• Journal of Applied Reliability
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• v.5 no.4
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• pp.439-450
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• 2005

Thermal deformation of Digital Television effect friction noise directly. However there was no methods to find and to solve the thermal friction noise which is huge problem in Digital Television In this study, to figure out occurrence cause of friction noise of the product, we measured thermal deformation of the product to organize a triggering device united with Laser Doppler Vibrometer(LDV) which turned occurrence moment of thermal friction noise into a possibility to measure. In conclusion, we could offer an effective information of design, and ensured ESPI(Electronic Speckle Pattern Interferometry) measure technique which is more detailed than the past way.

• Journal of the Korean Society for Nondestructive Testing
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• v.22 no.6
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• pp.643-648
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• 2002

In this study, shearography and ESPI have been used for quantitative analysis of an inside crack of pipeline and both of them appeared suitable to qualitatively detect inside crack. However, shearography needs several effective factors including the amount of shearing, shearing direction and induced load for the quantitative evaluation of the inside crack. In this study, the factors were optimized for the quantitative analysis and the site of cracks has been determined. Although the effective factors in shearography has been optimized, it is difficult to determine the factors exactly because they are related to the details of tracks. On the other hand, ESPI is independent on the details of a crack and only the induced load plays an important role. The out-of-plane displacement was measured under the optimized load and the measured were numerically differentiated, which resulted in an equivalent to the shearogram. The size of cracks can be determined quantitatively without any detail of a crack.

• Proceedings of the Korean Reliability Society Conference
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• 2005.06a
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• pp.303-305
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• 2005

Recently, various plastics are used for improvement of reliability and thermal stability of electronic goods. But, it is difficult to choose suitable balance of grade resin to each other product property. Selection of high efficiency resin is becoming inescapable circumstance according to change of reflow temperature of product and development of product following to lead free. Using a inexpensive and reasonable resin, that sustain a uniform performance of product quality. It is make a robust product and increase a company's competitive power. Hereupon, I introduce example that use ESPI methods of thermal deformation analysis of product using in our company product. I try to refer to a structural weak point detection of real time measurement of electronic parts instead of mechanical and chemical measurement of specimen type.

• Journal of the Korean Society for Precision Engineering
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• v.11 no.1
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• pp.114-122
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• 1994

ESPE(Electonic-Speckle-Pattern-Interferometry) is very useful method for measuring In-plane displacement. Using the CW-Laser and Image processing system, it is possible to measure displacement and strain. Unlike traditional straingauge or moire' method, ESPI method requires no special surface preparation or attachments and can be measured In-plane displacement with no contact and real time. In this experimental specimen was loaded in paralled with loadcell, which provided loading step. The specimen was sheet plate, which was attached straingauge in x-y direction. In this study provides an example of how ESPI has been used to measure two dimensional displacement and strain distribution in this specimen. The results measured by ESPI compare with the data which was measured straingauge method in tensile testing at 1 ton range.

• The Journal of the Korea institute of electronic communication sciences
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• v.9 no.2
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• pp.155-160
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• 2014

In this paper, an algorithm using RGB-depth camera is proposed to detect smoke in interrior. RGB-depth camera, the Kinect provides RGB color image and depth information. The Kinect sensor consists of an infra-red laser emitter, infra-red camera and an RGB camera. A specific pattern of speckles radiated from the laser source is projected onto the scene. This pattern is captured by the infra-red camera and is analyzed to get depth information. The distance of each speckle of the specific pattern is measured and the depth of object is estimated. As the depth of object is highly changed, the depth of object plain can not be determined by the Kinect. The depth of smoke can not be determined too because the density of smoke is changed with constant frequency and intensity of infra-red image is varied between each pixels. In this paper, a smoke detection algorithm using characteristics of the Kinect is proposed. The region that the depth information is not determined sets the candidate region of smoke. If the intensity of the candidate region of color image is larger than a threshold, the region is confirmed as smoke region. As results of simulations, it is shown that the proposed method is effective to detect smoke in interior.

• Journal of Korean Ophthalmic Optics Society
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• v.12 no.4
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• pp.77-81
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• 2007

The spherical lens is typically classified by the refractive power into two groups such as (+) diopter lens and (-) diopter lens. The deformation occurred by the external force that is applied to a lens is caused by the increase or the decrease in the diopter of a lens. In this paper, the deformation of the lens was quantitatively measured by using ESPI (Electronic Speckle Pattern Interferometry) which have been used in the optical measurement field for past few years. ESPI has an advantage that the deformation of an object can be measured precisely by using coherence of the light. The experiment was carried out to the totally 16 types of plastic lens. It was confirmed that the deformation was decreased by increasing the diopter of the lens when same displacement was applied to the lens in case of (+) diopter lens and was increased by decreasing the diopter of the lens in case of (-) diopter lens. Also, it was found that the deformation of (+) diopter lens is less than that of (-) diopter lens. Therefore, with these results, it is expected that the possibility of the quantitative measurement for variation of the optical defect caused by the deformation of a lens when the deformation is occurred to the various types of the lens can be presented and that the application in the lens industrial field can be performed.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.32 no.7
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• pp.597-601
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• 2008

Currently knowledge of strain in welds has mainly been obtained from strain gaging method: that is directly attaching most of the material to the gage. The very few non-contact methods are still in the early stage. One of the non-contact methods is by the use of the laser that has high-level of the accuracy for the measurement, and this laser also has excellent characteristics on which many studies for its applications are focused throughout the many fields. A method of study is on the measurement of the strain caused by the characteristics of the spot welded zone which is used with 3-D ESPI system that is functionally modified through the laser ESPI(Electronic Speckle Pattern Interferometry) system. This system employed the SGCC 1.2t which are mainly used for the steel plate such as automobile, structure, building material and electronic appliances.

• Journal of the Korean Society for Nondestructive Testing
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• v.28 no.3
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• pp.302-308
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• 2008

Composite materials are widely used as structural materials for aerospace engineering because of its excellent mechanical properties such as light weight, high stiffness, and low thermal expansion. In driving, impact damage is one of the common but dangerous damages, caused by internal failure of the laminas interface which is not detected by in the surface. Many techniques to detect defects or delaminate between laminates have been reported. Shearography is a kind of laser speckle pattern interferometry with the advantages of non-destructive, non-contact, high resolution and displacement slope measurement. In this paper, the shearography is used to evaluate non-destructively impact damaged surface of the composite material and a measuring method using shearography for the thermal deformation of a impact damaged composite material is discussed. The basic principles of the technique are also described briefly.

• Proceedings of the KSME Conference
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• 2003.04a
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• pp.25-30
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• 2003

The total relaxed stress in annealing and the thermal strain/stress were obtained from the identification of the residual stress-free state using electronic speckle pattern interferometry (ESPI). The residual stress fields in case of both single and film/substrate systems were modeled using the thermo-elastic theory and the relationship between relaxed stresses and displacements. We mapped the surface residual stress fields on the indented bulk Cu and the 0.5 ${\mu}m$ Au film by ESPI. In indented Cu, the normal and shear residual stress are distributed over -1.7 GPa to 700 MPa and -800 GPa to 600 MPa respectively around the indented point and in deposited Au film on Si wafer, the tensile residual stress is uniformly distributed on the Au film from 500 MPa to 800 MPa. Also we measured the residual stress by the x-ray diffractometer (XRD) for the verification of above residual stress results by ESPI.

• Proceedings of the KSME Conference
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• 2003.04a
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• pp.1315-1320
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• 2003

The thermal expansion coefficient, which causes the micro failure at the interfacial state of thin films is necessary to consider for proper designing MEMS. The effect of temperature on the coefficient of thermal expansion(CTE) of $SiO_2$ and $Si_3N_4$ film was investigated. Thermal strain induced by mismatch of CTE between substrate and thin film continuously measured with resolution-improved electronic speckle pattern interferometry(ESPI). The thermal stress induced by mismatch of CTE derivate through thermal strain. The thermal expansion coefficients of thin film were calculated with the general equation of CTE and thermal stress in thin films, and it confirmed that CTE of $SiO_2$changed from $0.25{\times}10^{-6}/^{\circ}C$ to $1.4{\times}10^{-6}/^{\circ}C$ with temperature increasing from 50 to $600^{\circ}C$