• Korean Journal of Computational Design and Engineering
• /
• v.17 no.6
• /
• pp.398-408
• /
• 2012

This paper investigates the tolerance stack-up in a commercial sliding-type mobile phone model developed by a Korean electronics company, with focus on the dimensional quality of the gap between the sliding top and the main body. The tolerance analysis in this study is done using a commercial software package, which runs Monte Carlo simulations to produce the statistical distributions of the gap size at desired locations. Such an analysis revealed that the original design did not yield the desired dimensional quality of the gap. Through a series of systematic analyses and syntheses, an improved design is proposed for the nominal dimensions and tolerances of selected features of the parts. The proposed design was validated, through tolerance analysis simulation, to meet the desired requirement of the gap quality.

• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
• /
• v.11 no.1
• /
• pp.11-16
• /
• 2005

Fruits are subjected to complex dynamic stresses in the transportation environment. During a long journey form the production area to markets, there is always some degree of vibration present. Vibration inputs are transmitted from the vehicle through the packaging to the fruit. Inside, these cause sustained bouncing of fruits against each other and container wall. These steady state vibration input may cause serious fruit injury, and this damage is particularly severe whenever the fruit inside the package is free to bounce, and is vibrated at its resonance frequency. The determination of the resonant frequencies of the fruit may help the packaging designer to determine the proper packaging system providing adequate protection for the fruit, and to understand the complex interaction between the components of fruit when they relate to expected transportation vibration inputs. The first frequency of the pear in packaged freight be stacked in resonance frequency band of the pear packaged freight was increased from the bottom to the top of the stack but the second frequency of that in resonance frequency band of the pear was decreased. This indicated that the high damage score of the pear in bottom tier in vibration test was due to higher acceleration level in resonance frequency band of the pear.

• Journal of the Korea Academia-Industrial cooperation Society
• /
• v.20 no.4
• /
• pp.503-509
• /
• 2019

The demand for smaller, faster, and multi-functional mobile devices in increasing at a rapidly increasing rate. In response to these trends, Stacked Chip Scale Package (SCSP) is used widely in the assembly industry. A film type adhesive called die attach film (DAF) is used widely for bonding chips in SCSP. The DAF requires high flowability at high die attachment temperatures for bonding chips on organic substrates, where the DAF needs to feel the gap depth, or for bonding the same sized dies, where the DAF needs to penetrate bonding wires. In this study, the mixture design of experiment (DOE) was performed for three raw materials to obtain the optimized DAF recipe for low elastic modulus at high temperature. Three components are acrylic polymer (SG-P3) and two solid epoxy resins (YD011 and YDCN500-1P) with different softening points. According to the DOE results, the elastic modulus at high temperature was influenced greatly by SG-P3. The elastic modulus at $100^{\circ}C$ decreased from 1.0 MPa to 0.2 MPa as the amount of SG-P3 was decreased by 20%. In contrast, the elastic modulus at room temperature was dominated by YD011, an epoxy with a higher softening point. The optimized DAF recipe showed approximately 98.4% pickup performance when a UV dicing tape was used. A DAF crack that occurred in curing was effectively suppressed through optimization of the cure accelerator amount and two-step cure schedule. The imizadole type accelerator showed better performance than the amine type accelerator.

• Journal of the Korea Academia-Industrial cooperation Society
• /
• v.21 no.12
• /
• pp.261-267
• /
• 2020

The demand for faster, lighter, and thinner portable electronic devices has brought about a change in semiconductor packaging technology. In response, a stacked chip-scale package(SCSP) is used widely in the assembly industry. One of the key materials for SCSP is a die-attach film (DAF). Excellent flowability is needed for DAF for successful die attachment without voids. For DAF with high flowability, two-step curing is often required to reduce a cure crack, but one-step curing is needed to reduce the processing time. In this study, DAF composition was categorized into three groups: cure (epoxy resins), soft (rubbers), hard (phenoxy resin, silica) component. The effect of the composition on a cure crack was examined when one-step curing was applied. The die-attach void and flowability were also assessed. The cure crack decreased as the amount of hard components decreased. Die-attach voids also decreased as the amount of hard components decreased. Moreover, the decrease in cure component became important when the amount of hard component was small. The flowability was evaluated using high-temperature storage modulus and bleed-out. A decrease in the amount of hard components was critical for the low storage modulus at 100℃. An increase in cure component and a decrease in hard component were important for the high bleed-out at 120℃(BL-120).

• 한국신재생에너지학회:학술대회논문집
• /
• 2009.06a
• /
• pp.323-327
• /
• 2009

To extract hydrogen for stack, fuels such as LPG and LNG were reformed in the fuel processor, which is comprised of desulfurizer, reformer, shift converter, CO remover and steam generator. All elements of fuel processor are integrated in a single package. Highly active catalysts (desulfurizing adsorbent, reforming catalyst, CO shift catalyst, CO removal catalyst) and the various burners were developed and evaluated in this study. The performance of the developed catalysts and the commercial ones was similar. 1 kW, 5 kW class fuel processor systems using the developed catalyst and burner showed efficiency of 75 %(LHV, for LNG). The start-up time of the 1 kW class fuel processor was less than 50 minutes and its volume including insulation was about 30 l. The start-up time of 3 kW and 5 kW class fuel processors with the volume of 90 l and 150 l, respectively, was about 60 minutes. In the case of LPG fuel, efficiency, volume and start-up time of 1kW class fuel processor showed 73 %(LHV), < 60 l and < 60 min, respectively. Advanced fuel processor showed more highly efficiency and shorter start-up time due to the improvement of heat exchanger and operating method. 1 kW and 3 kW class fuel processors have been evaluated for reliability and durability including with on/off test of developed catalysts and burner.