• Journal of the Korean Society of Manufacturing Process Engineers
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• v.19 no.3
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• pp.1-7
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• 2020

Fused filament fabrication (FFF) is a process extruding and stacking materials. PLA materials are one of the most frequently used materials for FFF method of 3D printing. Polylactic acid (PLA)-based materials are among the most widely used materials for FFF-based three-dimensional (3D) printing. PLA is an eco-friendly material made using starch extracted from corn, as opposed to plastic made using conventional petroleum resin; PLA-based materials are used in various fields, such as packaging, aerospace, and medicines. However, it is important to analyze the mechanical properties of theses materials, such as elastic strength, before using them as structural materials. In this study, the reliability of PLA-based materials is assessed through an analysis of the changes in the linear elasticity of these materials under thermal degradation by applying a hyperelastic analytical model.

• Design & Manufacturing
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• v.2 no.3
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• pp.28-31
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• 2008

In recent, the demand of high-productivity injection mold is increased because of the growth of international packaging market which is induced by an increase of population. The increase of productivity leads to the large-capacity injection molding machine and peripheral devices. For solving this problem, the stack mold which is based on the exsiting machine and device has researched in advanced countries actively. In this paper, as the preliminary research of stack mold development, the stack mold which has 2 level ${\times}4$ cavity was designed and fabricated. Besides, the motion and structural analysis were performed to verify the stability of developed stack mold.

• Smart Structures and Systems
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• v.6 no.3
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• pp.309-333
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• 2010

Civil infrastructure, in both its construction and maintenance, represents the largest societal investment in this country, outside of the health care industry. Despite being the lifeline of US commerce, civil infrastructure has scarcely benefited from the latest sensor technological advances. Our future should focus on harnessing these technologies to enhance the robustness, longevity and economic viability of this vast, societal investment, in light of inherent uncertainties and their exposure to service and even extreme loadings. One of the principal means of insuring the robustness and longevity of infrastructure is to strategically deploy smart sensors in them. Therefore, the objective is to develop novel, durable, smart sensors that are especially applicable to major infrastructure and the facilities to validate their reliability and long-term functionality. In some cases, this implies the development of new sensing elements themselves, while in other cases involves innovative packaging and use of existing sensor technologies. In either case, a parallel focus will be the integration and networking of these smart sensing elements for reliable data acquisition, transmission, and fusion, within a decision-making framework targeting efficient management and maintenance of infrastructure systems. In this paper, prudent and viable sensor and health monitoring technologies have been developed and used in several large structural systems. Discussion will also include several practical bridge health monitoring applications including their design, construction, and operation of the systems.

• Korean Journal of Optics and Photonics
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• v.11 no.5
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• pp.340-346
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• 2000

Traveling wave type semiconductor optical amplifiers integrated with spot-size-converter (SSC-TW-SOA) have been extensively studied for the improvement of coupling effiClency With single-mode fiber and fO! the cost reducClon 111 a packaging In tlIis paper the slructural dependence of the spot-slZe-converter on the effective facet reflectlvllY $R_{eff}$ was experimentally as well as thcoretienlly mvestlgated. It was shown that not only a sufficient mode-conversion in a sse region along the latersl and tran~verse directions but also an introductIOn of angled-facet were very essential in order to reduce $R_{eff}$ Very small ripple less than 0.1 dB in an amplified spontaneous emission spectrum was observed with the fabncated SSC-lW-SOA which consists of the wrndow length of $20\mu\textrm{m}$, facet angle of $7^{\circ}$, and antlrelleetioll-coated facet of ] % reflectivity.tivity.

• Advances in concrete construction
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• v.5 no.6
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• pp.563-573
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• 2017

Transparency, excellent toughness, thermal stability and a very good dimensional stability make Polycarbonate (PC) one of the most widely used engineering thermoplastics. Polycarbonate market include electronics, automotive, construction, optical media and packaging. One alternative for reducing the environmental pollution caused by polycarbonate from electronic waste (e-waste), is to use it in cement concretes. In this work, physical and chemical characterization of recycled polycarbonate from electronic waste was made, through the analysis by Fourier transform infrared spectroscopy (FTIR), X-ray diffraction (XRD), energy dispersive spectroscopy (EDS) and scanning electron microscope (SEM). Then cement concrete was made with Portland cement, sand, gravel, water, and this recycled polycarbonate. Specimens without polycarbonate were produced for comparison purposes. The effect of the particle sizes and concentrations of recycled polycarbonate within the concrete, on the compressive strength and density was studied. Results show that compressive strength values and equilibrium density of concrete depend on the polycarbonate particle sizes and its concentrations; particularly the highest compressive strength values were 20% higher than that for concrete without polycarbonate particles. Moreover, morphological, structural and crystallinity characteristics of recycled polycarbonate, are suitable for to be mixed into concrete.

• Structural Engineering and Mechanics
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• v.85 no.1
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• pp.119-133
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• 2023

Impact event is the key factor influencing the operational state of the mechanical equipment. Additionally, nonlinear factors existing in the complex mechanical equipment which are currently attracting more and more attention. Therefore, this paper proposes a novel hybrid-separate identification strategy to solve the force identification problem of the nonlinear structure under impact excitation. The 'hybrid' means that the identification strategy contains both l1-norm (sparse) and l2-norm regularization methods. The 'separate' means that the nonlinear response part only generated by nonlinear force needs to be separated from measured response. First, the state-of-the-art two-step iterative shrinkage/thresholding (TwIST) algorithm and sparse representation with the cubic B-spline function are developed to solve established normalized sparse regularization model to identify the accurate impact force and accurate peak value of the nonlinear force. Then, the identified impact force is substituted into the nonlinear response separation equation to obtain the nonlinear response part. Finally, a reduced transfer equation is established and solved by the classical Tikhonove regularization method to obtain the wave profile (variation trend) of the nonlinear force. Numerical and experimental identification results demonstrate that the novel hybrid-separate strategy can accurately and efficiently obtain the nonlinear force and impact force for the nonlinear structure.

• Journal of Nuclear Fuel Cycle and Waste Technology(JNFCWT)
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• v.21 no.3
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• pp.411-417
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• 2023

During the operation of a nuclear power plant (NPP), the generation of radioactive waste, including dry active waste (DAW), concentrates, spent resin, and filters, mandates the implementation of appropriate disposal methods to adhere to Korea's waste acceptance criteria (WAC). In this context, this study investigates the potential use of polymer concrete (PC) as a high-integrity container (HIC) material for solidifying and packaging these waste materials. PC is a versatile composite material comprising binding polymers, aggregates, and additives, known for its exceptional strength and chemical stability. A comprehensive analysis of PC's long-term integrity was conducted in this study. First, its compressive strength, which is crucial for ensuring the structural stability of HICs over extended periods, was evaluated. Subsequently, the resilience of PC was tested under various stress conditions, including biological, radiological, thermal, and chemical stressors. The findings of this study indicate that PC exhibits remarkable long-term properties, demonstrating exceptional stability even when subjected to diverse stressors. The results therefore underscore the potential viability of PC as a reliable material for constructing high-integrity containers, thus contributing to the safe and sustainable management of radioactive waste in NPPs.

• Journal of the Microelectronics and Packaging Society
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• v.6 no.1
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• pp.1-10
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• 1999

InGaP epilayers were grown on the flat, $2^{\circ}$off, $6^{\circ}$ off, and $10^{\circ}$off GaAs substrates by organo-metallic vapor phase epitaxy, and influences of crystallographic misorientation of the substrate on the structural and optical properties such as lattice mismatch, elastic strain, lattice curvature, misfit stress, and PL intensity /line-width were investigated in this study. Material characterizations were carried out by TXRD( tripple-axis x-ray diffractometer) and low temperature (11K) PL (photoluminescence). With increase of the substrate misorientation angle (S.M.A.), the relative incorporation of Ga atoms on the substrate surface was found to be enhanced. Also, with increase of the S. M. A., the x-ray line-width of the InGaP epilayer was reduced, indicating that the crystal quality of the epilayer could be improved tilth a misoriented substrate. It was also found that the elastic accommodation of the strain-free lattice misfit was more remarkable in a misoriented sample. PL intensity increased, and PL line-width and emission wavelength decreased with the increase of S. M. A. The results conclude that the elastic characteristics and the crystal quality of the InGaP epilayer could be remarkably enhanced when the misoriented substrates were employed.

• Journal of the Microelectronics and Packaging Society
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• v.24 no.4
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• pp.31-37
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• 2017

Recently, there has been substantial interest in flexible and wearable devices whose properties and performances are close to conventional devices on hard substrates. Despite the advancement on flexible devices with organic semiconductors or carbon nanotube films, their performances are limited by the carrier scattering at the molecular to molecular or nanotube-to-nanotube junctions. Here in this study, we demonstrate on the vertical semiconductor crystal array embedded in flexible polymer matrix. Such structures can relieve the strain effectively, thereby accommodating large flexural deformation. To achieve such structure, we first established a low-temperature solution-phase synthesis of single crystalline 3D architectures consisting of epitaxially grown ZnO constituent crystals by position and growth direction controlled growth strategy. The ZnO vertical crystal array was integrated into a piece of polydimethylsiloxane (PDMS) substrate, which was then mechanically detached from the hard substrate to achieve the freestanding ZnO-polymer composite. In addition, the characteristics of transferred ZnO were confirmed by additional structural and photoluminescent measurements. The ZnO vertical crystal array embedded in PDMS was further employed as pressure sensor that exhibited an active response to the external pressure, by piezoelectric effect of ZnO crystal.

• Journal of the Microelectronics and Packaging Society
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• v.24 no.4
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• pp.39-46
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• 2017

This paper presents the fabrication of ceramic insulation layer on metallic heat spreading substrate, i.e. an insulated metal substrate, for planar type heater. Aluminum alloy substrate is preferred as a heat spreading panel due to its high thermal conductivity, machinability and the light weight for the planar type heater which is used at the thermal treatment process of semiconductor device and display component manufacturing. An insulating layer made of ceramic dielectric film that is stable at high temperature has to be coated on the metallic substrate to form a heating element circuit. Two technical issues are raised at the forming of ceramic insulation layer on the metallic substrate; one is delamination and crack between metal and ceramic interface due to their large differences in thermal expansion coefficient, and the other is electrical breakdown due to intrinsic weakness in dielectric or structural defects. In this work, to overcome those problem, selected metal oxide buffer layers were introduced between metal and ceramic layer for mechanical matching, enhancing the adhesion strength, and multi-coating method was applied to improve the film quality and the dielectric breakdown property.