Effects of PCB ENIG and OSP Surface Finishes on the Electromigration Reliability and Shear Strength of Sn-3.5Ag PB-Free Solder Bump (PCB의 ENIG와 OSP 표면처리에 따른 Sn-3.5Ag 무연솔더 접합부의 Electromigration 특성 및 전단강도 평가)
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- Korean Journal of Materials Research
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- v.24 no.3
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- pp.166-173
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- 2014