• 한국진공학회:학술대회논문집
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• 한국진공학회 2012년도 제43회 하계 정기 학술대회 초록집
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• pp.418-418
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• 2012

Synthesis of nanocrystalline diamond powder was investigated via a gas-to-particle scheme using the hot filament chemical vapor deposition. Effect of substrate surface seeding by nano diamond powder, and that of the electrical conductance of the substrate were studied. The substrate temperature, methane content in the precursor gas, filament-substrate distance and filament temperature were $670^{\circ}C$, 5% methane in hydrogen, 10 mm and $2400^{\circ}C$, respectively. The powder formation by gas-to-particle mechanism were greatly enhanced by the substrate seeding by the nano diamond powder. It was attributed to the removal of the electrostatic force between the substrate and the seeded nano diamond particle by the thermal electron shower from the hot filament, via the depolarization of the substrate surface or the attached diamond powder and subsequent levitation into the gas phase to serve as the gas-phase nucleation site. The powder formation was greatly favoured by the conducting substrate relative to the insulating substrate, which proved the actual effect of the electric static force in the powder formation.

• 대한기계학회논문집A
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• 제30권11호
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• pp.1392-1400
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• 2006

Since the monolithic ceramic substrate was in introduced for automotive catalytic converters, the durability of the substrate has been a continuing requirement to reduce the emission, gas of vehicle. The substrate can occupy a volume as small as 82 $cm^3$ and as large as 8200 $cm^3$ to provide the required substrate for catalytic activity. The long-term durability varies with the size of the substrate from manufacture's point of view. Therefore this study presents that the response surface model using central composite design can explain size effect on the modulus of rupture in a cordierite ceramic monolithic substrate.

• 한국재료학회지
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• 제14권5호
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• pp.343-347
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• 2004

We investigated the growth feasibility of polycrystalline Si film on mica substrate for the transfer of the layer to a plastic substrate. The annealing temperature was limited up to $600^{\circ}C$ because of crack development in the mica substrate. Amorphous Si film was deposited on mica substrate by PECVD and was crystallized by furnace annealing. During the annealing, bubbles were formed at the Si/mica interface. The bubble formation was avoided by the Ar-plasma treatment before amorphous Si deposition. A uniform and clean polycrystalline Si film was obtained by coating $NiCl_2$ on the amorphous Si film and annealing at $500^{\circ}C$ for 10 h. The conventional Si lithography was possible on the mica substrate and the devices fabricated on the substrate could be transferred to a plastic substrate.

• 열처리공학회지
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• 제4권1호
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• pp.19-29
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• 1991

This study was to investigate the influence of the substrate hardness on the hardness and adhesion of TiN thin film deposited by R.F. PACVD. Although the substrate hardness changed, chemical composition, stoichiometry and structure of TiN thin film did not change. ISE index was 1.96-1.99 for the substrate and was 1.57-1.79 for TiN thin film. And ISE index of TiN thin film was inverse proportion to the substrate hardness. When the substrate hardness was low, TiN thin film had many cracks around the indentation. But as the substrate hardness increased, TiN thin film had a few cracks and the deformation was limited within indentation. In having measured the adhesion of TiN thin film by SAT, the critical load (Lc) generally increased as the substrate hardness decreased.

• 한국환경과학회지
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• 제24권9호
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• pp.1221-1231
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• 2015

The present study was conducted to find a way to recycle the coir substrate by investigating changes in its physical and chemical properties based on the number of use year. Specific gravity of unused coir substrate was $0.212g/cm^3$, while it was higher for the substrate used for 2 years. Porosity was different depending on the number of use year. The porosity of unused substrate was 51.9%, but it increased to 68.6% after used for 2 years. In general, physical and chemical properties were better in the coir substrate used for 2 years than in unused one. The number of leaves, leaf area, flesh weight and dry weight of oriental cabbage and lettuce were higher in coir substrate used for 2 years than those in unused one. Whereas, no significant difference was observed between the substrates used for one year and 2 years, indicating that the one time-used wast substrate could be recycled for cultivating vegetables. Growth of the vegetables was improved when organic fertilizer composed of complex organics with different mixing ratios was provided to the coir substrate, compared to untreated plot. The optimum mixing ratio of the wast substrate and complex organics was 2:8(v/v) for fertilization using wast coir substrate. Therefore, coir substrate generally wasted after being used for one time was reuseable by supplying organic fertilizer.

• 대한전자공학회논문지TC
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• 제46권2호
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• pp.114-125
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• 2009

정사각형 기판의 크기가 패치 안테나의 방사 특성에 미치는 영향에 대하여 연구하였다. 기판의 크기가 공진 주파수와 대역폭에 미치는 영향은 매우 작지만 방사 패턴에 미치는 영향은 매우 큼을 볼 수 있었다. 전방방사 이득과 이득이 최대가 되는 각도는 기판의 크기에 따라 거의 주기적으로 변화함을 볼 수 있었다. 전방방사 이득이 최대가 되는 변의 길이와 최소가 되는 변의 길이는 기판의 전기적 두께가 커질수록 작아짐을 볼 수 있었다. 기판의 전기적 두께가 클수록 기판 크기에 따른 전방방사 이득 변화 폭이 큼을 볼 수 있었다. 기판 크기에 따른 방사 패턴의 변화도 기판의 전기적 두께와 매우 밀접한 관계를 가짐을 볼 수 있었다.

• 마이크로전자및패키징학회지
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• 제25권4호
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• pp.129-135
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• 2018

신축성 기판은 신축성 전자소자의 신축성, 공정성, 내구성을 결정하는 매우 중요한 소재로서 신축성 전자소자를 개발함에 있어서 우선적으로 고려해야 된다. 특히 현재 사용되는 신축성 기판은 히스테리시스가 존재하여 센서 및 기타 응용에 많은 어려움이 있다. 본 연구에서는 신축성 소재 기판으로 사용되는 PDMS와 Ecoflex를 혼합한 PDMS-Ecoflex 하이브리드 신축성 기판을 제작하여 신축성과 히스테리시스 특성을 향상하고자 하였다. 인장 시험을 통하여 신축성 하이브리드 기판의 기계적 거동을 관찰하였으며, 투과도 측정을 통하여 투과도를 평가하였다. Ecoflex의 함량이 증가할수록 하이브리드 신축성 기판은 더 유연해지며, 탄성계수는 감소한다. 또한 PDMS 기판은 270% 변형률에서 파단이 발생한 반면, PDMS-Ecoflex 하이브리드 기판은 500%의 변형률까지 파단되지 않으며 우수한 신축성을 갖는 것을 알 수 있었다. 반복 인장시험에서 PDMS와 Ecoflex의 혼합비를 2:1로 제작된 기판은 히스테리시스가 발생하였다. 반면 1:1의 혼합비로 제작된 기판의 경우 50%, 100%의 변형률에서는 히스테리시스가 발생하지 않았다. 결론적으로 500% 이상의 신축성을 갖으면서 히스테리시스가 없은 기판을 제작하였다. 기판의 혼합비에 따른 광투과도 측정 결과, Ecoflex 기판의 투과도는 68.6% 이였으나, PDMS-Ecoflex 함량이 2:1, 1:1인 하이브리드 기판의 경우, 각각 78.6%, 75.4%의 투과율을 보이며, 향후 투명 신축성 기판으로서 개발 가능성을 보여주었다.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2001년도 추계 기술심포지움
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• pp.75-87
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• 2001

Three different kinds of substrate used in this study : bare Cu substrate, Ni-P/Cu substrate with a Ni-P layer thickness of $5\mu\textrm{m},$ and Au/Ni-P/Cu substrate with the Ni-P and Au layers of $0.15\mu\textrm{m}$ and $5\mu\textrm{m}$ thickness respectively. The wettability of various Sn-base solders was affected by the substrate metal finish used, i.e., nickel, gold and copper. On the Au/Ni-F/Cu substrate, Sn-base solders wet better than any of the other substrate metal finishes tested. The interfacial reaction between various substrate and Sn-base solder was investigated at $70^{\circ}C,$ $100^{\circ}C,$ $120^{\circ}C,$ $150^{\circ}C,$ $170^{\circ}C$ and $200^{\circ}C$ for reaction times ranging from 0 day to 60 day. Intermetallic phases was formed along a Sn-base solder/ various substrate interface during solid-state aging. The apparent activation energy for growth of Sn-Ag/Cu, Sn-Ag-Bi/Cu, and Sn-Bi/Cu couples were 65.4, 88.6, and 127.9 Kj/mol, respectively. After isothermal aging, the fracture surface shoved various characteristics depending on aging temperature and time, and the types of BGA pad.

• 한국재료학회지
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• 제25권9호
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• pp.487-491
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• 2015

In photovoltaic power generation where minority carrier generation via light absorption is competing against minority carrier recombination, the substrate thickness and material quality are interdependent, and appropriate combination of the two variables is important in obtaining the maximum output power generation. Medici, a two-dimensional semiconductor device simulation tool, is used to investigate the interdependency in relation to the maximum power output in front-lit Si solar cells. Qualitatively, the results indicate that a high quality substrate must be thick and that a low quality substrate must be thin in order to achieve the maximum power generation in the respective materials. The dividing point is $70{\mu}m/5{\times}10^{-6}sec$. That is, for materials with a minority carrier recombination lifetime longer than $5{\times}10^{-6}sec$, the substrate must be thicker than $70{\mu}m$, while for materials with a lifetime shorter than $5{\times}10^{-6}sec$, the substrate must be thinner than $70{\mu}m$. In substrate fabrication, the thinner the wafer, the lower the cost of material, but the higher the cost of wafer fabrication. Thus, the optimum thickness/lifetime combinations are defined in this study along with the substrate cost considerations as part of the factors to be considered in material selection.

• 한국산학기술학회논문지
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• 제14권12호
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• pp.6106-6113
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• 2013

가솔린 엔진 차량용 삼원촉매담체는 주로 코제라이트 세라믹으로 제작되는 다공성 부품으로 엔진의 혼합기가 농후한 경우 삼원촉매의 열적 내구성이 급격히 떨어져 설계 내구 수명을 제대로 만족시키지 못하고 있다. 따라서 본 연구에서는 SiC 세라믹 촉매 담체의 내구성 평가에 사용할 기계적 물성치를 유한요소해석으로 구하기 위하여 등가물성평가방법을 이용하여 SiC 세라믹 하니컴 담체의 기계적 물성치를 유한요소해석용 시험편으로 구하였다. MOR과 탄성계수는 코제라이트 세라믹 하니컴 담체에 비하여 SiC 세라믹 하니컴 담체가 최소 2배와 9.3배 정도 크게 평가되고 있어 SiC 세라믹 하니컴 담체는 코제라이트 세라믹 하니컴 담체에 비하여 높은 구조 강도를 가지고 있다.