• 제목/요약/키워드: Stress singularity

검색결과 147건 처리시간 0.029초

수분 흡수로 인해 얇은 필름에 발생하는 계면 응력의 경계요소해석 (Boundary Element Analysis of Interface Stresses in a Thin Film Due to Moisture Absorption)

  • 이상순
    • 한국전산구조공학회:학술대회논문집
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    • 한국전산구조공학회 1999년도 봄 학술발표회 논문집
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    • pp.19-26
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    • 1999
  • This paper deals with the stress singularity induced at the interface corner between the viscoelastic thin film and the rigid substrate as the film absorbs moisture from the ambient environment. The rime-domain boundary element method is employed to investigate the behavior of interface stresses. The order of the free-edge singularity is obtained numerically for a given viscoelastic model. It is shown that the free-edge stress intensity factor is relaxed with time,'while the order of the singularity increases with time for the viscoelastic model considered.

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반도체 칩의 접착계면에 발생하는 열응력 해석 (Analysis of Thermal Stresses Developed in Bonding Interface of Semiconductor Chip)

  • 이상순
    • 한국전산구조공학회:학술대회논문집
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    • 한국전산구조공학회 1999년도 가을 학술발표회 논문집
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    • pp.437-443
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    • 1999
  • This paper deals with the stress singularity induced at the interface corner between the viscoelastic thin film and the rigid substrate subjected to uniform temperature change. The viscoelastic film has been assumed to be thermorheologically simple. The time-domain boundary element method(BEM) has been employed to investigate the behavior of interface stresses. The order of the free-edge singularity has been obtained numerically for a given viscoelastic model. It is shown that the free-edge stress intensity factor is relaxed with time, while the order of the singularity increases with time for the viscoelastic model considered.

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응력특이성을 고려한 세라믹/금속 접합재의 정적강도평가 (Evaluation of Static Strength on Ceramic /Metal Bonded Joints Considering Stress Singularity)

  • 김기성
    • 한국생산제조학회지
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    • 제6권1호
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    • pp.59-68
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    • 1997
  • Recently, the cases of using bonded dissimiliar materials which have each of the different components tend to increase for the purpose of developing new materials and using the special objects in the field of industry. Among the cases the strength evaluation of the joining materials of vehicle engine and the structural materials with ceramic/metal bonded joints becomes more important. But the residual stress occurs, because the joining of ceramics and metals is performed in extremely high temperature. It becomes a dominant cause to reduce the strength of the ceramic/metal bonded joints. In this paper, strength evaluation method of ceramic/metal bonded joints considering stress singularity was investigated by boundary element method and 4-point bending test. An advanced method of quantitative strength evaluation for ceramin/metal bonded joints is to be suggested.

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특이 접촉응력 문제의 형상 최적화 (Geometric Optimization Involving Contact Stress Singularities)

  • 박정선;이수용
    • 대한기계학회논문집A
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    • 제20권1호
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    • pp.180-188
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    • 1996
  • The stress singularity of a sharp wedge contacting a half plane can be avoided by changing the wedge shape. Shape optimization is accomplished with the geometric strain method (GSM), an optimality criterion method. Several numerical examples are provided for different materials in the wedge and half plane to avoid stress singularity neal the sharp corner of the wedge. Optimum wedge shapes are obtained and critical corner angles are compared with the angles from analytical contact mechanics. Numerical results are well matched to analytical and experimental results. It is shown that shape optimization by the geometric strain method is a useful tool to reshape the wedge and to avoid a stress singulatiry. The method applies to more general geometries where the singular behavior would be difficult to avoid by classical means.

경계요소법에 의한 반도체 패키지의 균열진전경로 예측 (Prediction of crack propagation path in IC package by BEM)

  • 송춘호;정남용
    • 대한기계학회:학술대회논문집
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    • 대한기계학회 2001년도 춘계학술대회논문집A
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    • pp.286-291
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    • 2001
  • Applications of bonded dissimilar materials such as IC package, ceramic/metal and resin/metal bonded joints, are very increasing in various industry fields. It is very important to analyze the thermal stress and stress singularity at interface edges in bonded joints of dissimilar materials. In orer to understand the package crack emanating from the edge of Die pad and Resin, fracture mechanics of bonded dissimilar materials and material properties are obtained. In this paper, the thermal stress and its singularity index for the IC package were analyzed using 2-dimensional elastic boundary element method. Crack propagation angle and path by thermal stress were numerically simulated with boundary element method.

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이종 마찰용접재의 파괴기준 설정 (Establishment of Fracture Criterion on Friction Welded Dissimilar Materials)

  • 정남용;박철희
    • 한국자동차공학회논문집
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    • 제14권5호
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    • pp.164-171
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    • 2006
  • Application of friction welding is increasing in the manufacturing process of machine elements in many industry fields. To establish a reasonable strength evaluation method and fracture criterion, it is necessary to analyze stress singularity under the residual stress condition on friction welded interface between dissimilar materials. In this paper, a method to establish fracture criterion on interface of friction welded dissimiliar materials was investigated by using the boundary element method BEM and static tensile testing. A quantitative fracture criterion for friction welded dissimilar materials is suggested by using stress singularity factor, $\Gamma$.

경계요소법에 의한 이종재료 접합 잔류열응력의 해석 (A Study on the Bonding Residual Thermal Stress Analysis of Dissimilar Materials Using Boundary Element Method)

  • 이원;유영철;정의섭;윤인식
    • 비파괴검사학회지
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    • 제15권4호
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    • pp.540-548
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    • 1996
  • 전자 부품의 일종인 LSI 패키지의 제조 과정에서 절연 방진 방습 등을 목적으로 수지 몰딩이 널리 사용되고 있는데, 냉각과정에서 금속과 수지의 계면에 접합 잔류열응력이 발생하여 파괴의 원인이 되고 있다. 접합 잔류열응력의 측정에는 X선 회절법등이 사용되지만 측정상의 어려움과 계면단 응력특이성에 대한 해석의 곤란함 때문에 적절한 모델링에 따른 수치해석적 연구가 새로이 주목을 받고 있다. 본 연구에서는 Al/Epoxy를 몰딩 접합한 세가지의 대표적인 계면 형상을 선정하여 계면에서의 잔류열응력을 경계요소 수치해석 및 스트레인 게이지를 이용한 실험을 통하여 각각 해석하였다. 수치해석과 실험결과는 정성적으로 잘 일치하였으며, 서브 요소를 사용하므로써 계면단 응력 특이성의 해석 정밀도를 향상시킬 수 있었다. 또한 접합 잔류열응력의 해석결과로부터 수직응력에 의한 계면 박리가 예상되고, 피착체의 두께가 증가할수록 응력 특이성이 강하게 나타남을 확인하였다.

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전자부품 패키지에 내재된 두재료 혹은 세재료 접합점에 대한 응력특이차수 (Order of Stress Singularities at Bonded Edge Corners with Two or Three Dissimilar Materials in the Eletronic Package)

  • 최성렬;권용수;박상선;박재완
    • 대한기계학회논문집A
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    • 제20권1호
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    • pp.135-145
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    • 1996
  • Order of stress singularities at bonded Edge Corners with two or three dissimilar isotropic Materials is analyzed. The problem is formulated by Mellin transform and characteristic equation is obtained as a determinant of matrix considering boundary conditions. Roots of characterictic equation are determinde by numerical calculations with ward method, from which the order of stress sigularities is obtained. Applying the results to the electronic packaging, the order of stress singularities is obtained. Applying the results to the electronic packaging, the order of stress singularities at bounded edge corners is calculated as a various bouned edge angle with given material combinations. Comparing the results, the optimal material combinaitons of bounded edge corners and bouned edge angle to reduce stress singularity could be determined. It suggests that the results are used to the basic design of electronic packaging reducing the stress singularity.

정규 크리깅보간법을 이용한 응력특이문제의 p-적응적 유한요소해석 (p-Adaptive Finite Element Analysis of Stress Singularity Problems by Ordinary Kriging Interpolation)

  • 우광성;박미영;박진환;한상현
    • 한국전산구조공학회:학술대회논문집
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    • 한국전산구조공학회 2006년도 정기 학술대회 논문집
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    • pp.849-856
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    • 2006
  • This paper is to examine the applicability of ordinary Kriging interpolation(OK) to the p-adaptivity of the finite element analysis that is based on variogram. In the p-refinement, the analytical domain has to be refined automatically to obtain an acceptable level of accuracy by increasing the p-level non-uniformly or selectively. In case of non-uniform p-distribution, the continuity between elements with different polynomial orders is achieved by assigning zero higher-order derivatives associated with the edge in common with the lower-order derivatives. It is demonstrated that the validity of the proposed approach by analyzing results for stress singularity problem.

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탄성 선형 경화 재료로 구성된 복합 구조물의 자유 경계면에서 나타나는 응력특이도 (The Free Edge Stress Singularity At An Interface of Bilinear Material Structure)

  • 정철섭
    • 전산구조공학
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    • 제10권3호
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    • pp.185-193
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    • 1997
  • 탄성 선형 경화 재료로 구성된 복합 구조물의 자유 경계면에서 나타나는 응력 특이도를 평면 변형률 상태에서 계산하였다. 자유 표면력 경계조건과 계면 연속조건을 만족해야하는 지배 탄성 방정식은 2점 경계치문제로 정의되며, 일반 고유치 문제의 해인 고유치가 응력 특이도가 될 것이다. 자유경계면 근처에서 응력 성분을 r/sup s-1/에 비례한다고 가정하여 특정한 s(고유치)를 구하는 고유치 문제를 뉴톤향상법과 사격법을 사용하여 수치적으로 해를 구하였다.

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