• Agribusiness and Information Management
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• v.6 no.1
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• pp.37-44
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• 2014

This study was conducted to evaluate light intensity and uniformity of two SMD (surface-mount device) type LEDs for protected crop production. A low-power (0.1 W) and a high-power (1 W) LEDs were selected and the intensity and uniformity was evaluated at different vertical (height) and horizontal (distance) intervals. When the horizontal interval of the LED bar was fixed, the light intensity increased and the uniformity decreased as the height decreased. At the 30~40 cm heights, 20~30% of the area showed $200{\pm}20{\mu}molm^{-2}s^{-1}$. As the horizontal distance of the LED bars increased, while the uniformity increased as well, the light intensity decreased. At the distances of 6~10 cm, 17~23% of the area showed $200{\pm}20{\mu}molm^{-2}s^{-1}$. When the LED bars were added to the sides, the light intensity and uniformity were generally improved. Results showed that the light intensity and uniformity depended on the height and interval of the LED bulbs; therefore, optimum arrangement for the crops interested should be determined through experiments.

• Annual Conference of KIPS
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• 2002.04b
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• pp.1619-1622
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• 2002

최근에 생산되는 디지털 VLSI칩들은 그 집적도가 계속 높아지고 있으며, 이러한 칩들을 장착한 보드의 경우도 그 복잡성이 점차 높아지고 있다. 이에 따라 칩 및 보드에 대한 철저한 테스트 과정이 요구된다. 지금까지 보드 테스트 방법으로 널리 쓰였던 ICT(In-Circuit Test)는 칩의 고집적화에 따른 핀 간격의 조밀화와 SMT(Surface Mount Technology), BGA(Ball Grid Array), MCM(Multi Chip Module) 등의 새로운 패키징 방식의 등장에 따라 테스트 방법으로의 한계성을 드러내고 있다. 이에 대한 대안으로 등장한 IEEE Std 1149.1 은 ICT의 한계성을 극복할 수 있는 기술일 뿐 아니라 여러 가지 장점을 가지고 있으며 그 활용 분야도 다양하다. 본 논문에서는 IEEE Std 1149.1에 따라 설계된 보드 상에서 발생 가능한 고장들에 대한 고장 모델을 제시한다. 또한 각 고장 모델들의 양상과 진단 기법을 제시한다. 이를 통해 IEEE Std 1149.1에 따라 설계된 보드 상에서 발생한 고장들을 검출할 수 있으며, 고장의 종류 및 성격, 그리고 고장의 발생 위치 등의 정보를 얻을 수 있다. IEEE Std 1149.1에 따른 보드 설계가 보드의 신뢰성 보장에 긴요함을 인식하는 계기가 되기를 기대하며 제시된 고장 모델 및 진단 기법이 기술적으로 중요한 참고자료가 되기를 기대한다.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2004.07b
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• pp.710-713
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• 2004

The design, simulation, modeling and measurement of a low temperature co-fired ceramic (LTCC) RF switch module for GSM applications is presented in this paper. RF switch module is constructed using a Rx/Tx switching circuit and integrated low pass filter. The low pass filter function was designed to operate in th GSM band. Insertion and return loss of the low pass filter were designed less than 0.3 dB and better than 12.7 dB at 900 MHz. The RF switch module contained 10 embedded passives and 3 surface mount components integrated on $4.6{\times}4.8{\times}1.2$ nm, 6-layer multi-layer integrated circuit. The insertion loss of switch module was measured at 900 MHz was 11 dB.

• Journal of the Korea Convergence Society
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• v.10 no.4
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• pp.39-43
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• 2019

The gantry of surface mount equipment (SMD) is responsible for transferring parts from the feeder to the PCB. At this time, the moving time of the gantry affects the yield. Therefore, in this paper, we propose the fastest path from the suction to the mounting to reduce the gantry travel time. This path is a case where the velocity in front of the camera is 2m/sec due to the nature of the gantry. Therefore, the trajectory graph of this case was created through simulation and the travel time was calculated. As a result, we can see that the moving time of the moving-motion method proposed in this paper is 20% shorter than the current stop-motion method.

• Geomechanics and Engineering
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• v.24 no.4
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• pp.359-370
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• 2021

Joint roughness is combination of primary and secondary roughness. Ordinarily primary roughness is a geostatistical part of a joint surface that has a periodic nature but secondary roughness or unevenness is a statistical part of that which have a random nature. Using roughness generating algorithms is a useful method for evaluation of joint roughness. In this paper after determining geostatistical parameters of the joint profile, were presented two roughness generating algorithms using Mount-Carlo method for evaluation of primary (GJRGAP) and secondary (GJRGAS) roughness. These based on geostatistical parameters (range and sill) and statistical parameters (standard deviation of asperities height, SDH, and standard deviation of asperities angle, SDA) for generation two-dimensional joint roughness profiles. In this study different geostatistical regions were defined depending on the range and SDH. As SDH increases, the height of the generated asperities increases and asperities become sharper and at a specific range (a specific curve) relation between SDH and SDA is linear. As the range in GJRGAP becomes larger (the base of the asperities) the shape of asperities becomes flatter. The results illustrate that joint profiles have larger SDA with increase of SDH and decrease of range. Consequencely increase of SDA leads to joint roughness parameters such Z2, Z3 and RP increases. The results showed that secondary roughness or unevenness has a great influence on roughness values. In general, it can be concluded that the shape and size of asperities are appropriate parameters to approach the field scale from the laboratory scale.

• Journal of the Microelectronics and Packaging Society
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• v.15 no.3
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• pp.27-33
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• 2008

With increasing use of portable appliances such as PDA and cellular phone, changing environment of applications requires higher solder joint reliability. The ENIG (Electroless Nickel Immersion Gold) process has been widely used for fine pitch SMT (Surface Mount Technology) and BGA (Ball Grid Array) packaged devices due to its benefits including excellent solderability, high uniformity and substantial legibility throughout the packaging process. Its brittle fracture of solder, however, has received increasingly attentions. It was Down that fracture brittleness is mainly related with black pad resulting from galvanic nickel corrosion and P-enriched layer formation between the IMC (Intermetallic Compounds) and electroless nickel layer. Theoretically, smooth electroless Ni layer was blown to have a advantages in minimizing the black pad phenomenon by uniform solution exchange during immersion gold plating. Nevertheless, how to control the surface morphology of electroless Ni layer has been hardly blown. This study investigates an effect of surface morphology of Cu underlayer on surface morphology of electroless Ni layer. To obtain various kinds of surface morphology of Cu layer, two types of Cu etching chemical and a number of Cu etching treatment were applied.

• The Journal of Korean Academy of Prosthodontics
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• v.45 no.6
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• pp.743-752
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• 2007

Statement of problem. The aims of the study were to evaluate the effect of current surface conditioning methods on the bond strength of a resin composite luting cement bonded to ceramic surfaces and to identify the optimum cement type. Material and methods. The sixty zirconia ceramic specimens(10 per group) with EVEREST milling machine and 60 tooth block were made. The zirconia ceramic surface was divided into two groups according to surface treatment: (1) airborne abrasion with $110{\mu}m$ aluminum oxide particles; (2) Rocatec system, tribochemical silica coating. The zirconia ceramic specimens were cemented to tooth block using resin cements. The tested resin cements were Rely X ARC, Panavia F and Superbond C&B. Each specimen was mount in a jig of the universal testing machine for shear strength. The results were subjected to 2-way ANOVA and Post hoc tests was performed using Tukey, Scheffe, and Bonferroni test. Results. The mean value of shear bond strength(MPa) were as follows: $$RelyXARC(+Al_2O_3),5.35{\pm}1.69$$; $$RelyXARC(+Rocatec),8.50{\pm}2.13$$; $$PanaviaF(+Al_2O_3),9.58{\pm}1.13$$; $$PanaviaF(+Rocatec),12.98{\pm}1.71$$; $$SuperbondC&B(+Al_2O_3)8.27{\pm}2.04$$; $$SuperbondC&B(+Rocatec),14.46{\pm}2.39$$. There was a significant increase in the shear bond strength when the ceramic surface was subjected to the tribochemical treatment(Rocatec 3M) in all cement groups(P<0.05). Bonding strengths of cements applied to samples treated with $Al_2O_3$ were compared; Rely X ARC showed the lowest values, whereas Panavia F cement showed higher value than that of Superbond C&B group with no statistical significance. When the bond strength of cements with of Rocatec treatment was compared, Rely X ARC showed lowest values. Overall, it was apparent that tribochemical treated Super-Bond possessed higher mean bond strength (14.46MPa; P<0.05) than that of Panavia F cement group with no significance. Conclusions. Silica coating followed silanization(Rocatec treatment) increase the bond strength between resin cement and zirconia ceramic. Panavia F containing phosphate monomer and Superbond C&B comprised of 4-META tend to bond chemically with zirconia ceramic, thus demonstrating higher bond strength compared to BisGMA resin cement. Superbond C&B has shown to have highest value of bonding strength to zirconia ceramic after Rocatec treatment compared to other cement.

• Transactions of the KSME C: Technology and Education
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• v.3 no.2
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• pp.131-140
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• 2015

The mono-ski for the paraplegia designed to skiing is formed as seat bucket on the sled. The impact force transferred by snow surface during skiing is absorbed by the leg joints of normal human, but it is transferred to the human body on the seat when using mono-ski. Most of commercially available mono-ski have absorbing device and link mechanism between seat and ski mount in order to complement it. In this study we developed the comfort evaluation model that could provide skiing simulation of mono-ski with hydraulic damper and analyzed vibrational acceleration occurred during skiing uneven surface. The evaluation method used in this study is the international standard BS6841. We evaluated comfort performance of mono-ski in accordance with nozzle adjustment of hydraulic damper.

• Korean Journal of Remote Sensing
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• v.33 no.1
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• pp.37-46
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• 2017

Sinabung volcano in Indonesia was formed due to the subduction between the Eurasian and Indo-Australian plates along the Pacific Ring of Fire. After being dormant for about 400 years, Sinabung volcano erupted on the 29th of August, 2010 and most recently on the 1st of November, 2016. We measured the deformation of Sinabung volcano using Advanced Land Observing Satellite/Phased Array type L-band Synthetic Aperture Radar(ALOS/PALSAR) interferometric synthetic aperture radar(InSAR) images acquired from February 2007 to January 2011. Based on multi-temporal InSAR processing, we mapped the ground surface deformation before, during, and after the 2010 eruption with time-series InSAR technique. During the 3 years before the 2010 eruption, the volcano inflated at an average rate of ~1.7 cm/yr with a markedly higher rate of 6.6 cm/yr during the 6 months prior to the 2010 eruption. The inflation was constrained to the top of the volcano. From the 2010 eruption to January 2011,the volcano subsided by approximately 3 cm (~6 cm/yr). We interpreted that the inflation was due to magma accumulation in a shallow reservoir beneath Sinabung. The deflation was attributed to magma withdrawal from the shallow reservoir during the eruption as well as thermo-elastic compaction of erupted material. This result demonstrates once again the utility of InSAR for volcano monitoring.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.15 no.8
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• pp.5269-5279
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• 2014

The cause of defects in the PCB SMT assembly is mostly solder paste deposits. Conventional inspection methods for solder paste deposits suffer from slow speed, low reliability and high cost. Therefore, this paper proposes a method for calculating the height and region of solder paste on PCB using the 3D profiles without measuring the 2D image. The solder paste region is detected by the phase difference in the measurement points and the average phase on the whole surface of PCB. The high reliable height of the solder paste region is computed by the average of the measurement points' phase with repeatability and reliability. The experimental results revealed improvements of 17% in inspection time and 29% repeatability in the height calculation of the solder paste region, resulting in a high speed and less expensive system.