• 제목/요약/키워드: Substrate loss

검색결과 803건 처리시간 0.026초

High Performance RF Passive Integration on a Si Smart Substrate for Wireless Applications

  • Kim, Dong-Wook;Jeong, In-Ho;Lee, Jung-Soo;Kwon, Young-Se
    • ETRI Journal
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    • 제25권2호
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    • pp.65-72
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    • 2003
  • To achieve cost and size reductions, we developed a low cost manufacturing technology for RF substrates and a high performance passive process technology for RF integrated passive devices (IPDs). The fabricated substrate is a conventional 6" Si wafer with a 25${\mu}m$ thick $SiO_2$ surface. This substrate showed a very good insertion loss of 0.03 dB/mm at 4 GHz, including the conductive metal loss, with a 50 ${\Omega}$ coplanar transmission line (W=50${\mu}m$, G=20${\mu}m$). Using benzo cyclo butene (BCB) interlayers and a 10 ${\mu}m$ Cu plating process, we made high Q rectangular and circular spiral inductors on Si that had record maximum quality factors of more than 100. The fabricated inductor library showed a maximum quality factor range of 30-120, depending on geometrical parameters and inductance values of 0.35-35 nH. We also fabricated small RF IPDs on a thick oxide Si substrate for use in handheld phone applications, such as antenna switch modules or front end modules, and high-speed wireless LAN applications. The chip sizes of the wafer-level-packaged RF IPDs and wire-bondable RF IPDs were 1.0-1.5$mm^2$ and 0.8-1.0$mm^2$, respectively. They showed very good insertion loss and RF performances. These substrate and passive process technologies will be widely utilized in hand-held RF modules and systems requiring low cost solutions and strict volumetric efficiencies.

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LTCC 기판 시스템의 고주파 특성 비교 (A Comparison of High Frequency Properties of LTCC Substrate Systems)

  • 이영신;김경철;박성대;박종철
    • 마이크로전자및패키징학회지
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    • 제9권3호
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    • pp.7-12
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    • 2002
  • LTCC(Low temperature Cofiring Ceramics)기판의 고주파특성 평가에 있어서, 기판은 전극 패터닝 공정 방식이 결합된 하나의 시스템으로 평가되어야 한다. LTCC의 경우 시스템마다 상이한 소결 수축 과정, 전극과 기판의 접합 특성(matching) 차이, 사용 도체간 전기 전도도의 차이 등으로 인해 유전 특성 및 신호손실이 차이를 나타내었다. 본 논문에서는 FR-4, Duroid, Teflon등 기존의 상용 PCB(Printed Circuit Board) 와의 상대적인 비교를 통해 현재 사용되고 있는 LTCC 기판의 주파수 응용도를 확인하였으며, 20 ㎓까지 측정을 수행하였다. 측정방식으로는 Ring 공진기와 Series-Gap 공진기를 활용한 마이크로 스트립 공진기 방법을 채택하였으며, 실험 결과 기판손실 측정은 Ring 공진기 방식이 유효하였으며 유전률 측정은 Series-Gap 공진기 방식이 유효함을 확인하였다. 또한 주파수 증가에 따라 LTCC 기판의 전극 패터닝 방식이 시스템의 손실에 미치는 영향에 대해 분석하였다.

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기판온도에 따른 (Ba,Sr)TiO$_3$ 박막의 구조와 유전특성 (The Structure and Dielectric Properties of the (Ba,Sr)TiO$_3$ Thin Films with the Substrate Temperature)

  • 이상철;이문기;이영희
    • 대한전기학회논문지:전기물성ㆍ응용부문C
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    • 제49권11호
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    • pp.603-608
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    • 2000
  • $(Ba, Sr)TiO_{3}$[BST] thin films were fabricated on the Pt/TiO$_2$/SiO$_2$/Si substrate by the RF sputtering. The structure and dielectric properties of the BST thin films with the substrate temperature were investigated. Increasing the substrate temperature, The BST phase increased and barium multi titanate phases decreased. Increasing the frequency, the dielectric constant decreased and the dielectric loss increased. The dielectric constant and dielectric loss of the BST thin films deposited at 50$0^{\circ}C$ were 300 and 0.018, respectively at 1 kHz. The leakage current density of the BST thin films deposited at 50$0^{\circ}C$ was $10^{-9}$ A/$\textrm{cm}^2$ with applied voltage of 3V. Because of the high dielectric constant(300), low dielectric loss(0.018) and low leakage current($10^{-9}$ A/$\textrm{cm}^2$), BST thin films deposited at 50$0^{\circ}C$ is expecting for the application of DRAM.

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Design and Development of an Ultralow Optical Loss Mirror Coating for Zerodur Substrate

  • Cho, Hyun-Ju;Lee, Jae-Cheul;Lee, Sang-Hyun
    • Journal of the Optical Society of Korea
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    • 제16권1호
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    • pp.80-84
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    • 2012
  • A high reflectance mirror, which has very low absorption and scattering loss, was coated onto a crystalline substrate by ion beam sputtering and then annealed at $450^{\circ}C$. We carefully selected the mirror coating material, and designed the high reflectance mirror, in order to avoid UV degradation which comes from the He-Ne plasma. We measured the surface roughness of the Zerodur substrate using phase shift interferometry and atomic force microscopy, and compared it with the TIS scattering of the mirror. The cavity ring-down method was used to measure the absorption of the mirror, and the thin film structure was correlated to its results. We also compared the optical properties of coated mirrors before and after annealing.

해양환경 중에서 Ni-Cr 용사피복재의 침식-부식 억제에 관한 연구 (Study on the Control of the Erosion-Corrosion for Ni-Cr Alloy Sprayed Coating in the Marine Environment)

  • 임우조;이상열;윤병두
    • 수산해양교육연구
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    • 제11권2호
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    • pp.139-149
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    • 1999
  • Thermal sprayed Ni-Cr alloy coating on the carbon steel was carried out erosion-corrosion test and electrochemical corrosion test in the marine environment. The erosion-corrosion behavior and electrochemical corrosion characteristics of substrate(SS400) and thermal sprayed Ni-Cr coating was investigated. The erosion-corrosion control efficiency of Ni-Cr coating to substrate was also estimated quantitatively. The main results obtained are as follows : 1) The weight loss rate of Ni-Cr coating layer by the erosion-corrosion compared with substrate was smaller. With the lapse of time, the weight loss rate of substrate was linearly increased in $25{\Omega}{\cdot}cm$ solution, but that of Ni-Cr coating became stable. 2) The corrosion potential of substrate became less noble than that of Ni-Cr coating layer, and the corrosion current density of Ni-Cr coating became lower than that of substrate. 3) The control efficiency of erosion-corrosion of Ni-Cr coating compared to substrate became more dull than that of corrosion in $25{\Omega}{\cdot}cm$ and $5000{\Omega}{\cdot}cm$ solution.

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직접 가열 방식을 이용한 반도체 제조용 히팅 장치 (A Heating Apparatus for Semiconductor Manufacturing using Direct Heating Method)

  • 정순원;구경완
    • 전기학회논문지P
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    • 제57권4호
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    • pp.408-411
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    • 2008
  • As to this research is new structure of the semiconductor substrate heating apparatus. The fast thermoresponsive according to the direct heating structure of the heating plate layer adhering closely to the floor side of a substrate and the fast heat loss minimization can be accomplished. Moreover, the contact area of the sheath heater, which is the heating plate layer built-in heating apparatus, is increased, so that it has more heating valid area. For this, it adheres closely to the substrate, in which the photosensitive film is coated and the heating plate layer, adhering closely to the floor side of a substrate the mica layer which adheres closely to the floor side of the upper heating plate layer in order to minimize an insulation and heat loss, and the lower part of the mica layer and it is comprised of the floor plate layer. The heating plate layer forms the continued groove portion over the floor side whole. The sheath heater for heating a substrate is inserted with the groove portion and the heating plate layer is comprised. It is confirmed that by using the new substrate heating structure, the temperature change of the heating plate against the time is observed. Then, there is the electric power saving effect of about 40% in comparison with the existing method.

마이크로파 가변 소자용 K-band Coplanar Stripline 공진기 설계 (K-band Coplanar Stripline Resonator for Microwave Tunable Devices)

  • 강종윤;윤석진;김현재
    • 한국전기전자재료학회논문지
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    • 제18권6호
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    • pp.532-537
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    • 2005
  • In order to develop a tunable resonator which can be easily operated by DC bias and applied for microwave tunable filters and devices using ferroelectric thin or thick films, the non conductor backed-and conductor backed- coplanar stripline resonators have been designed and analyzed. They have been designed to be operated at 25 GHz which involve coplanar stripline input and output ports. The resonators have been simulated and analyzed using Ansoft HFSS. The research has been focused on the Quality factor of the coplanar stripline resonator. The conductor Q, box Q, and radiation Q of the resonators have been analyzed and calculated according to the substrate thickness & conductor width of the resonators. From these parameters, the loss factors of the coplanar stripline resonator have been investigated. The conducting Q of the coplanar stripline resonator has no relation with the thickness of dielectric substrate and increases as the conductor width increases. The box Q has no much relation with the thickness of substrate and the conductor width, which is above 2000. The radiation loss increases as the thickness of substrate and the conductor width increase. To decrease the radiation loss of the coplanar stripline resonator, a conductor backed coplanar stripline resonator has been proposed which has the unloaded Q of 170.

Spurious Suppressed Substrate Integrated Waveguide Bandpass Filter Using Stepped-Impedance Resonator

  • Lee, Il-Woo;Nam, Hee;Yun, Tae-Soon;Lee, Jong-Chul
    • Journal of electromagnetic engineering and science
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    • 제10권1호
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    • pp.1-5
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    • 2010
  • A spurious suppressed bandpass filter is proposed and discussed using the stepped impedance resonator(SIR) on a substrate-integrated waveguide(SIW) structure with a double-layer substrate. The second resonance of the fundamental $TE_{10}$ mode can be controlled by adjusting the electrical length and impedance ratio of each SIR. The spurious suppressed SIW bandpass filter shows the measurement results of the insertion loss of 3.98 dB and return loss of less than 11.58 dB at the center frequency of 12 GHz. Also, the second spurious frequency is improved to about $1.5f_0$ compared with $1.33f_0$.

A New Planar Spiral Inductor with Multi-layered Bragg Reflector for Si-Based RFIC's

  • Mai Linh;Lee Jae-Young;Le Minh-Tuan;Pham Van-Su;Yoon Gi-Wan
    • Journal of information and communication convergence engineering
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    • 제4권2호
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    • pp.88-91
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    • 2006
  • In this paper, a novel physical structure for planar spiral inductors is proposed. The spiral inductors were designed and fabricated on multi-layered substrate Bragg-reflector/silicon (BR/Si) wafer. The impacts of multi-layered structure substrate and pattern on characteristics of inductor were studied. Experimental results show that the inductor embedded on Bragg reflector/silicon substrate can achieve the best improvement. At 0.4-1.6 GHz, the Bragg reflector seems to significantly increase the S11-parameter of the inductor.

A New Planar Spiral Inductor with Multi-layered Bragg Reflector for Si-Based RF IC's

  • Linh Mai;Lee Jae-Young;Tuan Le Minh;Su Pham Van;Yoon Gi-Wan
    • 한국정보통신학회:학술대회논문집
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    • 한국해양정보통신학회 2006년도 춘계종합학술대회
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    • pp.255-258
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    • 2006
  • In this paper, a novel physical structure for planar spiral inductors is proposed. The spiral inductors were designed and fabricated on multi-layered substrate Bragg-reflector/silicon (BR/Si) wafer. The impacts of multi-layered structure substrate and pattern on characteristics of inductor were studied. Experimental results show that the inductor embedded on Bragg reflector/silicon substrate can achieve the best improvement. At 0.4-1.6 GHz, the Bragg reflector seems to significantly increase the $S_{11}-parameter$ of the inductor.

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