• Journal of the Korean Society of Manufacturing Process Engineers
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• v.18 no.1
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• pp.101-108
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• 2019

In this study, the hole-cavity resonance technology and the micro pore stainless chip sintering technology were fused to develop silencers with excellent noise attenuation performance even at fluid pressures exceeding 30 bar for the first time at home and abroad. As a result of this study, the noise attenuation performance was greatly improved as reflection, loss, and resonance were made to occur thousands of times simultaneously when fluids pass through the sintered micro pore stainless steel chip sound absorber. The noise of the gas emitted from the bomb without the silencer was shown to be 125dB. And noise test conducted after installation of the silencer showed the noise of 67dB. Given the study results, the amount of noise was greatly reduced in the sintered silencer.

• Journal of Sensor Science and Technology
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• v.11 no.3
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• pp.138-144
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• 2002

The silicon piezoresistive pressure sensor is made by semiconductor process to obtain stainless steel isolated type pressure sensor. The sensor is loaded on a stainless steel housing with glass molding, $50\;{\mu}m$ stainless steel thin film is welded, and the stainless steel housing encapsulated by silicone oil. The performance of fabricated the pressure sensor has 10 bar pressure range. The XTR105 of exclusive transmitter chip is used the pressure transmitter that output current is 4 - 20 mA. The accuracy is ${\pm}5%$ FS, however, the accuracy is ${\pm}1%$ FS when the sensor is compensated temperature.

• Proceedings of the KSME Conference
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• 2007.05a
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• pp.1517-1521
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• 2007

On this study, technical aspects were reviewed to drill a series of micro holes (${\phi}$0.10) over 200 within a few micron tolerance in diameter and position on the stainless steel material. Dedicated tools & jigs were designed and manufactured and optimum cutting conditions were found. On this micro hole drilling process, guide drill and step feeding were applied to help chip discharge, prevent drill breakage and finally improve the accuracy of positioning and roundness. The processing results indicated that most holes are distributed within a few micron tolerance in diameter and position intervals.

• Journal of Welding and Joining
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• v.25 no.2
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• pp.76-81
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• 2007

Solder bumps have been used to interconnect the chip and substrate, and the size of the solder bump decreases below $100{\mu}m$ to accommodate higher packaging density. In order to fabricate solder bumps, a mold to chip transfer process is suggested in this work. Since the thin stainless steel mold is not wet by the solder, the molten solder is forced to fill the mold cavities with ultrasonic vibration. The solders within the mold cavities are transferred to the Cu pads on the polyimide film through reflow soldering.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.7 no.4
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• pp.56-61
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• 2008

Cropping metal materials is widely used for feeding processes of various forming method, such as forging, extrusion, drawing, and upsetting. However, cropping has many weak points, which are material loss in part of cutting, chip creation, and much use of lubrication oil, etc. In this study, instead of cropping, a novel process is proposed to cut metal materials, especially stainless steel bar which is known very difficult to crop. Results of FE-analysis will be shown to verify the proposed method comparing with those of the conventional cropping process. Also, fitting products were successfully forged using the fabricated billet by the proposed process.

• Journal of the Korean Society for Precision Engineering
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• v.17 no.11
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• pp.55-62
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• 2000

The poor machinability material such as austenite stainless steel(STS304) is emphasized on the wide use of HSSE for the tapping operation. The difficulty can be entirely to tapping torque due to chip formation through the hole of tap. The object of this study is to investigate tap geometry affecting the tapping torque from a practical point of view. The study shows that the optima tapping torque is affected by the tap geometry and cutting condition for STS304.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.30 no.10 s.253
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• pp.957-965
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• 2006

A high-performance hot chuck is designed as a heating device for an ultra-precision flip-chip bonder with infrared alignment system. Analysis of design requirements for thermal performance leads to a radiative heating mechanism employing two halogen lamps as heating source. The heating tool is made of silicon carbide characterized by high thermal diffusivity and small thermal expansion coefficient. Experimental tests are performed to assess heat-up performance and temperature uniformity of the heating tool. It is revealed that the initial design of hot chuck results in a good heat-up speed but there exist a couple of troubles associated with control and integrity of the device. As a means to resolve the raised issues, a revised version of heating tool is proposed, which consists of a working plate made of silicon carbide and a supporting structure made of stainless steel. The advantages of this two-body heating tool are discussed and the improved features are verified experimentally.

• Food Science and Biotechnology
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• v.16 no.2
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• pp.315-319
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• 2007

Biofilm formation on various surfaces is a well-known phenomenon and it has caused pollution problems, health and safety hazards, and substantial economic loss in many areas including the food industry. In the present study, Gamma irradiation at a dose of 2.0 kGy reduced the bacterial counts of Staphylococcus aureus and Pseudomonas aeruginosa suspensions by 6.7 and >6.5 log CFU/mL, respectively, and 30 ppm of sodium hypochlorite effectively reduced the counts of both bacterial suspensions to below the limit of detection ($<2\;log\;CFU/cm^2$). However, in bacterial biofilms attached to stainless steel, gamma irradiation at a dose of 10.0 kGy reduced the counts of S. aureus attached fur 1 hr and overnight by ${\geq}5.1\;and\;5.0\;log\;CFU/cm^2$, respectively. Gamma irradiation at a dose of 1.0 kGy reduced the counts of P. aeruginosa counts to below the limit of detection ($<2\;log\;CFU/cm^2$). On the contrary, S. aureus and P. aeruginosa cells attached to stainless steel chips were difficult to eliminate using sodium hypochlorite. Four hundred ppm of sodium hypochlorite reduced the counts of S. aureus and P. aeruginosa attached for 1 hr by 2.5 and $3.3\;log\;CFU/cm^2$, respectively.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.16 no.4
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• pp.2430-2435
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• 2015

In order to achieve high flexibility in manufacture, analysis of chip's shape is one of the most important problems. This paper describes the change of machining characteristics in workpiece materials depending on turning clearance angle. The experiments start from choosing three workpiece materials that are SM45C(machine structural carbon steel), STS303(stainless steel), SCM415 (chrome-molybdenum steel). Then, the experiments show specifically how features of selected materials changed when they were processed with diverse machining depths and with feed rate starting from fixed rotational speed. Especially, the experiments were also analyzed in chip's shape and wear of insert tip. In conclusion, these experiments show that chip's shape was changed by quality of the materials, depth of cut, and conveying speed. When machining feedrate and machining depth were 0.10mm/rev and 0.3mm respectively, workpiece materials showed the best shapes, not categorizing quality of the materials and machining characteristics.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.10 no.4
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• pp.57-63
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• 2011

The aim of this study is to analyze turning process using commercial FEM simulation code. Various simulation models of orthogonal cutting process for 3 layers of metallic material have been simulated and analyzed. The workpiece material used for the orthogonal plane-strain metal cutting simulation consists of three layers, which are Allow Tool Steel, Aluminum and Stainless Steel. The finite element model is composed of a deformable workpiece and a rigid tool. The tool penetrates through the workpiece at a constant speed and constant feed rate. As an analytical result, detailed cutting temperature, strain, pressure, residual stress for both a tool and each layer of workpiece were obtained during the turning process. It has been closely observed that the chip flow curve deforms continuously.