• 한국콘크리트학회:학술대회논문집
• /
• 한국콘크리트학회 1998년도 가을 학술발표대회 논문집(III)
• /
• pp.894-899
• /
• 1998

To absorb the deformation of live load, thermal gradient, shrinkage and creep in bridge structures and general structures, expansion joint has to be established. Especially expansion joint for high-speed railway bridge has to accomodate the static and dynamic forces and it not only has the durability of itself but also maintain the durability of structure by preventing the leakage of water. The actual used product of expansion joint for high-speed railway bridge is only ones made in France, Germany and Japan. In this study, the development process and test results of developed expansion joint are introduced which has the functional operation and durability enough to apply to high-speed railway bridges, roadway bridges and general structures. The tests consist of fatigue-durability test of 3 million times by high-speed rail load, leakage test and jack-up test for verifying the possibility of exchanging it. The performance of developed expansion joint satisfy the specification of Korea High Speed Rail Construction authority.

• 한국철도학회:학술대회논문집
• /
• 한국철도학회 1998년도 추계학술대회 논문집
• /
• pp.24-29
• /
• 1998

To absorb the deformation of ,external live load, thermal gradient, shrinkage and creep in bridge structures and general structures, expansion joint has to be established. Especially expansion joint for high-speed railway bridge has to accomodate the static and dynamic forces and it not only has the durability of itself but also maintain the durability of structure by preventing the leakage of water. The actual used product of expansion joint for high-speed railway bridge is only ones made in France, Germany and Japan. In this study, the development process and test results of developed expansion joint are introduced which has the functional operation and durability enough to apply to high-speed railway bridges, roadway bridges and general structures. The tests consist of fatigue-durability test of 3 million times by high-speed rail load, leakage test and jack-up test for verifying the possibility of exchanging it. The performance of developed expansion joint satisfy the specification of Korea High Speed Rail Construction Authority.

• Advances in nano research
• /
• 제10권1호
• /
• pp.43-57
• /
• 2021

In this study, thermally induced bifurcation buckling of shallow composite cylindrical panels reinforced with aligned single-walled carbon nanotubes is investigated. Distribution of carbon nanotubes across the thickness of the cylindrical panel as reinforcements may be either uniform or functionally graded. Thermo-mechanical properties of the matrix and reinforcements are considered to be temperature dependent. Properties of the cylindrical panel are obtained using a refined micromechanical approach which introduces the auxiliary parameters into the rule of mixtures. The governing equations are obtained by using the static version of the Hamilton principle based on the first-order shear deformation theory and considering the linear strain-displacement relation. An energy-based Ritz method and an iterative process are used to obtain the critical buckling temperature of composite cylindrical panel with temperature dependent material properties. In addition, the effect of various parameters such as the boundary conditions, different geometrical conditions, distribution pattern of CNTs across the thickness and their volume fraction are studied on the critical buckling temperature and buckled pattern of cylindrical panels. It is shown that FG-X type of CNT dispersion is the most influential type in thermal stability.

• 대한토목학회논문집
• /
• 제14권5호
• /
• pp.1115-1128
• /
• 1994

국내 아스팔트포장의 온도변화 특성을 파악하기 위하여 국내 주요 5개 지역을 선정하여 포장의 내부온도를 측정하였고, 이를 바탕으로 포장체 연수지를 검토함과 동시에 포장체의 표면온도변화를 산정하고 열전도 이론을 이용하여 내부온도를 예측하는 수치모형을 도입 프로그램화함으로서 실측자료와 예측자료를 비교, 검토하고 그 적용성을 검증하였다. 그리고, 아스팔트혼합물의 온도의 영향을 분석하고자 국내에서 현재 생산 중인 아스팔트 재료 즉, 포장용아스팔트 AP-3(AC 85~100)와 AP 5(AC 60~70)를 선정하여 아스팔트물성시험과 Ascon 공시체를 마샬배합설계법에 따라 제작하여 온도에 따른 일압축시험과 간접인장시험의 정적탄성계수시험을 시행함으로서 아스팔트혼합물의 온도에 따른 변형특성을 파악하고자 하였고, 이로부터 온도변화에 따른 포장내부 온도예측 모델을 정립하고 온도에 따른 변형계수 변동을 분석, 대기온도와 변형계수 관계를 도출함으로서 지역에 따른 적정 아스팔트 설정을 위한 기초자료를 제시해 보고자 하였다.

• Steel and Composite Structures
• /
• 제34권4호
• /
• pp.511-524
• /
• 2020

In this research, a simple four-variable trigonometric integral shear deformation model is proposed for the static behavior of advanced functionally graded (AFG) ceramic-metal plates supported by a two-parameter elastic foundation and subjected to a nonlinear hygro-thermo-mechanical load. The elastic properties, including both the thermal expansion and moisture coefficients of the plate, are also supposed to be varied within thickness direction by following a power law distribution in terms of volume fractions of the components of the material. The interest of the current theory is seen in its kinematics that use only four independent unknowns, while first-order plate theory and other higher-order plate theories require at least five unknowns. The "in-plane displacement field" of the proposed theory utilizes cosine functions in terms of thickness coordinates to calculate out-of-plane shear deformations. The vertical displacement includes flexural and shear components. The elastic foundation is introduced in mathematical modeling as a two-parameter Winkler-Pasternak foundation. The virtual displacement principle is applied to obtain the basic equations and a Navier solution technique is used to determine an analytical solution. The numerical results predicted by the proposed formulation are compared with results already published in the literature to demonstrate the accuracy and efficiency of the proposed theory. The influences of "moisture concentration", temperature, stiffness of foundation, shear deformation, geometric ratios and volume fraction variation on the mechanical behavior of AFG plates are examined and discussed in detail.

• 한국진공학회:학술대회논문집
• /
• 한국진공학회 2012년도 제42회 동계 정기 학술대회 초록집
• /
• pp.341-341
• /
• 2012

Recently, oxide semi-conductor materials have been investigated as promising candidates replacing a-Si:H and poly-Si semiconductor because they have some advantages of a room-temperature process, low-cost, high performance and various applications in flexible and transparent electronics. Particularly, amorphous indium-gallium-zinc-oxide (a-IGZO) is an interesting semiconductor material for use in flexible thin film transistor (TFT) fabrication due to the high carrier mobility and low deposition temperatures. In this work, we demonstrated improvement of flexibility in IGZO TFTs, which were fabricated on polyimide (PI) substrate. At first, a thin poly-4vinyl phenol (PVP) layer was spin coated on PI substrate for making a smooth surface up to 0.3 nm, which was required to form high quality active layer. Then, Ni gate electrode of 100 nm was deposited on the bare PVP layer by e-beam evaporator using a shadow mask. The PVP and $Al_2O_3$ layers with different thicknesses were used for organic/inorganic multi gate dielectric, which were formed by spin coater and atomic layer deposition (ALD), respectively, at $200^{\circ}C$. 70 nm IGZO semiconductor layer and 70 nm Al source/drain electrodes were respectively deposited by RF magnetron sputter and thermal evaporator using shadow masks. Then, IGZO layer was annealed on a hotplate at $200^{\circ}C$ for 1 hour. Standard electrical characteristics of transistors were measured by a semiconductor parameter analyzer at room temperature in the dark and performance of devices then was also evaluated under static and dynamic mechanical deformation. The IGZO TFTs incorporating hybrid gate dielectrics showed a high flexibility compared to the device with single structural gate dielectrics. The effects of mechanical deformation on the TFT characteristics will be discussed in detail.

• 한국소성가공학회:학술대회논문집
• /
• 한국소성가공학회 2007년도 춘계학술대회 논문집
• /
• pp.191-194
• /
• 2007

In hot embossing lithography which has shown to be a good method to fabricate polymeric patterns for IT and bio components, it is very important to determine the proper process conditions of pressure, temperature, and time. It is also a key factor for predicting the optical properties of final product to calculate residual stress distribution after the embossing process. Therefore, to design the optimum process with right conditions, the ability to predict viscoelastic behavior of polymer during and after the hot embossing process is required. The objective of the present investigation is to establish simulation technique based on constitutive modeling of polymer with experiments. To analyze deformation behavior of viscoelastic polymer, the large strain material properties were obtained from quasi-static compression tests at different strain rates and temperatures and also stress relaxation tests were executed. With this viscoelastic material model, finite element simulation of hot embossing was executed and stress distribution is obtained. Proper process pressure is very important to predict the defect and incomplete filling.

• 한국진공학회:학술대회논문집
• /
• 한국진공학회 2011년도 제40회 동계학술대회 초록집
• /
• pp.479-479
• /
• 2011

Flexible inverters based on complementary thin-film transistor (CTFTs) are important because they have low power consumption and other advantages over single type TFT inverters. In addition, integrated CTFTs in flexible electronic circuits on low-cost, large area and mechanically flexible substrates have potentials in various applications such as radio-frequency identification tags (RFIDs), sensors, and backplanes for flexible displays. In this work, we introduce flexible complementary inverters using pentacene and amorphous indium gallium zinc oxide (IGZO) for the p-channel and n-channel, respectively. The CTFTs were fabricated on polyimide (PI) substrate. Firstly, a thin poly-4-vinyl phenol (PVP) layer was spin coated on PI substrate to make a smooth surface with rms surface roughness of 0.3 nm, which was required to grow high quality IGZO layers. Then, Ni gate electrode was deposited on the PVP layer by e-beam evaporator. 400-nm-thick PVP and 20-nm-thick ALD Al2O3 dielectric was deposited in sequence as a double gate dielectric layer for high flexibility and low leakage current. Then, IGZO and pentacene semiconductor layers were deposited by rf sputter and thermal evaporator, respectively, using shadow masks. Finally, Al and Au source/drain electrodes of 70 nm were respectively deposited on each semiconductor layer using shadow masks by thermal evaporator. Basic electrical characteristics of individual transistors and the whole CTFTs were measured by a semiconductor parameter analyzer (HP4145B, Agilent Technologies) at room temperature in the dark. Performance of those devices then was measured under static and dynamic mechanical deformation. Effects of cyclic bending were also examined. The voltage transfer characteristics (Vout- Vin) and voltage gain (-dVout/dVin) of flexible inverter circuit were analyzed and the effects of mechanical bending will be discussed in detail.