• Korean Journal of Metals and Materials
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• v.48 no.12
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• pp.1116-1122
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• 2010

Metal interconnections of multilayer Al/Ni and TiW/seed-Ni/Ni were formed on glass, and the adhesion strength and nanoindentation response of the composite layers were evaluated. The Al/Ni multilayer was formed by an anodic bonding of glass to Al and subsequent electroless plating of Ni, while the TiW/Ni multilayer was fabricated by sputter deposition of TiW and seed-Ni onto glass and electroless plating of Ni. Because of the diffusion of aluminum into glass during the anodic bonding, anodically bonded glass/Al joint exhibited greater interfacial strength than the sputtered glass/TiW one. The Al/Ni on glass also showed excellent resistance against delamination by bending deformation compared to the TiW/seed-Ni/Ni on glass. From the nanoindentation experiment of each metal layer on glass, it was found that the aluminum layer had extremely low hardness and elastic modulus similar to the glass substrate and played a beneficial role in the delamination resistance by lessening stress intensification at the joint. The indentation data of the multilayers also supported superior joint reliability of the Al/Ni to glass compared to that of the TiW/seed-Ni/Ni to glass.

• Korean Journal of Materials Research
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• v.14 no.10
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• pp.731-736
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• 2004

Herein, we report on the co-firing of a low-K wiring substrate and a middle-K functional substrate in LTCC. Firstly, we researched the sintering behavior and dielectric properties of the low-k wiring substrate comprised by alumina and glass frit with ${\varepsilon}_r$, of $\sim7$ and the middle-k functional substrate comprised by $Ba_{5}Nb_{4}O_{15}$ and glass frit with ${\varepsilon}_r$, of $20\sim30$. The warpage and delamination between the hetero layers of the low-K and the middle-K composition were also studied. In particular, physical matching of the hetero layers could be possible by adjusting of the sintering properties of the composition. We observed that an introduction of the glass frit to the low- and middle-K substrate gives rise to a minimization of an effect given by separation of the hetero layers, and modification of the fraction of the glass frit accompanied by a variation of the composition could control the sintering behavior and its beginning temperature. In the case of co-firing of the L03 as the low-K wiring substrate composition and the M03 as the middle-K functional substrate composition at $875^{\circ}C$, we could fabricate a desirable structure of hetero layers without any kinds of structural defects such as separation, warpage, delamination, pore trap, etc. We suppose that the co-firing techniques described in this study would provide a helpful method to fabricate a LTCC multi-functional for the next generation.

• Proceedings of the KIEE Conference
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• 2003.10a
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• pp.297-299
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• 2003

In this paper, we present the fabrication of copper electrode array and test of electrochemical discharge machining for the fabrication of microholes on Borofloat33 glass. Copper electrode array is fabricated by the bonding of silicon upper substrate and lower substrate and copper electroplate. The silicon upper electrode having microholes fabricated by ICP-RIE is the mold of copper electroplate. The lower substrate is used as the seed layer for copper electroplate after Au - Au thermocompression bonding with the upper substrate.

• Carbon letters
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• v.10 no.3
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• pp.230-233
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• 2009

In this study, a low temperature growth of high-quality carbon nanotubes on glass substrate using a local surface heating without heating damage to substrate was tried and characterized. The local joule heating was induced to only Ni/Ti metal film on glass substrate by applying voltage to the film. It was estimated that local surface joule heating method could heat the metal surface locally up to around $1200^{\circ}C$ by voltage control. We could successfully obtain high-quality carbon nanotubes grown at $300^{\circ}C$ by applying 125 V for joule heating as same as carbon nanotubes grown at $900^{\circ}C$.

• Proceedings of the KWS Conference
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• 1999.10a
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• pp.247-250
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• 1999

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2000.11a
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• pp.75-78
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• 2000

• 한국정보디스플레이학회:학술대회논문집
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• 2006.08a
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• pp.125-125
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• 2006

We present a low temperature thermal process for the transparent dielectric layer, barrier rib, and white back dielectric layer on the soda-lime glass substrate of the PDP by the $TruNano^{TM}$ processor in combination with a compositional modification to the conventional dielectric pastes. By this method the firing temperature can be lowered by more than $100^{\circ}C$.

• 한국정보디스플레이학회:학술대회논문집
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• 2000.01a
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• pp.39-40
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• 2000

STN LCDs on Plastic Film substrates for mobile communication devices have been researched and developed at KETI in KOREA. The Plastic Film substrate is so weak to heat and pressure that its fabrication process is limited to $110^{\circ}C(Tg)$. In order to maintain uniform pressure on Plastic Film substrate we used newly designed jig and fabrication process. Electro-optical characteristics are better than or equivalent to those of typical glass LCD though it is thinner, lighter-weight, and more robust than glass LCD.

• Proceedings of the IEEK Conference
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• 2000.07b
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• pp.933-936
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• 2000

N-channel poly-Si TFT, processed by Solid Phase Crystalline(SPC) on a glass substrate, has been investigated by measuring its electrical properties before and after stressing. It is observed that the threshold voltage shift due to electrical stress varies with various stress conditions. Threshold voltages measured in 1.5um and 3um poly-Si TFT’s are 3.3V, 37V respectively. With the threshold voltage shift, the degradation of transconductance and subthreshold swing is also observed.

• Journal of the Korean Ceramic Society
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• v.43 no.6 s.289
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• pp.338-343
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• 2006

The effects of lead-borosilicate glass frits on the sintering behavior and microwave dielectric properties of ceramic-glass composites were investigated as functions of glass composition of glass addition ($10{\sim}50vol%$), softening point (Ts) of the glass, and sintering temperature of the composites ($500{\sim}900^{\circ}C$ for 2 h). The addition of 50 vol% glass ensured successful sintering below $900^{\circ}C$. Sintering characteristics of the composites were well described in terms of Ts. PbO addition in to the glass enhanced the reaction with $Al_{2}O_3$ to form liquid phase and $PbAl_{2}Si_{2}O_8$, which was responsible to lower Ts. Dielectric constant(${\epsilon}_r$), $Q{\times}f_0$ and temperature coefficient of resonant frequency (${\tau}_f$) of the composite with 50 vol% glass contents ($B_{2}O_{3}:PbO:SiO_{2}:CaO:Al_{2}O_3$ = 5:40:45:5:5) demonstrated 8.5, 6,000 GHz, $-70\;ppm/^{\circ}C$, respectively, which is applicable to substrate requiring a low dielectric constant. When the same glass composition was applied sinter $MgTiO_3\;and\;TiO_2,\;at\;900^{\circ}C$ (50 vol% glass in total), the properties were 23.8, 4,000 GHz, $-65ppm/^{\circ}C$ and 31.1, 2,500 GHz, $+80ppm/^{\circ}C$ respectively, which is applicable to filter requiring an intermidiate dielectric constant.