• Korean Journal of Materials Research
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• v.17 no.3
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• pp.152-159
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• 2007

When the electronics are tested with thermal shock for Pb-free solder joint reliability, there are temperature conditions with use environment but number of cycles for test don't clearly exist. To obtain the long term reliability data, electronic companies have spent the cost and times. Therefore this studies show the test method and number of thermal shock cycles for evaluating the solder joint reliability of electronic components and also research bonding strength variation with formation and growth of intermetallic compounds (IMC). SMD (surface mount device) 3216 chip resistor and 44 pin QFP (quad flat package) was utilized for experiments and each components were soldered with Sn-40Pb and Sn-3.0 Ag-0.5 Cu solder on the FR-4 PCB(printed circuit board) using by reflow soldering process. To reliability evaluation, thermal shock test was conducted between $-40^{\circ}C\;and\;+125^{\circ}C$ for 2,000 cycles, 10 minute dwell time, respectively. Also we analyzed the IMCs of solder joint using by SEM and EDX. To compare with bonding strength, resistor and QFP were tested shear strength and $45^{\circ}$ lead pull strength, respectively. From these results, optimized number of cycles was proposed with variation of bonding strength under thermal shock.

• Resources Recycling
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• v.24 no.2
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• pp.62-68
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• 2015

The high pure tin production was conducted from crude-tin containing waste solder by electro-refining process. The electro-refining process maintained at 0.2V produced tin with purity of 99.98%, whereas a little increase of voltage to 0.3 V resulted tin purity of 99.92%. The high pure tin of 3N in the present process was produced by fixing the voltage at 0.3V. Considering the high pure tin production, the current density was maintained within $100-120A/m^2$ with current efficiency of 94%. Addition of sulfuric acid of 20 ~ 25 g/L to the electrolyte solution was performed in order to keep Pb (lead) concentration below 100 mg/L in the final tin product. The anode slime generated during electro refining process was analyzed by X-ray diffraction (XRD) study to understand the phases of impurities in it. It detected the presence of Cu and Ag in the slime as in the form of $Cu_6Sn_5$, $Ag_3Sn$, whereas Pb occurred as $PbSO_4$ compound.

• Resources Recycling
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• v.23 no.3
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• pp.37-43
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• 2014

A study has been made on the recovery of tin and copper from waste solder stripper by oxalate precipitation. With the increasing of the oxalic acid addition, tin was precipitated effectively and removed above 99.5% of tin when the oxalic acid, in an amount 1.0-1.5 times the stoichometric requirement, was added. But, in this case, only 2.0% of copper was precipitated and lead, iron were not precipitated. So, tin was selectively removed from the waste solution. With the increasing of the reaction temperature, the removal percentage of tin was increased and maximum value at arounf $60^{\circ}C$ and decreased with increase in the temperature any more. After filtering the precipitate and drying in oven, $SnO_2$ was obtained from the precipitate. After removal of tin in stripping solution, above 91% of copper was selectively removed by Cu-oxalate by addition of oxalic acid.

• Resources Recycling
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• v.24 no.5
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• pp.33-39
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• 2015

A basic study was conducted to effectively recover nitric acid from a waste solder stripper by diffusion dialysis using anion exchange membranes. The effects of flow rate, flux ratio, nitrate concentration, and metallic ion types and concentration on the recovery percentage of nitric acid were investigated. The recovery percentage of nitric acid was decreased with the increase of flow velocity. But the recovery percentage of nitric acid was increased as the increase of flux ratio(W/F) and showing a recovery percentage of nitric acid of about 99% at a flux ratio of 1.5 or more. As the increase of nitric acid concentration in feed solution, the recovery percentage of nitric acid was increased up to 3.0M, but in case of greater than 3.0M, the recovery percentage gradually was decreased. Leakage percentage of metallic ions through the membrane were in the order of Pb, Na and Cu but Fe and Sn did not leakaged. As a result of diffusion dialysis using real waste solder stripper at a flow rate of $0.9L/hr-m^2$, W/F = 1.3, a recovery percentage of nitric acid of approximately 94% was gained.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2015.11a
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• pp.224-225
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• 2015

폐솔더 박리액으로부터 주석 및 구리의 분리를 위하여 옥살레이트 침전을 통해 각각 금속염으로 회수하기 위한 기초 연구를 실시하였다. 먼저 옥살산의 첨가량에 따라 주석의 침전율이 증가하였으며 당량비(옥살산/주석)의 1.0-1.5배를 첨가할 경우 주석이 99.5%, 구리는 2.0% 정도 침전되었고 철, 납 등은 거의 침전되지 않아 주석만 선택적으로 침전되는 것을 확인 하였다. 반응온도 증가에 따라 주석의 침전율은 증가하여 $60^{\circ}C$ 부근에서 최대값을 보이다가 온도가 더 증가하면 오히려 감소 경향을 보였다. 침전물의 고액분리 용이를 위해 카티온성 고분자 응집제를 이용하여 침강시킨 후, 분리된 침전물을 건조, 분쇄하여 $SnO_2$의 산화물을 얻을 수 있었다. 주석이 제거된 폐솔더 박리액에 옥살산을 첨가하여 구리가 약 91% 이상 침전되어 납, 철 등의 금속과 분리하여 선택적으로 회수가 가능하였다.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2014.11a
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• pp.89-90
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• 2014

인쇄회로기판 패턴도금 박리공정 중 발생하는 폐솔더 박리액은 주석, 구리, 철, 납 등 유가금속이 함유된 질산계 폐액이다. 본 연구에서는 이러한 폐솔더 박리액에서 질산과 유가금속을 체계적으로 회수하는 기술을 개발하고자 하였다. 먼저 폐액을 $80^{\circ}C$에서 3시간 정도 반응시켜 주석을 $SnO_2$ 상태로 90% 이상 회수가 가능하였다. 주석이 회수되고 구리, 철, 납만이 존재하는 질산계 폐솔더 박리액에서 확산투석을 이용하여 질산을 94% 이상 회수가 가능하였고 회수된 질산의 농도는 5.1 N 이었다. 질산을 추출한 폐액에서 침전제로 옥살산(Oxalic acid)을 사용하여 구리를 구리옥살레이트 상태로 침전시켜 타금속이온과 선택적으로 분리하였다. 마지막으로 폐액 중 용해되어있는 납을 $65^{\circ}C$이상에서 철 스크랩을 이용한 세멘테이션을 통하여 회수하였다.

• Resources Recycling
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• v.23 no.3
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• pp.61-70
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• 2014

Tin has been widely used to solder, tin plated steel, bronze alloy, sputtering target for transparent electrode and chemical additives. It has been widely reported to the recycling technologies for tin scraps because of the scarcity and economic efficiency of the reserve. This study was analyzed by using open/registered patents KR, US, CN, JP and EP related to recycling technologies for processing scrap, sludges, waste fluid for plating process and spent alloy containing tin in between 1970 and 2013. Patents were collected using key-words searching and filtered by filtering criteria. The trends of the patents were analyzed by year, country, appliant and technology.