• 한국산업보건학회지
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• 제33권1호
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• pp.3-5
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• 2023

Objective: This study introduces exposure concentrations of time-weighted average standard (TWA) evaluation and short-time exposure standard (STEL) evaluation for trichloroethylene in the cleaning process. Methods: Trichloroethylene measurement was conducted according to the KOSHA Guide (A-24-2019) method. It was carried out twice. Results: As a result of the first measurement, TWA concentration exceeded 4 times the exposure standard and STEL concentration exceeded 16 times, but the inaccuracy and breakthrough of the collection time could not be considered, so the second measurement was conducted. The second measurement result was lower than the first measurement result, but exceeded the exposure standards (TWA, STEL). Conclusions: We were able to confirm that the exposure level of workers in the cleaning process using trichloroethylene exceeded the exposure standard. And it is also considered necessary to grasp the approximate concentration using a detector tube in the preliminary survey.

• 청정기술
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• 제14권2호
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• pp.103-109
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• 2008

본 연구에서는 솔더페이스트(solder paste)로 솔더링후 표면에 잔류하는 플럭스(flux)의 효과적인 세정성능 평가방법 개발을 목적으로 하였다. 솔더링시 플럭스의 퍼짐오차를 줄이기 위해 본 연구에서 고안한 금속치구를 이용하여 1,1,1-TCE 및 플럭스 제거용 몇 가지 대표 준수계 대체세정제에 대하여 세정시간에 따른 플럭스 제거율을 무게측정법으로 측정, 비교하였다. 세정시간 변화에 따른 각 세정제의 세정효율을 측정한 결과 측정값들의 상대표준편차(RSD)가 약 4%이하로 data의 신뢰성이 확인되었다. 따라서 솔더페이스트로 솔더링후 대체세정제의 잔류플럭스의 세정성능 평가시험에 본 연구에서 적용한 금속치구(metal test tool)를 이용한 평가방법이 유력한 방법으로 적용가능할 것으로 판단된다. 그리고 이 평가방법을 적용한 결과 현재 상용화 되어 있는 우수하다고 알려진 몇 가지 대표 준수계 대체세정제 중 ST100SX와 750H가 고활성 플럭스에 대한 세정력이 우수한 성능을 나타냈으나 기존의 1,1,1-TCE에 비해서는 현저히 떨어짐을 확인할 수 있었다.

• 한국재료학회지
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• 제31권2호
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• pp.97-100
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• 2021

We report the effect of Standard Clean-1 (SC-1) cleaning to remove residual Ti layers after silicidation to prevent Al diffusion into Si wafer for Ti Schottky barrier diodes (Ti-SBD). Regardless of SC-1 cleaning, the presence of oxygen atoms is confirmed by Auger electron spectroscopy (AES) depth profile analysis between Al and Ti-silicide layers. Al atoms at the interface of Ti-silicide and Si wafer are detected, when the SC-1 cleaning is not conducted after rapid thermal annealing. On the other hand, Al atoms are not found at the interface of Ti-SBD after executing SC-1 cleaning. Al diffusion into the interface between Ti-silicide and Si wafer may be caused by thermal stress at the Ti-silicide layer. The difference of the thermal expansion coefficients of Ti and Ti-silicide gives rise to thermal stress at the interface during the Al layer deposition and sintering processes. Although a longer sintering time is conducted for Ti-SBD, the Al atoms do not diffuse into the surface of the Si wafer. Therefore, the removal of the Ti layer by the SC-1 cleaning can prevent Al diffusion for Ti-SBD.

• 반도체디스플레이기술학회지
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• 제22권2호
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• pp.17-23
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• 2023

In semiconductor manufacturing processes, a cleaning process is important that can remove sub-micron particles. Conventional wet cleaning methods using chemical have limits in removing nano-particles. Thus, physical forces of a mechanical vibration up to 1 MHz frequency, was tried to aid in detaching them from the substrates. In this article, we developed a 1 MHz quartz megasonic for a bare wafer cleaning using finite element analysis. At first, a 1 MHz megasonic prototype was manufactured. Using the results, a main product which can improve a particle removal performance, was analyzed and designed. The maximum impedance frequency was 992 kHz, which agreed well with the experimental value of 986 kHz (0.6% error). Acoustic pressure distributions were measured, and the result showed that maximum / average was 400.0~432.4%, and standard deviation / average was 46.4~47.3%. Finally, submicron particles were deposited and cleaned for the assessment of the system performance. As a result, the particle removal efficiency (PRE) was proved to be 92% with 11 W power. Reflecting these results, the developed product might be used in the semiconductor cleaning process.

• 공업화학
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• 제25권5호
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• pp.548-551
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• 2014

기존 유기 세정제의 문제점인 인체 독성을 낮추기 위하여 생분해도 및 $LD_{50}$가 향상된 에테르 및 에스테르 작용기를 동시에 갖는 세정제 4종을 새롭게 합성하였다. 합성한 세정제를 한국기계전기전자시험연구원에서 국가산업표준 방법으로 분석하여 물리적인 성질과 생분해도 및 $LD_{50}$을 측정하고 세정성 평가를 수행하였다. 물성 측정 결과, 물리화학적 성질이 세정제로서 적합한 것으로 확인되었다. 세정력 평가를 위하여 $60{\times}40mm$ 크기의 스테인리스 강 기판에 절삭유, 방청유, 인발유, 윤활유를 각각 기판에 도포하여 합성한 세정제(1-4)에 침적하여 세정력을 평가하였다. 최대 5 min 간 침적하였을 때 절삭유는 96-100%, 방청유에서는 64-72%, 인발유는 59-88%, 윤활유는 72-84% 정도의 높은 세정력을 보였다. 또한 세정제(1-4)의 생분해도 99% 이상, $LD_{50}$ 2,000 mg/kg 이상의 값을 보임으로서 인체에 거의 해가 없는 친환경 세정제임을 확인하였다.

• 한국재료학회지
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• 제4권8호
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• pp.921-926
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• 1994

Gate oxide의 특성은 세정공정에서 사용된 last세정용액에 큰 영향을 받는다. Standard RCA, HF-last, SCI-last, and HF-only 공정들은 gate oxidation하기 전 본 실험에서 행해진 세정공정들이다. 세정공정을 마친 Si기판들은 oxidation furnace에서 $900^{\circ}C$로 thermal oxidation공정을 거치게 된다. 100$\AA$의 gate oxide를 성장시킨 후 lifetime detector, VPD, AAS, SIMS, TEM, 그리고 AFM고 같은 분석장비를 이용하여 oxide의 특성을 평가했다. HF-last와 HF-only 공정에 의해 금속 불순물들이 매우 효과적으로 제거됐음을 알 수 있었다. Oxide의 표면 및 계면 형상은AFM과 TEM 측정을 통하여 관찰하였다. 표면거칠기는 SCI 세정용액을 사용한 splits 실험에서 불균일함이 관찰되었고 HF-only세정공정을 거친 시편 및 계면이 가장 smooth했다.

• 한국산업보건학회지
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• 제15권1호
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• pp.19-26
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• 2005

In previous report, we presented that petroleum based solvents used in dry cleaning shop was almost similar to stoddard solvent defined by ACGIH and NIOSH, and the occupational exposure standard of stoddard solvent could be used in total exposure assessment of those solvents. The specific aim of the this study was to evaluate of the solvent exposure used in commercial dry cleaning shops by using occupational exposure standard of stoddard solvent. We conducted first survey of 8 self-employed dry cleaning shops and 5 factory type dry cleaning shops from July to August, and second survey of the same shops from October to November in 2002. The exposure concentration to the solvent during loading and unloading activity of vented dry cleaning machine was 489.2ppm(GM), 270.3ppm(GM), respectively, which was almost excursion limit(500ppm) of ACGIH, and exceed the ceiling limit(312ppm) of NIOSH. The time-weighted average (TWA) worker exposure to the solvent was 21.3ppm(GM) at self-employed shops, 20.7ppm(GM) at factory type shops on first survey, and 31.1ppm(GM), 33.7ppm(GM), respectively on second survey. The TWA exposure concentration of workers with spotting and cleaning machine operating job was 25.4ppm(GM), which was 2.9 times higher than the TWA exposure concentration, 8.8ppm(GM) of press workers. All TWA exposure concentrations was lower than OEL(100ppm) of stoddard solvent. We found that the most heavy exposure process at dry cleaning was loading, unloading process, and the vent of dry cleaning machine was the main emission source for workers exposure to petroleum based solvent.

• 동력기계공학회지
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• 제18권1호
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• pp.63-68
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• 2014

The numerical analysis of fluid flow in the tube cleaning system is examined. The working flow used in this study is seawater, and the temperature change is not considered as the temperature change of seawater in the tube cleaning system is negligible. Also, the analysis is performed under the assumption of steady state. The screens of complicated morphologies are simplified for the analysis, and only one fourth of the tube cleaning system is modeled as the system has a symmetrical shape. The velocity inlet boundary condition is employed for the seawater inlet, whereas the outflow boundary condition is employed for two seawater outlets. In applying the outflow boundary condition for the system with more than two outlets, the flow rate can be arbitrarily assigned. In the analysis, the finite-volume method based numerical analysis tool, the pressure based solver, the standard k-$\varepsilon$ model are utilized, and the under relaxation factor is modified appropriately. From the analysis, the distribution of velocity vectors, pressure and path lines are obtained, and the physical characteristics of fluid flow in the tube cleaning system is well-examined.

• 청정기술
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• 제19권2호
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• pp.184-188
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• 2013

기존 탄화수소계 세정제는 낮은 인화점으로 인하여 화재, 폭발과 같은 문제점을 가지고 있다. 인화점을 높이기 위해 불소가 포함된 난연성 세정제 7종을 개발하였다. 새롭게 합성한 세정제를 한국석유관리원에서 국가산업표준 방법으로 분석하여 물성을 측정하고 세정성 평가를 수행하였다. 물성 측정 결과, 인화점이 탄화수소계 세정제보다 높은 것을 확인하였다. 세정력 평가를 위하여 가로 60 mm, 세로 40 mm 크기의 스테인리스강 기판에 인발유, 아비에트산, 절삭유, 윤활유를 각각 도포하여 합성한 세정제(1~7)에 넣어 침적한 후 세정력을 평가하였다. 최대 5분간 침적하였을 때 인발유는 80~96%, 아비에트산은 82~97%, 윤활유는 86~93% 정도의 높은 세정력을 보였다. 그러나 절삭유에서는 60~87% 정도로 다른 오일보다 낮은 세정력을 보였다. 따라서 약간의 차이는 있지만 대체적으로 우수한 세정력을 보여 산업세정분야에 적용이 가능함을 나타내었다.

• 반도체디스플레이기술학회지
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• 제23권2호
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• pp.114-122
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• 2024

NF₃, Chamber cleaning gas, has a high Global Warming Potential (GWP) of 17,000, causing significant greenhouse effects. Reducing gas usage during the cleaning process is crucial while increasing the cleaning Rate and reducing cleaning standard deviation (Stdev). In a previous study with a 6-inch PECVD chamber, a multiple linear regression analysis showed that Power and Pressure had no significant effect on the cleaning Rate because of their P-values of 0.42 and 0.68. The weight for Flow is 11.55, and the weights for Power and Pressure are 1.4 and 0.7. Due to the limitations of the research equipment, which differed from those used in actual industrial settings, it was challenging to assess the effects in actual industrial environment. Therefore, to show an actual industrial environment, we conducted the cleaning process on a 12-inch PECVD chamber, which is production-level equipment, and quantitatively analyzed the effects of each variable. Power, Pressure, and NF3 Flow all had P-values close to 0, indicating strong statistical significance. The weight for Flow is 15.68, and the weights for Power and Pressure are 4.45 and 5.24, respectively, showing effects 3 and 7 times greater than those with the 6-inch equipment on the cleaning rate. Additionally, we analyzed the cleaning Stdev and derived that there is a trade-off between increasing the cleaning Rate and reducing the cleaning Stdev.