• Journal of the Korean Society for Precision Engineering
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• v.13 no.7
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• pp.90-99
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• 1996

In the area of assembly process of micro-chips and electronic parts on the printed circuit board, surface mounting device(SMD) is used as a fundamental tool. Generally speaking, the motion of the SMD is based on the ball screw system operated by any type of actuators. The ball screw system is a mechanical transformed which converts the mechanical rotational motion to the translational one. Also, this system could be considered as an efficient motion device against mechanical backlash and friction. Therefore a dynamic modeling and state sensitivity analysis of the ball screw system in SMD have to be done in the initial design stage. In this paper, a simple mathematical dynamic model for this system and the sensit- ivity analysis are mentioned. Especially, the bond graph approach is used for graphical modeling of the dynamic system before analysis stage. And the direct differentiation method is used for the state sensit- ivity analysis of the system. Finally, some trends for the state variables with respect to the design variables could be suggested for the better design and faster operating based on the results of dynamic and state sensitivity.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 1995.10a
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• pp.628-634
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• 1995

In the area of assembly process of micro-chips and electronic parts on the printed circuit board, surface mounting device(SMD) is used as a fundamental tool. Generally speaking, the motion of the SMD is based on the ball screw system operated by any type of actuators. The ball screw system is a mechanical transformer which converts the mechanical rotational motion to the translational one. Also, this system could be considered as an efficient motion device against mechanical backash and friction. Therefore a dynamic modeling and stste sensitivity analysis of the ball screw system in SMD have to be done in the initial design stage. In this paper, a simple mathematical dynamic model for this system and the sensitivity snalysis are mentioned. Especially, the bond graph approach is used for graphical modeling of the dynamic system before analysis stage. And the direct differentiation method is used for the state sensitivity analysis of the system. Finally, some trends for the state variables with respect to the design variables could be suggested for the better design based on the results on the results of dynamic and state sensitivity.

• Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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• 2002.05a
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• pp.1039-1042
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• 2002

SMD(Surface Mounting Device) which mounts electronic components as IC-Chips on PCB automatically, produces a large dynamic force and vibration. The unwanted vibrations in SMD degrade the performance of the precision device and it is the major obstacle to limit its speed for mounting. This study investigated the vibration analysis of a typical SMD to predict the natural frequencies and mode shapes. To validate the finite element analysis of SMD, the FE result was compared with that of ODS measurements. It was shown that the predicted results were well correlated with the experimental modal parameters.

• Journal of the Korean Society for Precision Engineering
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• v.13 no.4
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• pp.122-128
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• 1996

In high speed and high precision assembly systems such as a surface mounting device and robotend effector, the contact force control is required. As the operation repeats, the repetitive control is applied to reduce the periodic contact force errors. Since high order unmodelled dynamics are easily excited in contact force control, a Q filter was introduced and its robust stability was analyzed. Simulation and Experimental results show the effectiveness of the algorithm.

• International Journal of Fuzzy Logic and Intelligent Systems
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• v.4 no.3
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• pp.316-321
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• 2004

In this paper, we have developed a new mounting head system for flip chip. The proposed head system consists of a macro/micro positioning actuator for stable force control. The macro actuator provides the system with a gross motion while the micro device yields fine tuned motion to reduce the harmful impact force that occurs between very small sized electronic parts and the surface of a PCB(printed circuit board). In order to show the effectiveness of the proposed macro/micro chip mounting system, we compared the proposed system with the conventional chip mounting head equipped with a macro actuator only. A series of experiments were executed under the mounting conditions such as various access velocities and PCB stiffness. As a result of this study, a satisfactory voice coil actuator as the micro actuator has been developed, and its performance meet well the specifications desired for the design of the chip mounting head system and show good correspondence between theoretical analysis and experimental results.

• Journal of Korean Society of Industrial and Systems Engineering
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• v.43 no.4
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• pp.67-75
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• 2020

This paper proposes a methodology for gantry route optimization in order to maximize the productivity of a odd-type surface mount device (SMD). A odd-type SMD is a machine that uses a gantry to mount electronic components on the placement point of a printed circuit board (PCB). The gantry needs a nozzle to move its electronic components. There is a suitability between the nozzle and the electronic component, and the mounting speed varies depending on the suitability. When it is difficult for the nozzle to adsorb electronic components, nozzle exchange is performed, and nozzle exchange takes a certain amount of time. The gantry route optimization problem is divided into the mounting order on PCB and the allocation of nozzles and electronic components to the gantry. Nozzle and electronic component allocation minimized the time incurred by nozzle exchange and nozzle-to-electronic component compatibility by using an mixed integer programming method. Sequence of mounting points on PCB minimizes travel time by using the branch-and-price method. Experimental data was made by randomly picking the location of the mounting point on a PCB of 800mm in width and 800mm in length. The number of mounting points is divided into 25, 50, 75, and 100, and experiments are conducted according to the number of types of electronic components, number of nozzle types, and suitability between nozzles and electronic components, respectively. Because the experimental data are random, the calculation time is not constant, but it is confirmed that the gantry route is found within a reasonable time.

• IE interfaces
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• v.10 no.1
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• pp.155-167
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• 1997

The purpose of this study is to develop the program for efficient operation of a multi-functional surface mounting device(SMD) which mount various components on a printed circuit board(PCB). These components are provided by diverse types of feeders such as cassette, stick and tray feeders. The SMD has one or two heads. In the SMD, the positions of PCB and feeders and fixed, and the head moves to pick up a component from a feeder and to mount it on the PCB. The number of lanes occupied by each feeder and the nozzle used for each component can be different. We develop an off-line program to minimize the cycle-time of the SMD by studying the optimal assignment of feeders and the optimal mounting sequence of components. Graphical User Interface(GUI) is also developed. Additionally, we consider the line balancing problem which appears when two SMDs are used sequentially.

• 제어로봇시스템학회:학술대회논문집
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• 2003.10a
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• pp.1060-1065
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• 2003

This paper contributes to development of a new chip mounting head system for flip chip. Recently, the LDM(Linear DC Motor) has been widely used, because it has particular merits than the rotary type motors. In this paper, we proposed a macro/micro positioning system for force control of a chip mounting system. In the proposed macro/micro system, the macro actuator provide the system with a gross motion while the micro device yields fine tuned motion to reduce the harmful impact force that occurs between very small sized electronic parts and PCB surface. In order to prove the effectiveness of the proposed macro/micro chip mounting system, we compared the proposed chip mounting head with the conventional chip mounting head equipped with a macro actuator only. A series of experiments were executed under the mounting conditions of various access velocities and PCB stiffness. As a result of this study, a satisfactory voice coil actuator as the micro actuator has been developed, and its performance meet well the specifications desired for the design of the chip mounting head system and show good correspondence between theoretical analysis and experimental results.

• Journal of Institute of Control, Robotics and Systems
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• v.4 no.3
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• pp.384-391
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• 1998

When a device is mounted on the PCB, it is impossible to have zero defects due to many unpredictable problems. Among these problems, devices with bent corner leads due to mis-handling and which are not placed at a given point measured along the axis are principal problem in SMT(Surface Mounting Technology). It is obvious that given the complexity of the inspection task, the efficiency of a human inspection is questionable. Thus, new technologies for inspection of SMD(Surface Mounting Device) should be explored. An example of such technologies is the Automated Visual Inspection(AVI), wherein the vision system plays a key role to correct this problem. In implementing vision system, high-speed and high-precision are indispensable for practical purposes. In this paper, a new algorithm based on the Radon transform which uses a projection technique to inspect the FIC(Flat Integrated Circuit) device is proposed. The proposed algorithm is compared with other algorithms by measuring the position error(center and angle) and the processing time for the device image, characterized by line scan camera.

• Journal of the Korean Society for Industrial and Applied Mathematics
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• v.10 no.1
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• pp.31-45
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• 2006

Recently advanced device and sophisticated manufacture process by high-density, high-integration require critical inspection criteria in SMT(surface mounting technologies). Especially for solder paste which come out over 60% of inferior goods of all product, 3-dimensional inspection replaces 2-D inspection as a effectiveness substitute of this trend. Therefore this paper proposes a fast 3-D inspection system and measurement algorithm automatically inspecting 3-D solder paste of PCB in SMT assembly line. The proposed method generates 3-D surface of data using B-spline algorithm and then extracts to inspect the pad.