• Title/Summary/Keyword: Surface Adhesion

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Effects of Pretreatments of PET Substrate on the Adhesion of Copper Films Prepared by a Room Temperature ECR-MOCVD Method (PET 기질의 전처리효과가 상온 ECR 화학증착법에 의해 증착된 구리박막의 계면접착력에 미치는 영향)

  • Hyun Jin;Jeon Bupju;Byun Dongjin;Lee Joongkee
    • Korean Journal of Materials Research
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    • v.14 no.3
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    • pp.203-210
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    • 2004
  • Effects of various pretreatments on the adhesion of copper-coated polymer films were investigated. Copper-coated polymer films were prepared by an electron cyclotron resonance-metal organic chemical vapor deposition (ECR-MOCVD) coupled with a DC bias system at room temperature. PET(polyethylene terephthalate) film was employed as a substrate material and it was pretreated by industrially feasible methods such as chromic acid, sand-blasting, oxygen plasma and ion-implantation treatment. Surface characterization of the copper-coated polymer film was carried out by AFM(Atomic Force Microscopy) and FESEM(Field Emission Scanning Electron Microscopy). Surface energy was calculated by based on the value of the contact angle measured. The adhesion of copper/PET films was determined by a pull-off test according to ASTM D-5179. It was found that suitable pretreatment of the PET substrate was required for obtaining good adhesion property between copper films and the substrate. In this study the highest adhesion was observed in sand-blasting, and then followed by those of acid and oxygen plasma treatment. However, the effect of surface energy was insignificant in our experimental range. This is probably due to compensating the difference in surface energy from various pretreatments by exposing substrate to ECR plasma for 5 min or longer at the early stage of the copper deposition. Therefore, it can be concluded that surface roughness of the polymer substrate plays an important role to determine the adhesion of copper-coated polymer for the deposition of copper by ECR-MOCVD.

Adhesion Characteristics of Polymer Material Treated by Atmospheric Pressure Plasma (상압 플라즈마 표면처리에 의한 고분자 재질의 접착특성 변화)

  • Seo, Seung-Ho;Chang, Sung-Hwan;Yoo, Yeoung-Een;Chung, Jae-Dong
    • Transactions of the Korean Society of Mechanical Engineers B
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    • v.35 no.5
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    • pp.445-450
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    • 2011
  • We studied the adhesion characteristics of polymer films (PC, PET, EVA) treated by atmospheric pressure plasma. The process parameters were the frequency, gas flow, and treatment time; we studied the effects of these parameters on the adhesion characteristics of the polymer materials. We used de-ionized water and diiodomethane as the polar and nonpolar solvents, respectively, for measuring the contact angles, and subsequently calculated the surface free energy of each polymer film. The adhesion characteristics were studied by carrying out a $180^{\circ}$ peel-off test. The polymer films treated with plasma developed a hydrophilic surface, which led to increased surface free energy and improved adhesion properties. From the results for contact angle, surface free energy, and adhesion strength, we obtained the optimal plasma-treatment conditions.

Surface Modification Effect and Mechanical Property of para-Aramid Fiber by Low-temperature Plasma Treatment (저온 플라즈마 처리를 이용한 파라 아라미드 섬유의 표면 개질 효과 및 역학적 특성)

  • Park, Sung-Min;Kwon, Il-Jun;Kim, Myung-Soon;Kim, Sam-Soo;Choi, Jae-Young;Yeum, Jeong-Hyun
    • Textile Coloration and Finishing
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    • v.24 no.2
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    • pp.131-137
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    • 2012
  • para-Aramid fibers were treated by low-temperature plasma to improve the adhesion. The surface of para-aramid fibers were treated with gaseous plasma of several discharge power and treatment time in oxygen gas at 1Torr pressure. The treated fibers at low-temperature plasma were taken oxygen-containing functional groups and micro-crator on the surface. The modified fibers were measured by dynamic contact angle analyzer and XPS(X-ray photoelectron spectroscopy). The Interfacial adhesion properties of aramid fabric and polyurethane resin were determined by T-peel test. The surface of aramid fibers were observed by FE-SEM photographs. It was found that surface modification and chemical component ratio of the aramid fibers were improved wettability and adhesion characterization.

Copper Electroplating on Mg Alloy in Pyrophosphate Solution

  • Van Phuong, Nguyen;Moon, Sungmo
    • Proceedings of the Korean Institute of Surface Engineering Conference
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    • 2016.11a
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    • pp.124.1-124.1
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    • 2016
  • In this work, uniform thickness and good adhesion of electrodeposited copper layer were achieved on AZ91 Mg alloy in alkaline noncyanide copper solution containing pyrophosphate ion by employing appropriate zincate pretreatment. Without zincate pretreatment, the electrodeposited copper layer on AZ91 Mg alloy was porous and showed poor adhesion which was explained by small number of nucleation sites of copper due to rapid dissolution of the magnesium substrate in the pyrophosphate solution. The zincate pretreatment was found as one of the most important steps that can form a conducting layer to cover AZ91 surface which decreased the dissolution rate of AZ91 Mg alloy about 40 times in the copper pyrophosphate solution. Electrodeposited copper layer on AZ91 Mg alloy after an appropriate zincate pretreatment showed good adhesion and uniform thickness with bright surface appearance, independent of the deposition time but the surface roughness of the electrodeposited copper layer increased with increasing Cu deposition time.

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Investigation of Adhesion Mechanism at the Metal-Organic Interface Modified by Plasma Part I

  • Sun, Yong-Bin
    • Journal of the Microelectronics and Packaging Society
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    • v.9 no.4
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    • pp.31-34
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    • 2002
  • For the mold die sticking mechanism, the major explanation is that the silica as a filler in EMC (epoxy molding compound) wears die surface to be roughened, which results in increase of adhesion strength. As the sticking behavior, however, showed strong dependency on the EMC models based on the experimental results from different semiconductor manufacturers, chemisorption or acid-base interaction is apt to be also functioning as major mechanisms. In this investigation, the plasma source ion implantation (PSII) using $O_2, N_2$, and $CF_4$ modifies sample surface to form a new dense layer and improve surface hardness, and change metal surface condition from hydrophilic to hydrophobic or vice versa. Through surface energy quantification by measuring contact angle and surface ion coupling state analysis by Auger, major governing mechanism for sticking issue was figured out to be a complex of mechanical and chemical factors.

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Evaluation of physical properties of Zn-Al metal coating according to arc metal spray surface treatment method (아크 금속 용사 표면 처리 방법에 따른 Zn-Al 금속 용사 피막의 물리적 특성 평가)

  • Jang, Jong-Min;Kim, Yeung-Kwan;Lee, Han-Seung
    • Proceedings of the Korean Institute of Building Construction Conference
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    • 2022.11a
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    • pp.89-90
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    • 2022
  • Arc metal spraying is a widely used method for improving the performance of construction structures such as corrosion resistance and electromagnetic wave shielding. However, when arc metal spraying is applied to a concrete structure, adhesion performance may deteriorate. Therefore, the effect of each surface treatment method on the physical properties between the arc metal spray coating and concrete was reviewed by evaluating the deposition efficiency and adhesion performance according to the arc metal spray surface treatment method (surface reinforcing agent, roughening agent, and sealing agent). As a result, it is suggested as an optimal surface treatment condition to induce non-interface failure by using a roughening agent and to improve the properties of concrete and metal coatings by applying a surface reinforcing agent and sealing agent.

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Surface Modification Effect and Mechanical Property of para-aramid Fiber by Low-temperature Plasma Treatment (저온 플라즈마 처리를 이용한 파라 아라미드 섬유의 표면 개질 효과 및 역학적 특성(2))

  • Park, Sung-Min;Son, Hyun-Sik;Sim, Ji-Hyun;Kim, Joo-Young;Kim, Taekyeong;Bae, Jin-Seok
    • Textile Coloration and Finishing
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    • v.27 no.1
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    • pp.18-26
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    • 2015
  • para-aramid fibers were treated by atmosphere air plasma to improve the interfacial adhesion. The wettability of plasma-treated aramid fiber was observed by means of dynamic contact angle surface free energy measurement. Surface roughness were investigated with the help of scanning electron microscopy and atomic force microscopy. The tensile test of aramid fiber roving was carried out to determine the effect of plasma surface treatments on the mechanical properties of the fibers. A pull-out force test was carried out to observe the interfacial adhesion effect with matrix material. It was found that surface modification and a chemical component ratio of the aramid fibers improved wettability and adhesion characterization. After oxygen plasma, it was indicated that modified the surface roughness of aramid fiber increased mechanical interlocking between the fiber surface and vinylester resin. Consequently the oxygen plasma treatment is able to improve fiber-matrix adhesion through excited functional group and etching effect on fiber surface.

Numerical Study on Multiphase Flows Induced by Wall Adhesion (벽면부착에 의해 야기되는 다상유동에 관한 수치적 연구)

  • Myong, Hyon-Kook
    • Transactions of the Korean Society of Mechanical Engineers B
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    • v.36 no.7
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    • pp.721-730
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    • 2012
  • The present paper presents a numerical study on multiphase flows induced by wall adhesion. The continuum surface force (CSF) model with the wall adhesion boundary condition model is used for calculating the surface tension force; this model is implemented in an in-house solution code (PowerCFD). The present method (code) employs an unstructured cell-centered method based on a conservative pressure-based finite-volume method with a volume capturing method (CICSAM) in a volume of fluid (VOF) scheme for phase interface capturing. The effects of wall adhesion are then numerically simulated by using the present method for a shallow pool of water located at the bottom of a cylindrical tank with no external forces such as gravity. Two different cases are computed, one in which the water wets the wall and one in which the water does not wet the wall. It is found that the present method efficiently simulates the surface tension-dominant multiphase flows induced by wall adhesion.

A Study of Minute Particles' Adhesion on a Rough Surface for a Cryogenic $CO_2$ Cleaning Process (극저온 $CO_2$ 세정공정을 위한 거친표면 위 미세입자의 점착특성 연구)

  • Seok, Jong-Won;Lee, Seong-Hoon;Kim, Pil-Kee
    • Journal of the Semiconductor & Display Technology
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    • v.9 no.1
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    • pp.5-10
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    • 2010
  • Among a variety of cleaning processes, the cryogenic carbon dioxide ($CO_2$) cleaning has merits because it is highly efficient in removing very fine particles, innoxious to humans and does not produce residuals after the cleaning, which enables us to extend its area of coverage in the semi-conductor fabrication society. However, the cryogenic carbon dioxide cleaning method has some technical research issues in aspect to particles' adhesion and removal. To resolve these issues, performing an analysis for the identification of particle adhesion mechanism is needed. In this study, a research was performed by a theoretical approach. To this end, we extended the G-T (Greenwood-Tripp) model by applying the JKR (Johnson-Kendall-Roberts) and Lennard-Jones potential theories and the statistical characteristics of rough surface to investigate and identify the contact, adhesion and deformation mechanisms of soft or hard particles on the rough substrate. The statistical characteristics of the rough surface were taken into account through the employment of the normal probability distribution function of the asperity peaks on the substrate surface. The effects of surface roughness on the pull-off force for these particles were examined and discussed.