• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2016.11a
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• pp.157-157
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• 2016

최근 많은 산업의 발전으로 인해 환경오염을 유발시키는 폐수가 다량으로 배출되고 있으며, 이러한 폐수 속에는 유기용매, 고분자 물질 및 각종 염 등의 난분해성 물질들이 다량으로 함유되어 있다. 이런 물질들을 분해시키기 위해 물리적, 생물학적 수처리 방법이 많이 이용되고 있지만 이 방법들은 각각 운전비용과 처리비용이 고가인 단점이 있다. 따라서 비용과 효율 측면에서 효과적인 폐수처리를 위해서 전기화학적 폐수처리 방법이 많이 사용되고 있다. 물리적, 생물학적 처리 방법에 비해 비용이 적게 들고, 처리 후 잔류물이 남지 않으며. 독성을 띄는 산화제의 첨가 없이도 높은 폐수처리 능력을 보이기 때문에 친환경적이므로, 전기화학적 폐수산화 처리에 사용되는 불용성 전극에 대한 연구가 많이 진행되어져 오고 있다. 그 중 BDD(Boron-doped diamond) 전극은 표면에서 강력한 산화제인 수산화 라디칼의 높은 발생량으로 인해 뛰어난 폐수처리 능력을 보이므로 불용성 전극 분야에서 활발한 연구가 진행 중이다. 그러나 기존에 BDD 전극의 기판 모재로 이용되던 Si, W, Pb등은 모두 기계적 강도. 폐수처리 능력 및 독성 문제로 인해 한계가 있었고, 특히 Nb기판 위에 형성시킨 BDD 전극은 뛰어난 폐수처리 능력에도 불구하고 비싼 모재 원가로 인해 상용화가 힘든 실정이다. 이런 문제점을 해결하기 위해 높은 기계적 강도와 전기화학적 안정성을 가진 Ti 기판을 사용한 BDD 전극에 대한 연구가 보고되고 있다. 그러나 BDD와 Ti 간의 lattice mismatch, BDD층 형성을 위한 고온 공정 시 탄소의 확산으로 인한 기판 표면에서의 TiC층 형성으로 인해 접착력이 감소하여 박리가 생기는 문제점이 있다. BDD와 Ti의 접착력을 향상시키기 위해 융점이 높고, 전기전도성이 우수한 TiN을 diffusion barrier layer로 삽입하면 탄소 확산에 의한 TiC층의 생성을 억제하여, 내부응력에 기인한 접착력 감소를 방지할 수 있다. 또 하나의 방법으로 Ti 기판의 전처리를 통해 BDD층의 접착력을 향상 시킬 수 있다. Sanding과 etching을 통해 기판 표면의 물리, 화학적인 표면조도를 부여하고, seeding을 통해 diamond 결정 성장에 도움을 주는 seed 입자를 분포시킴으로써, 중간층과 BDD층의 접착력을 향상시키고, BDD 결정핵 성장을 촉진시켜 고품질의 BDD박막 증착이 가능하다. 본 연구에서는 기존 Si, Nb 등의 기판 모재를 Ti로 대체함으로써 제조원가를 절감시키고, TiN 중간층을 삽입하여 접착력을 향상시킴으로써 기존의 BDD 전극과 동등한 수준의 물성 및 수처리 특성을 가진 BDD전극 제작을 목표로 하였다. $25{\times}25mm$의 Ti 기판위에 TiN 중간층을 DC magnetron sputtering을 이용하여 증착 후, BDD 전극 층을 HFCVD로 증착하였다. 전처리를 진행한 기판과 중간층 및 BDD층의 미세구조를 XRD로 분석하였고, 표면 형상을 SEM으로 확인하였다. BDD전극의 접착력 분석을 통해 TiN 중간층의 최적 조성을 도출하고, 최종적으로 BDD/TiN/Ti 전극의 CV특성과 가폐수의 COD분해능력 및 축산폐수, 선박평형수 등의 실제 폐수 처리 능력을 BDD/Si, BDD/Nb 전극과 비교 검토할 것이다.

• Journal of the Microelectronics and Packaging Society
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• v.12 no.2 s.35
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• pp.111-119
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• 2005

Stack specimen with three dimensional interconnection structure through Cu via of $75{\mu}m$ diameter, $90{\mu}m$ height and $150{\mu}m$ pitch was successfully fabricated using subsequent processes of via hole formation with Deep RIE (reactive ion etching), Cu via filling with pulse-reverse electroplating, Si thinning with CMP, photolithography, metal film sputtering, Cu/Sn bump formation, and flip chip bonding. Contact resistance of Cu/Sn bump and Cu via resistance could be determined ken the slope of the daisy chain resistance vs the number of bump joints of the flip chip specimen containing Cu via. When flip- chip bonded at $270^{\circ}C$ for 2 minutes, the contact resistance of the Cu/Sn bump joints of $100{\times}100{\mu}m$ size was 6.7m$\Omega$ and the Cu via resistance of $75{\mu}m$ diameter, $90{\mu}m$ height was 2.3m$\Omega$.

• Journal of the Microelectronics and Packaging Society
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• v.14 no.1
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• pp.33-38
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• 2007

We studied a bonding at low temperature using polymer bump and Non-Conductive Adhesive (NCA), and studied the reliability of the polymer bump/Al pad joints. The polymer bumps were formed on oxidized Si substrates by photolithography process, and the thin film metals were formed on the polymer bumps using DC magnetron sputtering. The substrate used was AL metallized glass. The polymer bump and Al metallized glass substrates were joined together at $80^{\circ}C$ under various pressure. Two NCAs were applied during joining. Thermal cycling test ($0^{\circ}C-55^{\circ}C$, cycle/30 min) was carried out up to 2000 cycles to evaluate the reliability of the joints. The bondability was evaluated by measuring the contact resistance of the joints through the four point probe method, and the joints were observed by Scanning Electron Microscope (SEM). The contact resistance of the joints was $70-90m{\Omega}$ before the reliability test. The joints of the polymer bump/Al pad were damaged by NCA filler particles under pressure above 200 MPa. After reliability test, some joints were electrically failed since thinner metal layers deposited at the edge of bumps were disconnected.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.38 no.7
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• pp.473-478
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• 2001

Ferroelectric P $b_{0.99}$［(Z $r_{0}$ 6S $n_{0.4}$)/0.9/ $Ti_{0.1}$］0.98/N $b_{0.02}$ $O_3$(PNZST) thin films were deposited by a RF magnetron sputtering on L $a_{0.5}$S $r_{0.5}$Co $O_3$(LSCO)/Pt/Ti/ $SiO_2$/Si substrate using a PNZST target with excess PbO of 10 mole%. The crystallinity and electrical properties of the thin films annealed at various temperature and time were investigated. The thin films deposited at the substrate temperature of 500 $^{\circ}C$ and the power of 80 W were crystallized to a perovskite phase after rapid thermal annealing(RTA). The thin films annealed at 650 $^{\circ}C$ for 10 seconds in air exhibited the good crystal structures. The remanent polarization and coercive field of the PNZST capacitor were about 20 $\mu$C/$\textrm{cm}^2$ and 50 kV/cm, respectively. The reduction of the polarization after 2.2$\times$10$^{9}$ switching cycles was less than 10 %..10 %......

• The Transactions of the Korean Institute of Electrical Engineers C
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• v.51 no.8
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• pp.340-346
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• 2002

Capacitor material utilized in the downsizing passive devices and integration of passive devices requires the physical and electrical properties at given area such as capacitor thickness reduction, relative dielectric constant increase, low leakage current and thermal stability. common capacitor materials, $Al_2O_3$, $SiO_2$, $Si_3N_4$, $SiO_2$/$Si_3N_4$, TaN and et al., used until recently have reached their physical limits in their application to integration of passive devices. $Ta_2O_{5}$ is known to be a good alternative to the existing materials for the capacitor application because of its high dielectric constant (25~35), low leakage current and high breakdown strength. Despite the numerous investigations of $Ta_2O_{5}$ material, there have little been established the clear understanding of the annealing effect on capacitance characteristic and conduction mechanism. This study presents the dielectric properties $Ta_2O_{5}$ MIM capacitor structure Processed by $O_2$ RTA oxidation. X-ray diffraction patterns showed the existence of amorphous phase in $600^{\circ}C$ annealing under the $O_2$ RTA and the formation of preferentially oriented-$Ta_2O_{5}$ in 650, $700^{\circ}C$ annealing and the AES depth profile showed $O_2$ RTA oxidation effect gives rise to the $O_2$ deficientd into the new layer. The leakage current density respectively, at 3~1l$\times$$10_{-2}$(kV/cm) were $10_{-3}$~$10_{-6}$(A/$\textrm{cm}^2$). In addition, behavior is stable irrespective of applied electric field. the frequency vs capacitance characteristic enhanced stability more then $Ta_2O_{5}$ thin films obtained by $O_2$ reactive sputtering. The capacitance vs voltage measurement that, Vfb(flat-band voltage) was increase dependance on the $O_2$ RTA oxidation temperature.

• Journal of the Korean Magnetics Society
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• v.8 no.3
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• pp.156-160
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• 1998

Crystal structures and magneto-optical properties of $(Mn_{0.5-Z}Sb_{0.5+Z})_{100-y}Pt_y$ (0$(Mn_{0.5-Z}Sb_{0.5+Z})_{100-y}Ag_y$ (0$^{\circ}C$ are C1b-type with fcc and NiAs-type with hcp, respectively. The MnSbAg films have a texture which the c-axis orientation is perpendicular to the film plane by annealing at 300 $^{\circ}C$ for less than 3 hours. The perpendicular anisotropy constants of the $Mn_{47.4}Sb_{47.5}Ag_{5.1}$ film annealed at 300 $^{\circ}C$ for 3 hours are $K_1=6.6{\times}10^5 \; erg/cm^3\;and\;K_2=1.9{\times}10^5\; erg/cm^3$. The Kerr rotation angle of MnSbPt films increases but that of MnSbAg film decreases by decreasing incident wavelength within the range of 700$\leq$ λ$\leq$1000 nm. High polar Kerr angles of 1.7$^{\circ}$ (λ =700 nm) and 0.6$^{\circ}$ (λ =1000 nm), 0.2$^{\circ}$ (λ =700 nm) and 0.97$^{\circ}$ (λ =1000 nm) have been obtained from $Mn_{41.1}Sb_{44,9}Pt_{14.0}$ and $Mn_{47.4}Sb_{47.5}Ag_{5.1}$ alloy films, respectively.

• Journal of the Korean Magnetics Society
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• v.7 no.5
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• pp.243-248
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• 1997

The effect of $O_2$ partial pressure on microstructure and soft magnetic properties of as-deposited Fe-Hf-O thin film alloys, which are produced by rf magnetron sputtering method in $Ar+O_2$ mixed gas atmosphere, are investigated. Saturation magnetization ($4{\pi}M_s$) of Fe-Hf-O film were decreased with increasing $O_2$ partial pressure, the best soft magnetic properties exhibit at $O_2$ partial pressure of 10%. With further increase of $O_2$ partial pressure, soft magnetic properties decreased continuously. The $Fe_{82}Hf_{3.4}O_{14.6}$ film with $P_{O2}=10%$ exhibits good soft magnetic properties with $4{\pi}M_s=17.7kG$, $H_c=0.7Oe$ and ${\mu}_ {eff}$ (1~100 MHz)=2,500, respectively. The addition of O is effective in grain refinement. In case of $P_{O2}=15%$, it is observed that $Fe_3O_4$ compound is formed and high frequency soft magnetic properties are decrease. The electrical resistvity($\rho$) of Fe-Hf-O film is increased with increasing $O_2$ partial pressure. Electrical resistivity of $Fe_{82}Hf_{3.4}O_{14.6}$ film was 5 times higher than that of the film without oxygen. Thus, it is considered that the good magnetic properties of $Fe_{82}Hf_{3.4}O_{14.6}$ film results from decreasing the $\alpha$-Fe grain size by precipitates (Hf and O), high electrical resistivity.

• Journal of the Korean Magnetics Society
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• v.7 no.5
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• pp.237-242
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• 1997

The microstructure and soft magnetic properties of as-deposited Fe-Hf-O thin film alloys, which are produced at $P_{O2}=10%$ by rf magnetron sputtering method in $Ar+O_2$ mixed gas atmosphere, is investigated. Newly developed $Fe_{82}Hf_{3.4}O_{14.6}$ film exhibits good soft magnetic properties with $4{\pi}M_s=17.7$ kG, $H_c=0.7$ Oe and ${\mu}_{eff}$(0.5~100MHz)=2,500, respectively. The Fe-Hf-O films are composed of $\alpha$-Fe nanograins and amorphous phase with larger amounts of Hf and O elements which chemically combine each other. With increasing Hf area fraction, Hf and O contents increased proportionally. It was considered that O content in films was determined by Hf contents, because O was chemically combined with Hf. It results from decreasing the $\alpha$-Fe grain size by precipitates (Hf and O), high electrical resistivity. The $Fe_{82}Hf_{3.4}O_{14.6}$ film exhibits the quality factor (Q=$\mu$'/$\mu$") of 25 at 20 MHz. These good frequency characteristics are considered to be superior to other films already reported.o other films already reported.

• Journal of the Korean Magnetics Society
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• v.7 no.5
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• pp.250-257
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• 1997

The microstructure and magnetic properties of Fe-Nb-B-N thin film alloys, which produced by rf magnetron sputtering method in $Ar+N_2$ mixed gas atmosphere, were investigated. The $Fe_{70}Nb_{14}B_{11}N_5$ films, annealed at 59$0^{\circ}C$, exhibit soft magnetic properties: $4{\pi}M_s=16.5kG$ , $H_c=0.13Oe$ and ${\mu}_{eff}$ (1~10 MHz)=5, 000. The frequency stability of the Fe-Nb-B-N films has also been found to be good up to 10 MHz. The Fe-Nb-B-N thin film alloys annealed at 59$0^{\circ}C$ consist of three phase; fine crystalline $\alpha$-Fe phase with grain size of about 5~10 nm, Nb-B rich amorphous phase and Nb-nitride precipitates with the size of less than 3 nm. Annealed Fe-Nb-B films have two phases; $\alpha$-Fe grains with the size of about 10 nm and Nb-B rich amorphous phase. The addition of N decreased $\alpha$-Fe grain size due to the precipitation of NbN. The good magnetic properties of the Fe-Nb-B-N film alloys are due to fine $\alpha$-Fe grains resulting from the precipitation of NbN.

• Journal of the Korean Magnetics Society
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• v.14 no.6
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• pp.236-239
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• 2004

We studied the specular spin valve (SSV) having the spin filter layer (SFL) in contact with the ultrathin free layer composed of Ta3/NiFe2/IrMn7/CoFel/(NOLl)/CoFe2/Cu1.8/CoFe( $t_{F}$)/Cu( $t_{SF}$ )/(NOL2)/Ta3.5 (in nm) by the magnetron sputtering system. For this antiferromagnetic I $r_{22}$M $n_{78}$-pinned spin filter specular spin valve (SFSSV) films, an optimal magnetoresistance (MR) ratio of 11.9% was obtained when both the free layer thickness ( $t_{F}$) and the SFL thickness ( $t_{SF}$ ) were 1.5 nm, and the MR ratio higher than 11% was maintained even when the $t_{F}$ was reduced to 1.0 nm. It was due to increase of specular electron by the nano-oxide layer (NOL) and of current shunting through the SFL. Moreover, the interlayer coupling field ( $H_{int}$) between free layer and pinned layer could be explained by considering the RKKY and magnetostatic coupling. The coercivity of the free layer ( $H_{cf}$ ) was significantly reduced as compared to the traditional spin valve (TSV), and was remained as low as 4 Oe when the $t_{F}$ varied from 1 nm to 4 urn. It was found that the SFL made it possible to reduce the free layer thickness and enhance the MR ratio without degrading the soft magnetic property of the free layer.