• 제목/요약/키워드: Substrate removal rate

검색결과 159건 처리시간 0.029초

Effect of Free Abrasives on Material Removal in Lap Grinding of Sapphire Substrate

  • Seo, Junyoung;Kim, Taekyoung;Lee, Hyunseop
    • Tribology and Lubricants
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    • 제34권6호
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    • pp.209-216
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    • 2018
  • Sapphire is a substrate material that is widely used in optical and electronic devices. However, the processing of sapphire into a substrate takes a long time owing to its high hardness and chemical inertness. In order to process the sapphire ingot into a substrate, ingot growth, multiwire sawing, lapping, and polishing are required. The lap grinding process using pellets is known as one of the ways to improve the efficiency of sapphire substrate processing. The lap grinding process ensures high processing efficiency while utilizing two-body abrasion, unlike the lapping process which utilizes three-body abrasion by particles. However, the lap grinding process has a high material removal rate (MRR), while its weakness is in obtaining the required surface roughness for the final polishing process. In this study, we examine the effects of free abrasives in lap grinding on the material removal characteristics of sapphire substrate. Before conducting the lap grinding experiments, it was confirmed that the addition of free abrasives changed the friction force through the pin-on-disk wear test. The MRR and roughness reduction rate are experimentally studied to verify the effects of free abrasive concentration on deionized water. The addition of free abrasives (colloidal silica) in the lap grinding process can improve surface roughness by three-body abrasion along with two-body abrasion by diamond grits.

미세조류의 Methane 발효특성

  • 강창민;최명락
    • 한국미생물·생명공학회지
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    • 제24권5호
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    • pp.597-603
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    • 1996
  • This study was carried out to examine degradation characteristics of microalgae Chlorella vulgaris in methane fermentation. We measured COD and VS reduction, gas and methane productivity, VFA (volatile fatty acid), respectively. Then we calculated material balance and hydrolysis rates in soluble and solid material. The substrate concentration was controlled from 14 gCOD$_{cr}$/l to 64 gCOD$_{cr}$/l in batch cultures, and HRT (hydraulic retention time) controlled from 2 days to 30 days in continuous experi- ments. The results were as follows. In batch culture, accumulated gas productivity increased with the increase of the substrate concentration. The SS and VSS was removed all about 30% increase of substrate concentration and the most of the degradable material removed during the first 10 days. The curve of gas and methane production rate straightly increased until substrate concentration is 26 gCOD$_{cr}$/l. In continuous culture experiments, the removal rates at HRT 10days were 20% for total COD and TOC, respectively. At longer HRT, there was no increase in the removal efficiency. At HRT 15 days, the removal rates were 30% for SS and VSS, respectively. Soluble organic materials were rapidly degraded, and so there was no accumulated. Soluble COD concentration was not increase regardless of HRT-increasing. That meaned the hydrolysis was one of the rate-limiting stage of methane fermentation. The first-order rate constants of hydrolysis were 0.23-0.28 day$^{-1}$ for VSS, and 0.07-0.08 day$^{-1}$ for COD.

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사파이어 화학기계적 연마에서 결정 방향이 재료제거 특성에 미치는 영향 (Effect of Crystal Orientation on Material Removal Characteristics in Sapphire Chemical Mechanical Polishing)

  • 이상진;이상직;김형재;박철진;손근용
    • Tribology and Lubricants
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    • 제33권3호
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    • pp.106-111
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    • 2017
  • Sapphire is an anisotropic material with excellent physical and chemical properties and is used as a substrate material in various fields such as LED (light emitting diode), power semiconductor, superconductor, sensor, and optical devices. Sapphire is processed into the final substrate through multi-wire saw, double-side lapping, heat treatment, diamond mechanical polishing, and chemical mechanical polishing. Among these, chemical mechanical polishing is the key process that determines the final surface quality of the substrate. Recent studies have reported that the material removal characteristics during chemical mechanical polishing changes according to the crystal orientations, however, detailed analysis of this phenomenon has not reported. In this work, we carried out chemical mechanical polishing of C(0001), R($1{\bar{1}}02$), and A($11{\bar{2}}0$) substrates with different sapphire crystal planes, and analyzed the effect of crystal orientation on the material removal characteristics and their correlations. We measured the material removal rate and frictional force to determine the material removal phenomenon, and performed nano-indentation to evaluate the material characteristics before and after the reaction. Our findings show that the material removal rate and frictional force depend on the crystal orientation, and the chemical reaction between the sapphire substrate and the slurry accelerates the material removal rate during chemical mechanical polishing.

생물막 유동층 반응기에서 미생물 성상에 따른 속도론적 고찰 (A Kinetic Study with Biomass Characteristics in Fluidized-Bed Biofilm Reactor.)

  • 김동석;안갑환이민규송승구
    • KSBB Journal
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    • 제6권2호
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    • pp.115-121
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    • 1991
  • 본 연구의 목적은 생물막 유동층 반응기내에서 높은 유기물 부하를 처리하는데 있어 지지체에 부착된 미생울의 특성과 유기물의 처리효율을 조사하는데 있다. 실험은 글루코오즈를 주 기질로 한 합성폐수를 이용하여, 상향유속은 0.47cm / sec, 체류시간을 5시간, 운전 온도는 $22{\pm}1{\circ}C$, pH는 $7{\pm}0.1$로 일정하게 하고 유기물 부하를 $10kgCOD\;/\;{\textrm{m}^3}$.day에서 $80kgCOD\;/\;{\textrm{m}^3}$.day로 증가시켰을 때, 각각 95%, 73%의 높은 COD 처리효율을 얻었다. 고정 생물막 반응기에 사용된 Andrew의 유기물 제거율 모델을 본 생물막 유동층 반응기에 적용시켜본 결과, 실제 유기물 제거율과 예측한 유기물 제거율은 85% 정도로 일치하였다.

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염화칼륨 농도에 따른 사파이어 기판 CMP에 관한 연구 (Study on Effect of KCl Concentration on Removal Rate in Chemical Mechanical Polishing of Sapphire)

  • 박철진;김형재;정해도
    • Tribology and Lubricants
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    • 제33권5호
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    • pp.228-233
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    • 2017
  • Chemical Mechanical Polishing of chemically stable sapphire substrates is dominantly affected by the mechanical processing of abrasives, in terms of the material removal rate. In this study, we investigated the effect of electrostatic force between the abrasives and substrate, on the polishing. If potassium chloride (KCl) is added to slurry, water molecules are decomposed into $H^+$ and $OH^-$ ions, and the amount of ions in the slurry changes. The zeta potential of the abrasives decreases with an increase in the amount of $H^+$ ions in the stern layer; consequently, the electrostatic force between the abrasives and substrate decreases. The change in zeta potential of abrasives in the slurry is affected by the slurry pH. In acidic zones, the amount of ions bound to the abrasives increases if the amount of $H^+$ ions is increased by adding KCl. However, in basic zones, there is no change in the corresponding amount. In acidic zones, zeta potential decreases as molar concentration of potassium increases; however, it does not change significantly in basic zones. The removal rate tends to decrease with increase in molar amount of potassium in acidic zones, where zeta potential changes significantly. However, in basic zones, the removal rate does not change with zeta potential. The tendencies of zeta potential and that of the frictional force generated during polishing show strong correlation. Through experiments, it is confirmed that the contact probability of abrasives changes according to the electrostatic force generated between the abrasives and substrate, and variation in removal rate.

외부탄소원을 사용한 SBBR의 공정 특성 및 질소제거 (Evaluation of SBBR Process Performance Focused on Nitrogen Removal with External Carbon Addition)

  • 한혜정;윤주환
    • 한국물환경학회지
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    • 제22권3호
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    • pp.566-571
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    • 2006
  • A sequencing batch biofilm reactor (SBBR) operated with a cycle of anaerobic - aerobic - anoxic - aerobic has been evaluated for the nutrient removal characteristics. The sponge-like moving media was filled to about 10% of reactor volume. The sewage was the major substrate while external synthetic carbon substrate was added to the anoxic stage to enhance the nitrogen removal. The operational results indicated that maximum T-N and T-P removal efficiencies were 97% and 94%, respectively were achieved, while COD removal of 92%. The observations of significant nitrogen removal in the first aerobic stage indicated that nitrogen removal behaviour in this SBBR was different to conventional SBR. Although the reasons for aerobic nitrogen removal has speculated to either simultaneous nitrification and denitrification or anoxic denitrification inside of the media, further researches are required to confirm the observation. The specific oxygen uptake rate (SOUR) test with biofilm and suspended growth sludge indicated that biofilm in SBBR played a major role to remove substrates.

펨토초 레이저를 이용한 플렉시블 ITO 패터닝 연구 (Femtosecond laser pattering of ITO film on flexible substrate)

  • 손익부;김영섭;노영철
    • 한국레이저가공학회지
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    • 제13권1호
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    • pp.11-15
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    • 2010
  • Indium tin oxide (ITO) provides high electrical conductivity and transparency in the visible and near IR (infrared) wavelengths. Thus, it is widely used as a transparent electrode for the fabrication of liquid crystal displays (LCDs) and organic light emitting diode displays (OLRDs), photovoltaic devices, and other optical applications. Lasers have been used for removing coating on polymer substrate for flexible display and electronic industry. In selective removal of ITO layer, laser wavelength, pulse energy, scan speed, and the repetition rate of pulses determine conditions, which are efficient for removal of ITO coating without affecting properties of the polymer substrate. ITO coating removal with a laser is more environmentally friendly than other conventional etching methods. In this paper, pattering of ITO film from polymer substrates is described. The Yb:KGW femtosecond laser processing system with a pulse duration of 250fs, a wavelength of 1030nm and a repetition rate of 100kHz was used for removing ITO coating in air. We can remove the ITO coating using a scanner system with various pulse energies and scan speeds. We observed that the amount of debris is minimal through an optical and a confocal microscope, and femtosecond laser pulses with 1030nm wavelength are effective to remove ITO coating without the polymer substrate ablation.

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이단미생물반응조에서 혼합 VOCs의 생분해 특성 (Biological Removal of a VOC Mixture in a Two-stage Bioreactor)

  • 송지현
    • 한국대기환경학회지
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    • 제22권6호
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    • pp.758-766
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    • 2006
  • A two-stage bioreactor, which consists of a biotrickling filter module and a biofilter module in series, was investigated for the enhanced treatment of a VOC mixture, toluene and methyl ethyl ketone (MEK). Throughout the experiments, the overall inlet loading rate was maintained at approximately $43g/m^3/hr$, but the inlet ratios of the VOCs were modified. The experimental results showed that the different ratios of the VOC mixture resulted in changes of overall removal efficiencies, elimination capacities (ECs) and microbial accumulation on the surface of each packing material. The ratio of inlet toluene to MEK at 50 : 150 was found to be most effective in terms of the overall removal efficiency, because, at this condition, MEK (i.e., the hydrophilic compound) was mostly removed in the biotrickling filter module and the following biofilter module was used to remove toluene. It was also found that when the inlet loading rate of the VOC mixture was serially increased stepwise within short-term periods, the ECs for toluene dropped significantly but the ECs for MEK increased at the ratio of the VOC mixture. These results implied that substrate interaction and/or substrate preferable utilization might have an effect on the biological removal of each compound in the two-stage bioreactor; therefore, the bioreactor should be operated in the condition where the substrate interaction could be minimized in order to maximize overall performance of the two-stage bioreactor.

엔통형 고정상 생물막법에 의한 고농도 유기성 폐수처리에 관한 연구 (A Study on the Treatment of a High-Strength Organic Wastewater by the Tube Type Fixed Biofilter Process)

  • 손종렬;장명배;문경환
    • 한국환경보건학회지
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    • 제20권2호
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    • pp.22-27
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    • 1994
  • This study is to discuss the factors influenced on the removal efficiency of a high-strength organic wastewaters investigated using the polypropyrene media which appropriate to attach microorganism in the tube type fixed biofilter reactor. The results obtained in the experiment were as follows: 1. The kinetics of reaction rate (k') were 0.125, 0.135, 0.155 varing initial COD 720, 1280, 1630 mg/l in batch reactor. 2. In the range of pH 4.0 ~12.0 was obtained the removal efficiency of COD higher than 85%. It was proved that variation of pH (4.0 ~12.0) was nothing to do with the removal efficiency of substrate in continuous reactor. 3. Temperature to obtain removal efficiency of COD higher than 85% was 10 ~ 40$\circ$C. Removal efficiency of COD was no less than those at high temperature. 4. In the continuous reactor, the volumetric loading of COD for removal efficiency higher than 95% had to be 0.5~1.5 kg COD/m$^3$.d below. And then the HRT was 8 hrs. 5. In comparison with the activated sludge process, the tube type fixed biofilter process was excellent in removal efficiency of substrate and sludge production rate.

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UV/O2 가스상 세정을 이용한 실리콘 웨이퍼상의 PEG 반응기구의 관찰 (Investigation of PEG(polyethyleneglycol) Removal Mechanism during UV/O2 Gas Phase Cleaning for Silicon Technology)

  • 권성구;김도현;김기동;이승헌
    • 한국전기전자재료학회논문지
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    • 제19권11호
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    • pp.985-993
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    • 2006
  • An experiment to find out the removal mechanism of PEG(polyethyleneglycol) by using UV-enhanced $O_2$ GPC (gas phase cleaning) at low substrate temperature below $200^{\circ}C$ was executed under various process conditions, such as substrate temperature, UV exposure, and $O_2$ gas. The possibility of using $UV/O_2$ GPC as a low-temperature in-situ cleaning tool for organic removal was confirmed by the removal of a PEG film with a thickness of about 200 nm within 150 sec at a substrate temperature of $200^{\circ}C$. Synergistic effects by combining photo-dissociation and photo oxidation can only remove the entire PEG film without residues within experimental splits. In $UV/O_2$ GPC with substrate temperatures higher than the glass transition temperature, the substantial increase in the PEG removal rate can be explained by surface-wave formation. The photo-dissociation of PEG film by UV exposure results in the formation of end aldehyde by dissociation of back-bone chain and direct decomposition of light molecules. The role of oxygen is forming peroxide radicals and/or terminating the dis-proportionation reaction by forming peroxide.