• Title/Summary/Keyword: Stress Fields

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The Subsurface Stress Field Caused by Both Normal Loading and Tangential Loading

  • Koo Young- Phi;Kim Tae-Wan;Cho Yong-Joo
    • Journal of Mechanical Science and Technology
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    • v.19 no.11
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    • pp.1967-1974
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    • 2005
  • The subsurface stress field caused by both normal loads and tangential loads has been evaluated using the rectangular patch solution. The effect of tangential loading on the subsurface stress field has been investigated in detail for both the cylinder-on-cylinder contact and a spur gear teeth contact. For the cylinder-on-cylinder contact, the subsurface stress fields are moved more to the direction of tangential loads and the positions where the maximum stress occur are getting closer to the surface with the increasing tangential loads. The subsurface stress fields of the gear teeth contact are expanded more widely to the direction of tangential loads with the increasing tangential loads. The friction coefficient of a gear teeth contact is low because they are operated in a lubricated condition, and therefore surface tractions in the EHL condition hardly affect on the subsurface stress field.

Determination of Knoop Indentation Stress Conversion Factors for Measuring Equibiaxial Residual Stress (인장 및 압축 등방 잔류응력 측정을 위한 누프 압입시험의 응력환산계수 결정)

  • Jeong, Min Jae;Kim, Young-Cheon
    • Corrosion Science and Technology
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    • v.20 no.6
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    • pp.484-490
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    • 2021
  • Instrumented indentation testing has been widely used for residual stress measurement. The Knoop indentation is mainly selected for determining anisotropic mechanical properties and non-equibiaxial residual stress. However, the measurement of equibiaxial stress state and compressive residual stress on a specimen surface using Knoop indentation is neither fully comprehended nor unavailable. In this study, we investigated stress conversion factors for measuring Knoop indentation on equibiaxial stress state through indentation depth using finite element analysis. Knoop indentation was conducted for specimens to determine tensile and compressive equibiaxial residual stress. Both were found to be increased proportionally according to indentation depth. The stress field beneath the indenter during each indentation test was also analyzed. Compressive residual stress suppressed the in-plane expansion of stress field during indentation. In contrast, stress fields beneath the indenter developed diagonally downward for tensile residual stress. Furthermore, differences between trends of stress fields at long and short axes of Knoop indenter were observed due to difference in indenting angles and the projected area of plastic zone that was exposed to residual stress.

Fatigue Crack-Tip Stress Mapping Using Neutron Diffraction

  • Choi, Gyudong;Lee, Min-Ho;Huang, E-Wen;Woo, Wanchuck;Lee, Soo Yeol
    • Korean Journal of Materials Research
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    • v.25 no.12
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    • pp.690-693
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    • 2015
  • Fatigue crack growth experiments were carried out on a 304 L stainless steel compact-tension(CT) specimen under load control mode. Neutron diffraction was employed to quantitatively measure the residual strains/stresses and the evolution of stress fields in the vicinity of a propagating fatigue-crack tip. Three principal stress components (i.e. crack growth, crack opening, and through-thickness direction stresses) were examined in-situ under loading as a function of distance from the crack tip along the crack-propagation path. The stress/strain fields, measured both at the mid-thickness and near the surface of the CT specimen, were compared. The results show that much higher compressive residual stress fields developed in front of the crack tip near the surface than developed at the mid-thickness area. The change of the stresses ahead of the crack tip under loading is more significant at the mid-thickness area than it is near the surface.

Unsteadily Propagating Permeable Mode III Crack in Piezoelectric Materials (압전재료에서 비정상적으로 전파하는 투과형 모드 III 균열)

  • Lee, Kwang-Ho
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.36 no.9
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    • pp.985-996
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    • 2012
  • An unsteadily propagating permeable crack in piezoelectric materials (PMs) under anti-plane shear mechanical loading and in-plane electric loading is studied. The equilibrium equations for a transiently propagating crack in a PM are developed, and the solutions on the stress and displacement fields for a permeable crack though an asymptotic analysis are obtained. The influences of piezoelectric constant, dielectric permittivity, time rate of change of the crack tip speed and time rate of change of stress intensity factor on the stress and displacement fields at the transiently propagating crack tip are explicitly clarified. By using the stress and displacements, the characteristics of the stress and displacement at a transiently propagating crack tip in a PM are discussed.

Analysis of Unsteady Propagation of Mode III Crack in Arbitrary Direction in Functionally Graded Materials (함수구배재료에서 임의의 방향을 따라 비정상적으로 전파하는 모드 III 균열해석)

  • Lee, Kwang Ho;Cho, Sang Bong;Hawong, Jai Sug
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.39 no.2
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    • pp.143-156
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    • 2015
  • The stress and displacement fields at the crack tip were studied during the unsteady propagation of a mode III crack in a direction that was different from the property graduation direction in functionally graded materials (FGMs). The property graduation in FGMs was assumed based on the linearly varying shear modulus under a constant density and the exponentially varying shear modulus and density. To obtain the solution of the harmonic function, the general partial differential equation of the dynamic equilibrium equation was transformed into a Laplace equation. Based on the Laplace equation, the stress and displacement fields, which depended on the time rates of change in the crack tip speed and stress intensity factor, were obtained through an asymptotic analysis. Using the stress and displacement fields, the effects of the angled property variation on the stresses, displacements, and stress intensity factors are discussed.

Evaluation of Stress Intensity Factors for an Electrostrictive Crack with an Electric Yielding Zone (전기적 항복영역을 갖는 전왜균열에 대한 응력강도계수 계산)

  • 범현규;정은도
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2000.11a
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    • pp.469-472
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    • 2000
  • a crack with electrically impermeable surfaces in an electrostrictive material subjected to uniform electric loading is analysed. A strip yield zone model is employed to investigate the effect of electric yielding on stress intensity factor. complete forms of electric fields and elastic fields for the crack are derived by using complex function theory. /the stress intensity factors are obtained based on the strip yield zone model.

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Strength Models dependent on Load Configurations (하중형상과 콘크리트 부재의 강도모형)

  • Hong, Sung-Gul
    • Proceedings of the Korea Concrete Institute Conference
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    • 2008.11a
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    • pp.843-846
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    • 2008
  • Rationality of strength models for structural concrete depends on how to treat loads on boundaries and load paths within members. Differentiation between strut-and-tie models and stress fields approaches for shear strength models is discussed in this paper for salient use of current design formula in design code provisions. How to model configuration of loads and stress states along the boundary for the regions under provides a key to realistic construction of stress fields together with STM.

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Cellular Risk Assessment of Cells Exposed to Extremely Low Frequency Electromagnetic Fields (극저주파 자기장 노출에 의한 세포 유해성 평가)

  • Kang, Heungsik;Lee, Seongpyo;Noh, Myunggyu;Kim, Ki-Jung;Kim, Keekwang
    • Journal of Digital Convergence
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    • v.19 no.5
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    • pp.207-214
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    • 2021
  • Humans are environmentally exposed to various electromagnetic fields, but the evaluation of the harmfulness of electromagnetic field and the development of a system therefor are still incomplete. We aimed to develop a system for evaluating biohazard against electromagnetic fields, and to determine biohazard through the system. An extremely-low frequency magnetic field generator was designed and manufactured, and the output reliability of the device was verified. Using this device, the effect on the formation of cellular stress-granules and the cell cycle progression of cells exposed to high magnetic fields of 6 mT and 60 Hz was confirmed. As a result, exposure to high magnetic fields of 6 hr, 12 hr and 36 hr did not affect the formation of cell stress-induced granules and the cell division cycle. These results are an important basis for the determination of biohazard to the extremely-low frequency high magnetic field.

Dynamic Stress Intensity Factor $K_{IIID}$ for a Propagating Crack in Liner Functionally Gradient Materials Along X Direction (X방향의 선형함수구배인 재료에서 전파하는 균열의 동적응력확대계수 $K_{IIID}$)

  • Lee, Kwang-Ho
    • Proceedings of the KSME Conference
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    • 2001.11a
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    • pp.3-8
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    • 2001
  • Dynamic stress intensity factors (DSIFs) are obtained when a crack propagates with constant velocity in rectangular functionally gradient materials (FGMs) under dynamic mode III load. To obtain the dynamic stress intensity factors, it is used the general stress and displacement fields of FGMs for propagating crack and the boundary collocation method (BCM). The stress intensity factors and energy release rates are the greatest in the increasing properties $(\xi>0)$, next constant properties $(\x=0)$ and decreasing properties $(\xi<0)$ under constant crack tip properties and crack tip speed.

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Application of Laser Interferometry for Assessment of Surface Residual Stress by Determination of Stress-free State (무잔류 응력상태 결정을 통한 표면 잔류응력장 평가에의 레이저 간섭계 적용)

  • Kim, Dong-Won;Lee, Nak-Kyu;Choi, Tae-Hoon;Na, Kyong-Hoan;Kwon, Dong-Il
    • Proceedings of the KSME Conference
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    • 2003.04a
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    • pp.25-30
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    • 2003
  • The total relaxed stress in annealing and the thermal strain/stress were obtained from the identification of the residual stress-free state using electronic speckle pattern interferometry (ESPI). The residual stress fields in case of both single and film/substrate systems were modeled using the thermo-elastic theory and the relationship between relaxed stresses and displacements. We mapped the surface residual stress fields on the indented bulk Cu and the 0.5 ${\mu}m$ Au film by ESPI. In indented Cu, the normal and shear residual stress are distributed over -1.7 GPa to 700 MPa and -800 GPa to 600 MPa respectively around the indented point and in deposited Au film on Si wafer, the tensile residual stress is uniformly distributed on the Au film from 500 MPa to 800 MPa. Also we measured the residual stress by the x-ray diffractometer (XRD) for the verification of above residual stress results by ESPI.

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