• Title/Summary/Keyword: SrTiO3

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Microstructure and Dielectric Properties of SCT Thin Film with Annealing Temperature (열처리 온도에 따른 SCT 박막의 미세구조 및 유전특성)

  • 김진사;조춘남;신철기;박건호;최운식;이성일;이준웅
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 1999.11a
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    • pp.244-247
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    • 1999
  • The(Sr$\sub$0.85/Ca$\sub$0.15/) TiO$_3$(SCT) thin films are deposited on Pt-coated electrode(Pt/TiN/SiO$_2$/Si) using RF sputtering method. The composition of SCT thin films deposited on Si substrate at room temperature is close to stoichiometry(1.102 in A/B ratio). Also, SCT thin films deposited on Pt-coated electrodes have the cubic perovskite structure and polycrystalline state. The maximum dielectric constant of SCT thin films is obtained by annealing at 600[$^{\circ}C$].The dielectric constant changes almost linearly in temperature ranges of -80~+90[$^{\circ}C$].

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Ferroelectric Properties of Pb[(Zr,Sn)Ti]N$bO_3$ Thin Films by Annealing (열처리에 따른 Pb[(Zr,Sn)Ti]N$bO_3$ 박막의 강유전 특성)

  • Choe, U-Chang;Choe, Hyeok-Hwan;Lee, Myeong-Gyo;Gwon, Tae-Ha
    • Journal of the Institute of Electronics Engineers of Korea SD
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    • v.38 no.7
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    • pp.473-478
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    • 2001
  • Ferroelectric P $b_{0.99}$[(Z $r_{0}$ 6S $n_{0.4}$)/0.9/ $Ti_{0.1}$]0.98/N $b_{0.02}$ $O_3$(PNZST) thin films were deposited by a RF magnetron sputtering on L $a_{0.5}$S $r_{0.5}$Co $O_3$(LSCO)/Pt/Ti/ $SiO_2$/Si substrate using a PNZST target with excess PbO of 10 mole%. The crystallinity and electrical properties of the thin films annealed at various temperature and time were investigated. The thin films deposited at the substrate temperature of 500 $^{\circ}C$ and the power of 80 W were crystallized to a perovskite phase after rapid thermal annealing(RTA). The thin films annealed at 650 $^{\circ}C$ for 10 seconds in air exhibited the good crystal structures. The remanent polarization and coercive field of the PNZST capacitor were about 20 $\mu$C/$\textrm{cm}^2$ and 50 kV/cm, respectively. The reduction of the polarization after 2.2$\times$10$^{9}$ switching cycles was less than 10 %..10 %......

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A study on the single buffer layers for the application of $YBa_{2}$$Cu_{3}$$O_{7-\delta}$ coated conductors (Y$Ba_{2}$$Cu_{3}$$O_{7-\delta}$ coated conductors의 응용을 위한 단일완충층에 대한 연구)

  • ;;;Donggi Shi
    • Proceedings of the Korea Institute of Applied Superconductivity and Cryogenics Conference
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    • 2003.10a
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    • pp.120-122
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    • 2003
  • BaZrO$_3$and SrTiO$_3$(STO) thin films were Pulsed laser deposited on biaxially textured Ni and Ni-W alloy substrates to be used as single buffer layer for coated conductor. The texture of the films were analysed using the GADDS (general area detector diffraction system). Both films deposited on the metal tape were strongly (001) oriented, and in-plane textured (Δø (BZO) =9$^{\circ}$, Δø (STO) = 10$^{\circ}$).

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Characterization and Fabrication of La(Sr)Fe(Co)O3-δ Infiltrated Cathode Support-Type Solid Oxide Fuel Cells (La(Sr)Fe(Co)O3-δ 침지법을 이용한 양극 지지형 SOFC 제조 및 출력 특성)

  • Hwang, Kuk-Jin;Kim, Min Kyu;Kim, Hanbit;Shin, Tae Ho
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.32 no.6
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    • pp.501-506
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    • 2019
  • To overcome the limitations of the conventional Ni anode-supported SOFCs, various types of ceramic anodes have been studied. However, these ceramic anodes are difficult to commercialize because of their low cell performances and difficulty in manufacturing anode-support typed SOFCs. Therefore, in this study, to use these ceramic anodes and take advantage of anode-supported SOFC, which can minimize ohmic loss from the thin electrolyte, we fabricated cathode support-typed SOFC. The cathode-support of LSCF-YSZ was prepared by the acid treatment of conventional Ni-YSZ (Yttria-stabilized Zirconia) anode-support, followed by the infiltration of LSCF to YSZ scaffold. The composite of $La(Sr)Ti(Ni)O_3$ and $Ce(Mn,Fe)O_2$ was used as the ceramic anode. The fabricated cathode-supported button cell showed a relatively low power density of $0.207Wcm^{-2}$ at $850^{\circ}C$; however, it is expected to show better performance through the optimization of the infiltration rate and thickness of LSCF-YSZ cathode-support layer.

Piezoelectric and Dielectric Characteristics of Low Temperature Sintering PMgN-PMnN-PZT Ceramics (저온소결 PMgN-PMnN-PZT 세라믹스의 압전 및 유전 특성)

  • Lee, Sang-Ho;Yoo, Ju-Hyun;Hong, Jae-Il;Chung, Kwang-Hyun;Jeong, Young-Ho
    • Proceedings of the KIEE Conference
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    • 2006.07c
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    • pp.1400-1401
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    • 2006
  • In this study, in order to develop low temperature sintering piezoelectric ceramics for multilayer piezoelectric actuator, $PbSr(Mn_{1/3}Nb_{2/3})O_3-(Mg_{1/3}Nb_{2/3})O_3-(ZrTi)O_3$ ceramics were fabricated using $Na_{2}CO_{3}-Li_{2}CO_{3}$ as sintering aids and their piezoelectric and dielectric characteristics were investigated according to the sintering tempo rature. At the sintering temperature of $900^{\circ}C$, the density, electrom echanical coupling factor(kp), mechanical quality factor(Qm) and dielectric constant(${\varepsilon}r$) of specimen showed the optimum value of $7.730[g/cm^2]$, 0.552, 1134, 1492 and 330[pC/N], respectively.

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Ruthenium Thin Films Grown by Atomic Layer Deposition

  • Shin, Woong-Chul;Choi, Kyu-Jeong;Jung, Hyun-June;Yoon, Soon-Gil;Kim, Soo-Hyun
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2008.11a
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    • pp.12-12
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    • 2008
  • Ruthenium is one of the noble metals having good thermal and chemical stability, low resistivity, and relatively high work function(4.71eV). Because of these good physical, chemical, and electrical properties, Ru thin films have been extensively studied for various applications in semiconductor devices such as gate electrode for FET, capacitor electrodes for dynamic random access memories(DRAMs) with high-k dielectrics such as $Ta_2O_5$ and (Ba,Sr)$TiO_3$, and capacitor electrode for ferroelectric random access memories(FRAMs) with Pb(Zr,Ti)$O_3$. Additionally, Ru thin films have been studied for copper(Cu) seed layers for Cu electrochemical plating(ECP) in metallization process because of its good adhesion to and immiscibility with Cu. We investigated Ru thin films by thermal ALD with various deposition parameters such as deposition temperature, oxygen flow rate, and source pulse time. Ru thin films were grown by ALD(Lucida D100, NCD Co.) using RuDi as precursor and $O_2$ gas as a reactant at 200~$350^{\circ}C$.

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