CDE (chemical downstream etching) process was employed and it can prove the possibility to applicate to the TSV industry.

• Polymer(Korea)
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• v.37 no.3
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• pp.316-322
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• 2013

In this study, poly(ethylene terephthalate) (PET) was treated with fluorination and ultrasonic washing treatment for hydrophilic modification of PET film. We measured the change of surface modified PET film surface characteristics using contact angle, surface free energy, FE-SEM, AFM and XPS. After direct fluorination and ultrasonic washing treatment, the water contact angle was measured to be $10.81^{\circ}$, 85% reduction compared to the untreated PET film. Total surface free energy has been measured to be $42.25mNm^{-1}$, 650% increase compared to the untreated PET film. Also RMS roughness has been measured to be 1.965 nm, 348% increase compared to the untreated PET film. Hydrophilic functional group C-OH bond concentration has increased approximately 3 times. These results are attributed to the hydrophilic functional group and cavitation due to chemical etching. From this result, it was suggested that the fluorination-ultrasonic washing treatment method could be useful to make PET film surface hydrophilic.

• The Journal of Korean Academy of Prosthodontics
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• v.42 no.4
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• pp.386-396
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• 2004

Statement of problem: It is not clear how to make a stable bonding between zirconia ceramic and resin cement. And the study about surface treatment of zirconia ceramic or bonding resin cement are not enough. Purpose: To measure and compare the shear bond strength of some resin cements on zirconia ceramic after different surface treatments. Material and method: 48 ceramic discs were made of 3 ceramic materials, zirconia ceramics (Zi-Ceram), heat-pressed ceramics (IPS Empress 2) and slip cast alumina ceramics (In-Ceram). According to the surface treatments of ceramic specimens and resin cements, specimens were classified into 6 groups and each group was composed of 8 specimens. For the surface treatment of Zi-Ceram group (test group), sandblasting and diamond bur preparation were applied and Superbond C&B and Panavia F were bonded respectively. For IPS Empress 2 group (control group), Variolink II was bonded after sandblasting, acid etching, silanization and for In-Ceram ALUMINA group (control group), Panavia F was bonded after sandblasting. After storing specimens in distilled water for 24 hours, the shear bond strength was measured by the universal testing machine. Results and conclusion: 1. Zi-Ceram group with Superbond C&B cement showed higher bond strength than with Panavia F cement regardless to the surface treatments (p<0.05). 2. In Zi-Ceram group with Superbond C&B cement, sandblasting treatment group (12.1MPa) showed higher bond strength than diamond bur treatment group (7.7MPa) (p<0.05). In Zi-Ceram group with Panavia F cement, there were no significant differences in the bond strength according to the surface treatments (p>0.05). 3. Zi-Ceram group with sandblasting and Superbond C&B cement (12.1MPa) showed the highest bond strength. The bond strength of this group was not significantly different from In-Ceram ALUMINA group (10.4MPa) (p>0.05) and lower than IPS Empress 2 group (15.9MPa) (p<0.05).

• Applied Chemistry for Engineering
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• v.33 no.6
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• pp.624-629
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• 2022

Formaldehyde is an indoor pollutant that is harmful to humans, such as causing respiratory and skin diseases. Nitrogen plasma treatment was performed to introduce nitrogen groups on the surface of the activated carbon fibers (ACFs), and the adsorption characteristics of formaldehyde for the surface-modified ACFs were considered. As the nitrogen gas flow rate increased, the content of nitrogen functional groups introduced to the surface of the ACFs increased by about 7%, and the ratio of nitrogen functional groups to each type present was similar. Ultramicropores increased on the ACFs surface due to the etching effect of plasma treatment. The adsorption efficiency of formaldehyde on the modified ACFs surface was also enhanced. However, under the nitrogen flow rate of 120 sccm or more, the surface of the ACFs was excessively etched, and the specific surface area and the formaldehyde adsorption capacity decreased. Therefore, the content of the nitrogen groups is the main factor in the adsorption of formaldehyde on the nitrogen plasma-treated ACFs, but it can be found that the adsorption efficiency of formaldehyde is improved when the ACFs have a suitable pore structure.

• The Journal of Korean Academy of Prosthodontics
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• v.46 no.5
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• pp.535-543
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• 2008

Purpose: The objective of this study was to compare the bonding characteristics of a new self-adhesive resin cement to dentin, which does not require bonding and conditioning procedure of the tooth surface, and conventional resin cement. The effect of phosphoric acid etching prior to application of self-adhesive resin cement on the shear bond strength was also evaluated. Material and methods: Fortyfive non-carious human adult molars extracted within 6 months were embedded in chemically cured acrylic resin. The teeth were ground with a series of SiC-papers ending with 800 grit until the flat dentin surfaces of the teeth were exposed. The teeth were randomly divided into 3 experimental groups. In group 1, self-adhesive resin cement, RelyX Unicem (3M ESPE, Seefeld, Germany) was bonded without any conditioning of teeth. In group 2, RelyX Unicem was bonded to teeth after phosphoric acid etching. For group 3, Syntac Primer (Ivoclar Vivadent AG, Schaan, Liechtenstein) was applied to the teeth before Syntac adhesive (Ivoclar Vivadent AG, Schaan, Liechtenstein) and Helibond (Ivoclar Vivadent AG, Schaan, Liechtenstein) followed by conventional resin cement, Variolink II (Ivoclar Vivadent AG, Schaan, Liechtenstein). To make a shear bond strength test model, a plastic tuble (3 mm diameter, 3 mm height) was applied to the dentin surfaces at a right angle and filled it with respective resin cement, and light-polymerized for 40 seconds. All the specimens were stored in distilled water at $37^{\circ}C$ for 24 hours before test. Universal Testing Machine (Z020, Zwick, Ulm, Germany) at a cross head speed of 1 mm/min was used to evaluate the shear bond strength. The failure sites were inspected under a magnifier and Scanning Electron Microscope. The data was analyzed with One way ANOVA and Scheffe test at ${\alpha}$= 0.05. Results: (1) The shear bond strengths to dentin of RelyX Unicem was not significantly different from those of Variolink II/Syntac. (2) Phosphoric acid etching lowered the shear bond strength of RelyX Unicem significantly. (3) Most of RelyX Unicem and Variolink II showed mixed fractures, while all the specimens of RelyX Unicem with phosphoric acid etching demonstrated adhesive failure between dentin and resin cement. Conclusion: Shear bond strength to dentin of self-adhesive resin cement is not significantly different from conventional resin cement, and phosphoric acid etching decrease the shear bond strength to dentin of self-adhesive resin cement.

• Journal of the korean academy of Pediatric Dentistry
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• v.35 no.3
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• pp.509-515
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• 2008

It is widely believed that the increase in the prevalence of dental erosion is due to soft drinks. The purpose of this study was to assess the influence of soft drinks and etchant on the erosion of tooth enamel and the effect of tooth brushing on the abrasion of eroded enamel, and the effect of milk, saliva and Tooth $Mousse^{(R)}$ on the remineralization. The changes in tooth enamel surface were observed by scanning electron microscophy. The results were as follows; 1. The pH of Coca-Cola and Chilsung-Cider were higher than the pH of FineEtch 37 and $Tyrian^{TM}SPE$. 2. The SEM photos revealed that the pattern of the surface eroded by Coca-Cola and Chilsung-Cider were more obvious than that eroded by etchants. 3. The results of remineralization by saliva, milk, Tooth $Mousse^{(R)}$ were not different from each other. 4. The remineralization by saliva decreased tooth brushing abrasion.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2018.06a
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• pp.140-140
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• 2018

The 3D interconnect technologies have been appeared, as the density of Integrated Circuit (IC) devices increases. Through Silicon Via (TSV) process is an important technology in the 3D interconnect technologies. And the process is used to form a vertically electrical connection through silicon dies. This TSV process has some advantages that short length of interconnection, high interconnection density, low electrical resistance, and low power consumption. Because of these advantages, TSVs could improve the device performance higher. The fabrication process of TSV has several steps such as TSV etching, insulator deposition, seed layer deposition, metallization, planarization, and assembly. Among them, TSV metallization (i.e. TSV filling) was core process in the fabrication process of TSV because TSV metallization determines the performance and reliability of the TSV interconnect. TSVs were commonly filled with metals by using the simple electrochemical deposition method. However, since the aspect ratio of TSVs was become a higher, it was easy to occur voids and copper filling of TSVs became more difficult. Using some additives like an accelerator, suppressor and leveler for the void-free filling of TSVs, deposition rate of bottom could be fast whereas deposition of side walls could be inhibited. The suppressor was adsorbed surface of via easily because of its higher molecular weight than the accelerator. However, for high aspect ratio TSV fillers, the growth of the top of via can be accelerated because the suppressor is replaced by an accelerator. The substitution of the accelerator and the suppressor caused the side wall growth and defect generation. The suppressor was used as Single additive electrodeposition of TSV to overcome the constraints. At the electrochemical deposition of high aspect ratio of TSVs, the suppressor as single additive could effectively suppress the growth of the top surface and the void-free bottom-up filling became possible. Generally, copper was used to fill TSVs since its low resistivity could reduce the RC delay of the interconnection. However, because of the large Coefficients of Thermal Expansion (CTE) mismatch between silicon and copper, stress was induced to the silicon around the TSVs at the annealing process. The Keep Out Zone (KOZ), the stressed area in the silicon, could affect carrier mobility and could cause degradation of the device performance. Cobalt can be used as an alternative material because the CTE of cobalt was lower than that of copper. Therefore, using cobalt could reduce KOZ and improve device performance. In this study, high-aspect ratio TSVs were filled with cobalt using the electrochemical deposition. And the filling performance was enhanced by using the suppressor as single additive. Electrochemical analysis explains the effect of suppressor in the cobalt filling bath and the effect of filling behavior at condition such as current type was investigated.

• Solar Energy
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• v.17 no.4
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• pp.3-11
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• 1997

Because grain boundaries in polycrystalline silicon act as potential barriers and recombination centers for the photo-generated charge carriers, these defects degrade conversion effiency of solar cell. To reduce these effects of grain boundaries, we investigated various influencing factors such as thermal treatment, various grid pattern, selective wet etching for grain boundaries, buried contact metallization along grain boundaries, grid on metallic thin film. Pretreatment above $900^{\circ}C$ in $N_2$ atmosphere, gettering by $POCl_3$ and Al treatment for back surface field contributed to obtain a high quality poly-Si. To prevent carrier losses at the grain boundaries, we carried out surface treatment using Schimmel etchant. This etchant delineated grain boundaries of $10{\mu}m$ depth as well as surface texturing effect. A metal AI diffusion into grain boundaries on rear side reduced back surface recombination effects at grain boundaries. A combination of fine grid with finger spacing of 0.4mm and buried electrode along grain boundaries improved short circuit current density of solar cell. A ultra-thin Chromium layer of 20nm with transmittance of 80% reduced series resistance. This paper focused on the grain boundary effect for terrestrial applications of solar cells with low cost, large area, and high efficiency.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.39 no.12
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• pp.1297-1303
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• 2015

The internal chromium plating of a long-axis tube is widely used in military and industrial application, with the thick hard plating formed using a mixed solution of Chromium acid and catalytic $H_2SO_4$. A large-caliber gun can endure a high explosive force as a result of the increased stiffness and wear resistance provided by this internal hard chromium surface. The internal chromium layer of a tube is prone to exfoliation caused by the high kinetic energy of the projectile and high pressure of the explosion. Therefore, we reviewed the plating process. Chromium plating comprises many steps, including the removal of Grease, water cleaning, electrolytic abrasion, etching, plating, water cleaning, and hydrogen brittleness removal. The exfoliated chromium plating layer is affected by the adhesion property of the plating. In particular, the Fe concentration of the electrolyte affects the adhesion property. The optimum Fe concentration for effectively suppressing the exfoliation of the plating layer was established by using a scanning electron microscope to determine the surface roughness, and the effectiveness was proved in an adhesion test, etc.