• Transactions of the Korean Society of Mechanical Engineers A
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• v.41 no.8
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• pp.765-770
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• 2017

GTD111 DS of nickel base superalloy has been used for gas turbine blades. In this study, low cycle fatigue test was conducted on the GTD111 DS alloy by setting conditions similar to the real operating environment. The low cycle fatigue tests were conducted at room temperature, $760^{\circ}C$, $870^{\circ}C$, and various strain amplitudes. Test results showed that fatigue life decreased with increasing total strain amplitude. Cyclic hardening response was observed at room temperature and $760^{\circ}C$; however, tests conducted at $870^{\circ}C$ showed cyclic softening response. Stress relaxation was observed at $870^{\circ}C$ because creep effects occurred from holding time. A relationship between fatigue life and total strain range was obtained from the Coffin-Manson method. The fratography using a SEM was carried out at the crack initiation and propagation regions.

• KSCE Journal of Civil and Environmental Engineering Research
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• v.38 no.1
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• pp.1-10
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• 2018

It is difficult to predict the early-age cracks of strain restrained concrete members due to environmentally sensitive parameters. A new method is proposed to predict the cracks by test of autogenous deformation and self-induced restrained stress of specimens which simulates early-age crack state by hydration heat of the'Wall-On-Foundation'members. For this purpose, thermal analysis of entire structure considering the environmental condition is performed at first, and the specimens are set up where hydration heat was electronically controlled according to the analysis results. By measuring free deformation and force to compensate the autogenous strain including relaxation, feasibility of cracks can be estimated. The proposed method can predict the occurrence of cracks better than the material test of the early age concrete which has large variance. The method of this study is particularly useful when it is used as a preliminary experiments to predict the crack more precisely before full-scale concrete placement in construction of large structures.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2004.09a
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• pp.233-241
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces strictly related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2004.09a
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• pp.211-219
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces stric시y related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials. In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• Magazine of the Korea Concrete Institute
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• v.9 no.4
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• pp.197-205
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• 1997

The shrinkage of polymer concrete overlays to cement concrete causes interface shear, normal and axial stresses in the overlays. These can lead to deterioration of the polymer concrete overlays due to affection of adhesion polymer concrete and cement concrete. The shrinkage stress in the polymer concrete cause it to shorten and the shorting is measured: With the modulus of elasticity of the polymer concrete and strain known the stresses can be calculated. The purpose of this study is to provide the basic data of application of polymer concrete overlays such as bridge decks, highway and airport pavement repair and overlay materials. From the test results. It has been found that depending on the type polymer. overlay thickness, time after curing and temperature. the shrinkage stresses are eliminated by relaxation in time ranging from a few hours to a few days.

• Proceedings of the KOSOMBE Conference
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• v.1995 no.05
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• pp.27-33
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• 1995

A time-dependent large deformation fracture theory is developed for application to soft biological tissues. The theory uses the quasilinear viscoelastic theory of Fung, and particularizes it to constitutive assumptions on polyvinyl-chloride (PVC) (Part I) and cartilage (Part II). This constitutive theory is used in a general viscoelastic theory by Christensen and Naghdi and an energy balance to develop an expression for the fracture toughness of the materials. Experimental methods are developed for measuring the required constitutive parameters and fracture data for the materials. Elastic stress and reduced relaxation functions were determined using tensile and shear tests at high loading rates with rise times of 25-30 msec, and test times of 150 sec. The developed method was validated, using an engineering material, PVC to separate the error in the testing method from the inherent variation of the biological tissues. It was found that the the proposed constitutive modeling can predict the nonlinear stress-strain and the time-dependent behavior of the material. As an approximation method, a pseudo-elastic theory using the J-integral concept, assuming that the material is a time-independent large deformation elastic material, was also developed and compared with the time-dependent fracture theory. For PVC. the predicted fracture toughness is $1.2{\pm}0.41$ and $1.5{\pm}0.23\;kN/m$ for the time-dependent theory and the pseudo-elastic theory, respectively. The methods should be of value in quantifying fracture properties of soft biological tissues. In Part II, an application of the developed method to a biological soft tissue was made by using bovine humeral articular cartilage.

• Journal of the Korean Vacuum Society
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• v.15 no.2
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• pp.152-161
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• 2006

In order to test the capacity of Si(5 5 12) as a potential template for nanowire fabrication, Bi/Si(5 5 12) system has been studied by STM. With Bi deposition, Si(5 5 12) has been transformed to Si(3 3 7) terrace. Initially Bi atoms selectively replace Si-dimers and Si-adatoms with Bi-dimers and Bi-adatoms, respectively. With extended Bi adsorption, Bi-dimers adsorb on the pre-adsorbed Bi-dimers and Bi-atoms. These dimers in the second layer form Bi-dimer pairs having relatively stable $p^3$ bonding, Finally, the Bi-dimer adsorbs on the Bi-dimers in the second layer and saturates. It can be deduced that both surface transformation to (3 3 7) and site-selective Bi adsorption are possible due to substrate-strain relaxation through inserting Bi atoms into subsurface of Si substrate.