• Title/Summary/Keyword: Surface Mount

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A Clustering Algorithm for Path Planning of SMT Inspection Machines (SMT 검사기의 경로계획을 위한 클러스터링 알고리즘)

  • Kim, Hwa-Jung;Park, Tae-Hyoung
    • Journal of the Korean Institute of Intelligent Systems
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    • v.13 no.4
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    • pp.480-485
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    • 2003
  • We Propose a Path planning method to reduce the Inspection time of AOI (automatic optical inspection) machines in SMT (surface mount technology) in-line system. Inspection windows of board should be clustered to consider the FOV (field-of-view) of camera. The number of clusters is desirable to be minimized in order to reduce the overall inspection time. We newly propose a genetic algorithm to minimize the number of clusters for a given board. Comparative simulation results are presented to verify the usefulness of proposed algorithm.

A Development of Surface Permanent Mount Synchronous Generator for 5 Phase 5KW (5상 5KW 표면부착형 영구자석 동기발전기(SPMSG) 개발)

  • Jung, Hyung-Woo;Kim, Min-Huei;Kim, Dong-Hee
    • Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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    • v.26 no.11
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    • pp.87-96
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    • 2012
  • This paper propose a development of surface permanent mount synchronous generator(SPMSG) for 5-phase 5Kw in order to study a polyphase ac machinery that keep hold of advantages more than traditional three-phase squirrel-cage induction motor, such as reducing a amplitude of torque pulsation decreasing electric noises, and increasing the reliability. Design methods of the generator use a development tools with Maxwell 2D and Simplorer. There are designed drawing of manufactured frames of the SPMSG. A amplitude and waveform of the generated electromotive force, FFT analysis of harmonics within output voltages, and reviewing a experiment results are shown by variable output frequency. We are presenting a design and manufacture methods for the SPMSG.

Development of the Process Planning Program for a Multi-functional Surface Mounting Device (다기능 표면실장기의 공정계획 프로그램 개발)

  • Sohn, Jin-Hyeon;Yu, Sung-Yeol;Kang, Jang-Ha;Park, Sung-Soo;Oh, Byung-Jun;Seong, Pil-Young
    • IE interfaces
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    • v.10 no.1
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    • pp.155-167
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    • 1997
  • The purpose of this study is to develop the program for efficient operation of a multi-functional surface mounting device(SMD) which mount various components on a printed circuit board(PCB). These components are provided by diverse types of feeders such as cassette, stick and tray feeders. The SMD has one or two heads. In the SMD, the positions of PCB and feeders and fixed, and the head moves to pick up a component from a feeder and to mount it on the PCB. The number of lanes occupied by each feeder and the nozzle used for each component can be different. We develop an off-line program to minimize the cycle-time of the SMD by studying the optimal assignment of feeders and the optimal mounting sequence of components. Graphical User Interface(GUI) is also developed. Additionally, we consider the line balancing problem which appears when two SMDs are used sequentially.

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A Machine Vision System for Inspecting Tape-Feeder Operation

  • Cho Tai-Hoon
    • International Journal of Fuzzy Logic and Intelligent Systems
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    • v.6 no.2
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    • pp.95-99
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    • 2006
  • A tape feeder of a SMD(Surface Mount Device) mounter is a device that sequentially feeds electronic components on a tape reel to the pick-up system of the mounter. As components are getting much smaller, feeding accuracy of a feeder becomes one of the most important factors for successful component pick-up. Therefore, it is critical to keep the feeding accuracy to a specified level in the assembly and production of tape feeders. This paper describes a tape feeder inspection system that was developed to automatically measure and to inspect feeding accuracy using machine vision. It consists of a feeder base, an image acquisition system, and a personal computer. The image acquisition system is composed of CCD cameras with lens, LED illumination systems, and a frame grabber inside the PC. This system loads up to six feeders at a time and inspects them automatically and sequentially. The inspection software was implemented using Visual C++ on Windows with easily usable GUI. Using this system, we can automatically measure and inspect the quality of ail feeders in production process by analyzing the measurement results statistically.

Defect Classification of Components for SMT Inspection Machines (SMT 검사기를 위한 불량유형의 자동 분류 방법)

  • Lee, Jae-Seol;Park, Tae-Hyoung
    • Journal of Institute of Control, Robotics and Systems
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    • v.21 no.10
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    • pp.982-987
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    • 2015
  • The inspection machine in SMT (Surface Mount Technology) line detects the assembly defects such as missing, misalignment, loosing, or tombstone. We propose a new method to classify the defect types of chip components by processing the image of PCB. Two original images are obtained from horizontal lighting and vertical lighting. The image of the component is divided into two soldering regions and one packaging region. The features are extracted by appling the PCA (Principle Component Analysis) to each region. The MLP (Multilayer Perceptron) and SVM (Support Vector Machine) are then used to classify the defect types by learning. The experimental results are presented to show the usefulness of the proposed method.

Dynamic characteristic analysis of SMT mounter system (SMT 마운터의 동특성 분석)

  • Rim, Kyung-Hwa;Jung, Jin-Ho;Beom, Hee-Rak
    • Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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    • 2011.10a
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    • pp.440-445
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    • 2011
  • Dynamic characteristic analysis is required in developing SMT mounter system with high installation speed and position precision, because of vibration source occurred by positioning head. This paper presents the method of improving dynamic characteristic of SMT(Surface Mount Technology) mounter with finite element method and modal test. The design direction is that natural frequencies of SMT mounter must be higher than the vibration source. In addition, the effect of input shaping on residual vibration reduction is investigated by simulating the response of a first-order system.

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Improvement of Temperature Characteristics in Ceramic-packaged Shunt Resistors (세라믹 패키지를 이용한 shunt 저항의 온도 특성 개선)

  • Kang, Doo-Won;Jo, Jungyol
    • Journal of the Semiconductor & Display Technology
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    • v.14 no.3
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    • pp.57-60
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    • 2015
  • Electric power in large devices is controlled by digital circuits, such as switching mode power supply. This kind of power circuits require accurate current sensor for power distribution. We studied characteristics of shunt resistor, which has many advantages for commercial application compared to Hall-effect current sensor. We applied ceramic package to the shunt resistor. Ceramic package has good thermal conductivity compared to plastic package, and this point is important for space requirement in Printed Circuit Board (PCB). Another advantage of the ceramic package is that surface mount technology (SMT) can be used for production. Our experimental results showed that the ceramic packaged resistor showed about 50% lower temperature than the plastic packaged one. Burning point and frequency characteristics are also discussed.

Heuristics for Sequencing Printed Circuit Boards on a Surface Mount Device Placement Machine (SMD기계의 PCB 생산순서 결정을 위한 발견적 기법)

  • Song, Chang-Yong;Shinn, Seong-Whan
    • IE interfaces
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    • v.13 no.2
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    • pp.195-203
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    • 2000
  • This paper considers the problem of sequencing printed circuit boards(PCBs) on an automatic surface mount device(SMD) placement machine in order to minimize total setup time. Since the total set of component feeders needed by all boards cannot be loaded simultaneously on the magazine, the setup must be made between two successive boards in the sequence. It is assumed that the setup time depends on the number of component feeders to be replaced in the magazine. An important characteristic is that each feeder occupies a different number of slots in the magazine. This problem is equivalent to travelling salesman problem(TSP) except that the distances between two cities, that is, the setup times between two boards, are not known in advance. So, TSP-based heuristics with new distance functions are presented and their performances are compared through various test problems. Computational results indicate that our heuristics outperform existing methods.

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The Temperature Properties of Inductor due to Current Injection (전류인가에 따른 인덕터의 온도 특성)

  • Kim, Ki-Joon
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2007.06a
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    • pp.494-495
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    • 2007
  • As a pocket size electronic device have developed and electronic parts is increased, it need dual face soldering using SMT(Surface Mount Technology) and it can be getting high density soldering. Inductor is one of their electronic parts using SMT and inductor was developed to make electromagnetic energy. In this study, it is analyzed temperature properties of surface mount type Inductor due to current injection which is satisfied the demand of utmost small size and the substance of high density simultaneously.

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Power Supply for White GaN LED by Using SMD Type Solar Cell Array (SMD 타입 태양전지 어레이를 이용한 white GaN LED용 전원 공급 장치)

  • Kim, Seong-Il;Lee, Yoon-Pyo
    • New & Renewable Energy
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    • v.5 no.4
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    • pp.34-37
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    • 2009
  • Using six SMD(surface mount device) type AlGaAs/GaAs single junction solar cells connected in series, a power source was fabricated for a white GaN LED. The electrical properties of the power source was measured and analyzed under one sun (100mW/$cm^2$) and various indoor light (300 - 900 lux) conditions. Under 600 lux indoor light condition, output power was 17.06 ${\mu}W$ and it was 30.75 ${\mu}W$ under 900 lux indoor light condition. Using the fabricated solar cell power supply, we have turned on the white GaN LED. It was worked well under 15 ${\mu}W$(at 480 lux) power supplied from solar cell array. This kind of solar cell power supply can be used as a power source for ubiquitous sensor network (USN).

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