• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2005.09a
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• pp.67-88
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• 2005

Mold-Flow 3 Die Stack CSP of Mold array packaging with different Gate types. As high density package option such as 3 or 4 die stacking technologies are developed, the major concerning points of mold related qualities such as incomplete mold, exposed wires and wire sweeping issues are increased because of its narrow space between die top and mold surface and higher wiring density. Full 3D rheokinetic simulation of Mold flow for 3 die stacking structure case was done with the rheological parameters acquired from Slit-Die rheometer and DSC of commercial EMC. The center gate showed severe void but corner gate showed relatively better void performance. But in case of wire sweeping related, the center gate type showed less wire sweeping than corner gate types. From the simulation results, corner gate types showed increased velocity, shear stress and mold pressure near the gate and final filling zone. The experimental Case study and the Mold flow simulation showed good agreement on the mold void and wire sweeping related prediction. Full 3D simulation methodologies with proper rheokinetic material characterization by thermal and rheological instruments enable the prediction of micro-scale mold filling behavior in the multi die stacking and other complicated packaging structures for the future application.

• Geophysics and Geophysical Exploration
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• v.19 no.1
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• pp.11-19
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• 2016

Two representative residual static methods of traveltime decomposition and stack-power maximization are discussed in terms of application to land seismic data. For the model data with synthetic shot/receiver statics (time shift) applied and random noises added, continuities of reflection event are much improved by stack-power maximization method, resulting the derived time-shifts approximately equal to the synthetic statics. Optimal parameters (maximum allowable shift, correlation window, iteration number) for residual statics are effectively chosen with diagnostic displays of CSP (common shot point) stack and CRP (common receiver point) stack as well as CMP gather. In addition to removal of long-wavelength time shift by refraction statics, prior to residual statics, processing steps of f-k filter, predictive deconvolution and time variant spectral whitening are employed to attenuate noises and thereby to minimize the error during the correlation process. The reflectors including horizontal layer of reservoir are more clearly shown in the variable-density section through repicking the velocities after residual statics and inverse NMO correction.

• The Journal of Engineering Geology
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• v.28 no.3
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• pp.465-473
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• 2018

The application of singular value decomposition (SVD) filtering is examined for attenuation of the ground-roll in land seismic data. Prior to the SVD computation to seek singular values containing the highly correlatable reflection energy, processing steps such as automatic gain control, elevation and refraction statics, NMO correction, and residual statics are performed to enhance the horizontal correlationships and continuities of reflections. Optimal parameters of SVD filtering are effectively chosen with diagnostic display of inverse NMO (INMO) corrected CSP (common shot point) gather. On the field data with dispersion of ground-roll overwhelmed, continuities of reflection events are much improved by SVD filtering than f-k filtering by eliminating the ground-roll with preserving the low-frequency reflections. This is well explained in the average amplitude spectra of the f-k and SVD filtered data. The reflectors including horizontal layer of the reservoir are much clearer on the stack section, with laminated events by SVD filtering and subsequent processing steps of spiking deconvolution and time-variant spectral whitening.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.20 no.4
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• pp.503-509
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• 2019

The demand for smaller, faster, and multi-functional mobile devices in increasing at a rapidly increasing rate. In response to these trends, Stacked Chip Scale Package (SCSP) is used widely in the assembly industry. A film type adhesive called die attach film (DAF) is used widely for bonding chips in SCSP. The DAF requires high flowability at high die attachment temperatures for bonding chips on organic substrates, where the DAF needs to feel the gap depth, or for bonding the same sized dies, where the DAF needs to penetrate bonding wires. In this study, the mixture design of experiment (DOE) was performed for three raw materials to obtain the optimized DAF recipe for low elastic modulus at high temperature. Three components are acrylic polymer (SG-P3) and two solid epoxy resins (YD011 and YDCN500-1P) with different softening points. According to the DOE results, the elastic modulus at high temperature was influenced greatly by SG-P3. The elastic modulus at $100^{\circ}C$ decreased from 1.0 MPa to 0.2 MPa as the amount of SG-P3 was decreased by 20%. In contrast, the elastic modulus at room temperature was dominated by YD011, an epoxy with a higher softening point. The optimized DAF recipe showed approximately 98.4% pickup performance when a UV dicing tape was used. A DAF crack that occurred in curing was effectively suppressed through optimization of the cure accelerator amount and two-step cure schedule. The imizadole type accelerator showed better performance than the amine type accelerator.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.21 no.12
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• pp.261-267
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• 2020

The demand for faster, lighter, and thinner portable electronic devices has brought about a change in semiconductor packaging technology. In response, a stacked chip-scale package(SCSP) is used widely in the assembly industry. One of the key materials for SCSP is a die-attach film (DAF). Excellent flowability is needed for DAF for successful die attachment without voids. For DAF with high flowability, two-step curing is often required to reduce a cure crack, but one-step curing is needed to reduce the processing time. In this study, DAF composition was categorized into three groups: cure (epoxy resins), soft (rubbers), hard (phenoxy resin, silica) component. The effect of the composition on a cure crack was examined when one-step curing was applied. The die-attach void and flowability were also assessed. The cure crack decreased as the amount of hard components decreased. Die-attach voids also decreased as the amount of hard components decreased. Moreover, the decrease in cure component became important when the amount of hard component was small. The flowability was evaluated using high-temperature storage modulus and bleed-out. A decrease in the amount of hard components was critical for the low storage modulus at 100℃. An increase in cure component and a decrease in hard component were important for the high bleed-out at 120℃(BL-120).