• Proceedings of the Korean Society of Precision Engineering Conference
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• 2011.06a
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• pp.623-624
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• 2011

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2003.06a
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• pp.969-974
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• 2003

A simple and cost-effective method for the electrostatic suspension of thin plates like silicon wafers is proposed which is based on a switched voltage control scheme. It operates according to a relay feedback control and deploys only a single high-voltage power supply that can deliver a dc voltage of positive and/or negative polarity. This method possesses the unique feature that no high-voltage amplifiers are needed which leads to a remarkable system simplification relative to conventional methods. It is shown that despite the inherent limit cycle property of the relay feedback based control, an excellent performance in vibration suppression is attained due to the presence of a relatively large squeeze film damping origination from the air between the electrodes and levitated object. Using this scheme, a 4-inch silicon wafer was levitated stably with airgap variation decreasing down to 1 $\mu\textrm{m}$ at an airgap of 100 $\mu\textrm{m}$

• Journal of the Korean Society for Precision Engineering
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• v.22 no.10 s.175
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• pp.56-64
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• 2005

A simple and cost-effective method for the electrostatic suspension of thin plates like silicon wafers is proposed which is based on a switched voltage control scheme. It operates according to a relay feedback control and deploys only a single high-voltage power supply that can deliver a DC voltage of positive and/or negative polarity. This method possesses the unique feature that no high-voltage amplifiers are needed which leads to a remarkable system simplification relative to conventional methods. It is shown that despite the inherent limit cycle property of the relay feedback based control, an excellent performance in vibration suppression is attained due to the presence of a relatively large squeeze film damping origination from the air between the electrodes and levitated object. Using this scheme, a 4-inch silicon wafer was levitated stably with airgap variation decreasing down to $1 {\mu}m$ at an airgap of $100{\mu}m$.

• Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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• 2001.05a
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• pp.521-527
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• 2001

The dynamic performance analyses and tests for a 50kW turbo-generator (KIMM-TG50) were carried out. The operating concept of this machine is that it gets the initial driving force from the built-in motor-generator until it reaches its self-sustaining speed of 40,000 rpm, and then the driving mode is changed to self-operating mode by the combustor installed between the centrifugal compressor and the turbine. Due to winding mistake of motor-generator, the system could go only up to 22000 rpm by the motor so that high pressure air externally fed into the turbine was utilized to get the system to run up to 62,000 rpm thereafter. The vibration data collected during the tests revealed that the first bending critical speed is in near 5,600 rpm as predicted in the design stage of the rotor-bearing system, and that there were no other identifiable critical speeds up until 62,000 rpm due to high damping from the squeeze film damper-bearings supporting the rotor. This paper presented some of the experimental results along with dynamic performance predictions made in the design stage as a part of progress being made.

• Journal of the Korean Society for Precision Engineering
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• v.23 no.6 s.183
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• pp.166-173
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• 2006

In this study, a probe array has been developed for use in a data storage device that is based on scanning probe microscope (SPM) and MEMS technology. When recording data bits by poling the PZT thin layer and reading them by sensing its piezoresponse, commercial probes of which the tip heights are typically shorter than $3{\mu}m$ raise a problem due to the electrostatic forces occurring between the probe body and the bottom electrode of a medium. In order to reduce this undesirable effect, a poly-silicon probe with a high aspect-ratio tip was fabricated using a molding technique. Poly-silicon probes fabricated by the molding technique have several features. The tip can be protected during the subsequent fabrication processes and have a high aspect ratio. The tip radius can be as small as 15 nm because sharpening oxidation process is allowed. To drive the probe, electrostatic actuation mechanism was employed since the fabrication process and driving/sensing circuit is very simple. The natural frequency and DC sensitivity of a fabricated probe were measured to be 18.75 kHz and 16.7 nm/V, respectively. The step response characteristic was investigated as well. Overshoot behavior in the probe movement was hardly observed because of large squeeze film air damping forces. Therefore, the probe fabricated in this study is considered to be very useful in probe-based data storages since it can stably approach toward the medium and be more robust against external shock.