• International Journal of Precision Engineering and Manufacturing
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• v.4 no.1
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• pp.23-29
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• 2003

Stencil is used normally as a mask for solder pasting on pad of a printed circuit board (PCB). The objective of this study is to develop a stencil cutting system and determine the optimal conditions to make good-quality stencil by using a Nd:YAG laser. The effects of process parameters such as laser power, type of mask, gas pressure, cutting speed and pulse duration on the cut edge quality were investigated. In order to analyze the cut surface characteristics (roughness, kerfwidth, dross) optical microscopy, SEM microscopy and roughness measurements were used. As a result, the optimal conditions of cutting process parameters were determined, and the practical feasibility of the proposed system was also examined by using a commercial Gerber file for PCB stencil manufacturing.

• Journal of the Korean Society for Precision Engineering
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• v.19 no.2
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• pp.106-113
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• 2002

Stencil is used normally as a mask for seeder pasting on pad of PCB. The objective of this study is to develop stencil cutting system and determine optimal conditions which make good-quality stencil by using a Nd:YAG laser. The effects of process parameters such as laser power, type of mask, gas pressure, cutting speed and pulse width old the cut edge quality were investigated. In order to analyse fille cut surface characteristics(roughness, kerf width, dross) optical microscopy, SEM photography and roughness test were used. As a result, the optimal conditions of process parameters were determined, and the practical feasibility of the proposed system is also examined by using a commercial Gerber file for PCB stencil manufacturing.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 1997.10a
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• pp.989-992
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• 1997

The objective of this study is to develop stencil cutting process and determine optimal conditions which make good-quality stencil by using a Nd:YAG laser. The effects of process parameters such as laser power, type of mask, gas pressure, cutting speed and pulse width on the cut edge quality were investigated. In order to analyze the cut surface characteristics(roughness, kerf width, dross) optical microscopy, SEM photography and roughness test were used. A a results, the optimal conditions of process parameters were determined, and the practical feasibility of the proposed system is also examined by using a commercial gerber file for PCB stencil manufacturing.

• Laser Solutions
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• v.4 no.2
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• pp.47-57
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• 2001

This study deals with the laser cutting of stencil for the PCB. The most important aim of this study is to determine optimal conditions which make good-qualify stencil in Nd:YAG laser cutting. We made an experiment according to various variables (power. type of mask. gas pressure, cutting speed, and pulse width) and analyzed the cutting characteristics (surface roughness, kerf width. dross) . Each variable has optimal value for good-qualify cut edge under fixed condition. And neural network after learning experimental data with a million time iteration could predict surface roughness of cut edge under arbitrary condition approximately.

• Proceedings of the Materials Research Society of Korea Conference
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• 1997.05a
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• pp.116-116
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• 1997

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.21 no.3
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• pp.408-414
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• 2012

Screen printing is a printing method that uses a woven mesh to support an ink-blocking stencil by transferring ink or other printable materials in order to form an image onto a substrate. Recently, the screen printing method has applied to micro-electronic packaging by using solder paste as a printable material. For the screen printing of solder paste, metal masks containing a number of micro-holes are used as a stencil material. The metal mask undergoes deformation when it is installed in the screen printing machine, which results in the deformation of micro-holes. In the present study, finite element (FE) analysis was performed to predict the amount of deformation of a metal mask. For an efficient calculation of the micro-holes of the metal mask, the sub-domain analysis method was applied to perform FE analyses connecting the global domain (the metal mask) and the local domain (micro-holes). The FE analyses were then performed to evaluate the effects of slot designs on the deformation characteristics, from which more uniform and adjustable deformation of the metal mask can be obtained.

• Journal of the Korean Society for Precision Engineering
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• v.31 no.6
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• pp.483-489
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• 2014

In this study, experiments were conducted for micro pattern printing to combine solution atomization process and stencil printing based on electrospray deposition. The stencil mask fabricated by etching the photosensitive glass placed below 0.3 mm distance to substrate has 100 um line width. The process parameters of electrospray deposition system for the atomization of the solution are applied voltage and supply flow rate of the solution. Meniscus angle of cone-jet was optimized by varying the supply flow rate from 0.3 ml/hr to 0.7 ml/hr. Voltage condition was verified having symmetric cone-jet angle and no pulsation at 8.5 kV applied voltage. In addition, a number of micro patterns are printed using a single 1 step process by solution atomization process. Variable line width of approximate 100 um was confirmed by changing conditions of solution atomization regardless of the pattern size of stencil mask.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2008.11a
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• pp.305-306
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• 2008

• Journal of the Korean Society for Precision Engineering
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• v.23 no.8 s.185
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• pp.27-32
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• 2006