• 제어로봇시스템학회:학술대회논문집
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• 2001.10a
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• pp.139.2-139
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• 2001

This paper presents identification and control of a surface mounting system. The mount head of the system is modeled to analyze its dynamic characteristics, which is critical to the placement performance of the mounter. Based on this model, an identification work is carried out to estimate the modeled parameters by using genetic algorithm (GA), which plays a role of minimizing an error between the actual response and the model response. Having obtained the identified parameters, we design a disturbance observer control to compensate the friction. The disturbance observer can estimate the friction force and the uncertainty of the system. From the experimental results, it is found that the proposed disturbance observer plus PID controller show a better performance than PID controller alone. In order to accomplish a stable contact content control for fast mounting a ...

• 제어로봇시스템학회:학술대회논문집
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• 2001.10a
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• pp.98.4-98
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• 2001

A tape feeder of a SMD(Surface Mount Device) mounter is a device that sequentially feeds electronic components on a tape reel to the pick-up system of the mounter. As components are getting much smaller, feeding accuracy of a feeder becomes one of the most important factors for successful component pick-up. Therefore, it is critical to keep the feeding accuracy to a specified level in the assembly and production of tape feeders. This paper describes a tape feeder inspection system that was developed to automatically measure and inspect feeding accuracy using machine vision. It consists of a feeder base, an image acquisition system, and a personal computer. The image acquisition system is composed of CCD cameras with lens ...

• Journal of the Korean Institute of Telematics and Electronics
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• v.16 no.1
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• pp.33-39
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• 1979

The resonance frequency of the slot-line resonator in the shielding box is analyzed. It is verified experimentally that an X-Band oscillator may be realized by the resonator in the microstrip circuit mount as a shielding cavity, and by shunt-connecting the IMPACT diode on the slot-line, And the oscillating power can be coupled with the microstrip by the coupling aperure on the opposite surface of the microstrip by the coupling aperure on the opposite of the substrate of the microstrip cirsuit.

• Proceedings of the Korean Operations and Management Science Society Conference
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• 2003.05a
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• pp.741-743
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• 2003

A surface mount machine operation policy to assemble printed circuit boards is being developed in this research. The policy includes how to assign electronic components to slots on a component rack, and how to determine placement sequences on printed circuit board. The suggested heuristic uses information about component types and closeness relationships in each component on the board to assemble. First, the size of components and closeness ratings are used to divide them into two different size groups. Then rack assignment and placement routes are developed using component type and quantity information for a small size group, and followed by a large size group. Simulation models are developed using Visual C++ for performance evaluation of the heuristic. Necessary statistical analyses are provided to show the effectiveness of the suggested heuristic.

• Transactions of the Korean Society for Noise and Vibration Engineering
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• v.16 no.7 s.112
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• pp.739-745
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• 2006

This paper presents a novel type of hybrid dispensing head for IC fabrication and surface mount technology. The proposed mechanism consists of solenoid valve and piezoelectric stack as actuators, and provides positive-displacement and jet dispensing. The positive-displacement dispensing can produce desired adhesive amount without viscosity effect, while the jet dispensing can produce high precision adhesive amount. In order to determine the relationship between required voltage of the piezoelectric actuator and needle displacement, both static and dynamic analysis are undertaken, In addition, finite element analysis is performed in order to find optimal design parameters. Dispensing flow rate and pressure in the chamber are evaluated through fluid dynamic model.

• Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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• 2000.06a
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• pp.1913-1917
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• 2000

SMD Equipment convey an electronic parts at high speed, then assemble parts into a circuit board, and it develop a long time-duration dynamic force to be caused by moving mass. Vibration problem to be caused by SMD Equipment have an effect on micro-meter level's precision production process, directly, and dynamic stability of building. In the cause of quantitatively access about its vibration problem, input information(or data) of structure dynamic analysis need accuracy information of dynamic load. Determination of Dynamic load is various kinds of method using experimental and theory. In this paper, we got dynamic load using direct measurement method. We expect that an study on the dynamic load characteristic of SMD can be used to Equipment development of low level vibration and basis information of structure dynamic analysis.

• Proceedings of the KWS Conference
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• 2006.05a
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• pp.16-17
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• 2006

We researched by the characteristic of a anisotropic etching of Si wafer and the Si career concerning the flip chip solder bump. Connectors and Anisotropic Conductive Film (ACF) method was already applied to board-to-board interconnection. In place of them, we have focused on board to board interconnection with solder bump by Si carrier, which has been used as Flip chip bonding technology. A major advantage of this technology is that the Flexible Printed Circuit (FPC) is connected in the same solder reflow process with other surface mount devices. This technology can be applied to semiconductors and electronic devices for higher functionality, integration and reliability.

• Proceedings of the KSME Conference
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• 2000.04a
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• pp.873-878
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• 2000

Semiconductor packaging technology is changed rapidly according to the trends of the micro miniaturization of multimedia and information equipment. For I/O limitation and fine pitch limitation, DIP and SOP/QFP are replaced by BGA/CSP. This is one of the surface mount technology(SMT). Solder ball is bumped n the die pad and connected onto mounting board. In ball bump formation, vacuum suction type ball alignment process is widely used, However this type has some problems such as ionization, static electricity and difficulty of fifo(first-input first-out) of solder balls. Seesaw type is reducing these problems and has a structural simplicity and economic efficiency. Ball cartridge velocity and ball aligned plate angle are Important variables to improve the ball alignment Process. In this paper, seesaw-type CSP solder ball loader is developed and the optimal velocity and plate angle are proposed.

• Journal of Welding and Joining
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• v.19 no.3
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• pp.298-304
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• 2001

Turbine blade is subject to force of three types ; the torsional force by torsional mount, the centrifugal force by the rotation of rotor and the cyclic bending force by steam pressure. The cyclic bending force was a main factor on fatigue strength. SEM fractography in root of turbine blade showed micro-clack width was not dependent on stress intensity factor range. Especially, fatigue did not exist on SEM photograph in root of turbine blade. To clear out the fracture mechanism of turbine blade, nanofractography was needed on 3-dimensional crack initiation and crack growth with high magnification. Fatigue striation partially existed on AFM photograph in root of turbine blade. Therefore, to find a fracture mechanism of the torsion-mounted blade in nuclear power plant, the relation between stress intensity factor range and surface roughness measured by AFM was estimated, and then the load amplitude ΔP applied to turbine blade was predicted exactly by root mean square roughness.

• Journal of the Korean Society for Precision Engineering
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• v.19 no.9
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• pp.151-156
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• 2002

A new position correction method using four fiducials as reference points was developed and examined. It was aimed to calibrate nonlinear deformation by numerous error sources. A correlation for correction was derived from the geometric relationship between four fiducials and chip position. Compared with three points method, it exhibited more accurate correction, especially for inner area of a quadrilateral composed of four fiducial points. Its accuracy was found to be increased as fiducials moves outwardly within a printed circuit board (PCB) and/or as they form more rectangle-like shape As for arbitrarily nonlinear deformation, this method can be applied using more than five fiducials. In this case, local-area calibration is carried out by sectioning a board area into several rectangular are as.