• Journal of the Korea Institute of Information and Communication Engineering
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• v.20 no.12
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• pp.2395-2400
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• 2016

Conventional drug carriers such as liposomes, nanoparticles, polymer micelles, polymeric conjugate and lipid microemulsion for cancer chemotherapy shield normal tissues from toxic drugs to treat cancer cells in tumors. However, inaccurate tumor targeting uncontrolled drug release from the carriers and unwanted accumulation in healthy sites can limit treatment efficacy with current conventional drug carriers with insufficient concentrations of drugs in the tumors and unexpected side effects as a result. Sickle red blood cells show natural tumor preferential accumulation without any manipulation due to the adhesive interaction between molecular receptors on the membrane surface and counter-receptor on endothelial cells. In addition, structural changes of microvascular in tumor sites enhances polymerization of sickle red blood cells. In this research, we examined the use of sickle red blood cells as a new drug carrier with novel tumor targeting and controlled release properties to quantify its therapeutic effects.

• Journal of the Korean Wood Science and Technology
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• v.44 no.3
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• pp.315-322
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• 2016

Block-glued glulam is a structural material that can be used as a construction member of a large-section wooden building, which is produced by edgewise bonding of two or more glulam beam elements. The edgewise bonding performance of the block-glued glulam was examined through delamination test and block shear strength test. According to the test results, the block-glued glulam that was manufactured with 1.5 MPa of compressive pressure after applying $500g/m^2$ of Resorcinol adhesive showed the best edgewise bonding performance. The block-glued glulam produced in a good edgewise bonding condition was compared with a control glulam with the same section modulus for bending strength performance. The modulus of elasticity (MOE) in bending was similar to that of the control glulam. The modulus of rupture (MOR) of the block-glued glulam was higher by 27% than that of the control glulam. No interfacial failure or cohesive failure were observed in the edgewise bonding layer.

• Composites Research
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• v.29 no.2
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• pp.85-89
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• 2016

This paper aims at estimating the fracture behavior at the bonded part of composite material. CFRP is manufactured as the type of TDCB. The static analysis of Mode 1 due to the configuartion factor of m is carried out. Four kinds of specimens have the configuartion factor(m) of 2, 2.5, 3 and 3.5. As the study result, the displacements at specimens are shown to be similar each other in these four cases. At m of 3.5, the reaction force becomes highest as 412 N and is shown to be improved as much as 14% by comparing m of 2. The data on defection of the bonded interface and reaction force are thought to be contributed to the structural design of CFRP and the safe design.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.25 no.4
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• pp.592-601
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• 2001

Fiber reinforced metal laminates(FRMLs) are new types of hybrid materials. FRMLs consists of high strength metal(Al 5052-H34) and laminated fiber with structural adhesive bond. The mixture ratio effect of epoxy resin$.$curing agent$.$accelerator on the fatigue behavior of FRMLs was investigated in this study. The epoxy, diglycidylether of bisphenol A(DGEBA), was cured by methylene dianiline(MDA) with or without an accelerator(K-54). Eight different kinds of resin mixture ratios were selected for the test ; five kinds of FRMLs(1) and three others of FRMLs(2). The relationship between da/dN and ΔK with variation of resin mixture ratio was studied. FRMLs(1) and FRMLs(2) indicated approximately 2 times and 2.2 times more improved maximum bending strengths in comparison with those of Al 5052-H34. The resin mixture ratio <1:1> in case of FRMLs(1) indicated the maximum fatigue life, while the resin mixture ratio <1:1:0.2> in case of FRMLs(2) indicated the maximum fatigue life. As results, FRMLs(2) turned out to have more effective characteristics on the fatigue properties and the bending strength than those of FRMLs(1).

• Proceedings of the Korean Vacuum Society Conference
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• 2014.02a
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• pp.489.2-489.2
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• 2014

The planar type flexible piezoelectric energy harvesters (PEH) based on PbZr0.52Ti0.48O3 (PZT) thin films on the flexible substrates are demonstrated to convert mechanical energy to electrical energy. The planar type energy harvesters have been realized, which have an electrode pair on the PZT thin films. The PZT thin films were deposited on double side polished sapphire substrates using conventional RF-magnetron sputtering. The PZT thin films on the sapphire substrates were transferred by PDMS stamp with laser lift-off (LLO) process. KrF excimer laser (wavelength: 248nm) were used for the LLO process. The PDMS stamp was attached to the top of the PZT thin films and the excimer laser induced onto back side of the sapphire substrate to detach the thin films. The detached thin films on the PDMS stamp transferred to adhesive layer coated on the flexible polyimide substrate. Structural properties of the PZT thin films were characterized using X-ray diffraction (XRD) and scanning electron microscopy (SEM). To measure piezoelectric power generation characteristics, Au/Cr inter digital electrode (IDE) was formed on the PZT thin films using the e-beam evaporation. The ferroelectric and piezoelectric properties were measured by a ferroelectric test system (Precision Premier-II) and piezoelectric force microscopy (PFM), respectively. The output signals of the flexible PEHs were evaluated by electrometer (6517A, Keithley). In the result, the transferred PZT thin films showed the ferroelectric and piezoelectric characteristics without electrical degradation and the fabricated flexible PEHs generated an AC-type output power electrical energy during periodically bending and releasing motion. We expect that the flexible PEHs based on laser transferred PZT thin film is able to be applied on self-powered electronic devices in wireless sensor networks technologies. Also, it has a lot of potential for high performance flexible piezoelectric energy harvester.

• Proceedings of the Korean Vacuum Society Conference
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• 2011.02a
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• pp.490-490
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• 2011

Graphene, hexagonal network of carbon atoms forming a one-atom thick planar sheet, has been emerged as a fascinating material for future nanoelectronics. Huge attention has been captured by its extraordinary electronic properties, such as bipolar conductance, half integer quantum Hall effect at room temperature, ballistic transport over ${\sim}0.4{\mu}m$ length and extremely high carrier mobility at room temperature. Several approaches have been developed to produce graphene, such as micromechanical cleavage of highly ordered pyrolytic graphite using adhesive tape, chemical reduction of exfoliated graphite oxide, epitaxial growth of graphene on SiC and single crystalline metal substrate, and chemical vapor deposition (CVD) synthesis. In particular, direct synthesis of graphene using metal catalytic substrate in CVD process provides a new way to large-scale production of graphene film for realization of graphene-based electronics. In this method, metal catalytic substrates including Ni and Cu have been used for CVD synthesis of graphene. There are two proposed mechanism of graphene synthesis: carbon diffusion and precipitation for graphene synthesized on Ni, and surface adsorption for graphene synthesized on Cu, namely, self-limiting growth mechanism, which can be divided by difference of carbon solubility of the metals. Here we present that large area, uniform, and layer controllable graphene synthesized on Cu catalytic substrate is achieved by acetylene-assisted CVD. The number of graphene layer can be simply controlled by adjusting acetylene injection time, verified by Raman spectroscopy. Structural features and full details of mechanism for the growth of layer controllable graphene on Cu were systematically explored by transmission electron microscopy, atomic force microscopy, and secondary ion mass spectroscopy.

• Journal of the Korea Concrete Institute
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• v.13 no.3
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• pp.221-227
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• 2001

Both strength and stiffness of RC structures strengthened by a steel plate greatly increase and however, their ductility might not be sufficient because premature failures usually occur at the adhesive-concrete interface. In this study, Mohr-Coulomb criterion was adopted to examine the bonding failure mechanism, and the diagonal shear bonding test, the direct shear bonding test, and the flexural test on RC beams strengthened by a steel plate were carried out to measure the bonding properties. It is found from the experimental and numerical results that the cohesive strengths of epoxy-concrete interfaces are ranging from 50 kgf/㎠ to 70 kgf/㎠ when the friction angle is 45°. Bonding failure loads can be predicted by applying the bonding properties to the structural analysis of RC beams strengthened by steel plate. By considering them in the design of strengthened beams, the premature failure would be effectively prevented.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2006.12a
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• pp.119-122
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• 2006

Process variables for manufacturing the $CuInSe_2$ thin film were established in order to clarify optimum conditions for growth of the thin film depending upon process conditions (substrate temperature, sputtering pressure, DC/RF Power), and then by changing a number of vapor deposition conditions and Annealing conditions variously, structural and electrical characteristics were measured. Thereby, optimum process variables were derived. For the manufacture of the $CuInSe_2$, Cu, In and Se were vapor-deposited in the named order. Among them, Cu and In were vapor-deposited by using the sputtering method in consideration of their adhesive force to the substrate, and the DC/RF power was controlled so that the composition of Cu and In might be 1:1, while the surface temperature having an effect on the quality of the thin film was changed from 100[$^{\circ}C$] to 300[$^{\circ}C$] at intervals of 50[$^{\circ}C$].

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.20 no.7
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• pp.600-605
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• 2007

Process variables for manufacturing the $CuInSe_2$ thin film were established in order to clarify optimum conditions for growth of the thin film depending upon process conditions (substrate temperature, sputtering pressure, DC/RF Power), and then by changing a number of vapor deposition conditions and Annealing conditions variously, structural and electrical characteristics were measured. Thereby, optimum process variables were derived. For the manufacture of the $CuInSe_2$, Cu, In and Se were vapor-deposited in the named order. Among them, Cu and In were vapor-deposited by using the sputtering method in consideration of their adhesive force to the substrate, and the DC/RF power was controlled so that the composition of Cu and In might be 1 : 1, while the surface temperature having an effect on the quality of the thin film was changed from $100^{\circ}C\;to\;300^{\circ}C$ at intervals of $50^{\circ}C$. The diffract fringe of X-ray, which depended upon the substrate temperature and the Annealing temperature of the manufactured $CuInSe_2$ thin film, was investigated. scanning electron microgaphs of represents a case that a sample manufactured at the substrate temperature of $100^{\circ}C$ was thermally treated at $200{\times}350^{\circ}C$. As a result, at $500^{\circ}C$ of the Annealing temperature, their chemical composition was measured in the proportion of 1 : 1 : 2. It could be known that under this condition, the most excellent thin film was formed, compared with the other conditions.

• Journal of Welding and Joining
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• v.23 no.6
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• pp.49-54
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• 2005

Inner Structured and Bonded(ISB) panel, a kind of metallic sandwich panel, consists of two thin skin plates bonded to a micro-patterned inner structure. Its overall thickness is $1\~3mm$and it has attractive properties such as ultra-lightweight, high efficiency in stiffness-to-weight and strength-to-weight ratio. In many previous studies, resistance welding, brazing and adhesive bonding are studied for joining the panel. However these methods did not consider productivity, but focused on structural characteristics of joined panels, so that the joining process is very complicated and expensive. In this paper, a new joining process with resistance welding is developed. Curved surface electrodes are used to consider the productivity and the stopper is used between electrodes during welding time to maintain the shape of inner structure. Welding time, gap of electrodes and distance between welding points are selected as the process parameters. By measuring the tensile load with respect to the variation of welding time and gap of electrodes, proper welding conditions are studied. Welding time is proper between 1.5-2.5cycle. If welding time is too long, then inner structures are damaged by overheating. Gap of electrode should be shorter than threshold value fur joint strength, when total thickness of inner structure and skin plate is 3.3mm, the threshold distance is 3.0mm.