• Title/Summary/Keyword: Solution-based process

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Agent-target Detection Problem Considering Change in Probability of Event Occurrence (사건 발생 확률 변화를 고려한 에이전트-타깃 감지 문제)

  • Gwang Kim
    • Journal of Korea Society of Industrial Information Systems
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    • v.29 no.4
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    • pp.67-76
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    • 2024
  • In this study, we address the problem of target detection using multiple agents. Specifically, the detection problem involving mobile agents necessitates additional strategies for path planning. The objective is to maximize the total utility derived from the detection process over a specific period. This detection problem incorporates realistic utility values by considering a stochastic process based on the Poisson process, which accounts for the changing probability of target event occurrence over time. The objective function is nonlinear and is classified as an NP-hard problem. To identify an effective solution within an efficient computation time, this study demonstrates that the objective function possesses the characteristic of submodularity. Using this property, we propose a heuristic algorithm designed to obtain a reasonable strategy with relatively low computational time. The proposed algorithm shows solution performance and the ability to generate solutions within an appropriate computation time through theoretical and experimental results.

An Analysis of the Pseudo-analytical Thought and Analytical Thought that Students Do in the Process of Algebra Problem Solving (대수 문장제 해결 과정에서 나타나는 擬似(의사) 분석적 사고와 분석적 사고에 대한 분석 - 중학생 대상의 사례 연구 -)

  • Park, Hyun-Jeong;Lee, Chong-Hee
    • Journal of Educational Research in Mathematics
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    • v.17 no.1
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    • pp.67-90
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    • 2007
  • The purpose of this study is to understand students' thinking process in the algebra problem solving, on the base of the works of Vinner(1997a, 1997b). Thus, two middle school students were evaluated in this case study to examine how they think to solve algebra word problems. The following question was considered to analyze the thinking process from the similarity-based perspective by focusing on the process of solving algebra word problems; What is the relationship between similarity and the characteristics of thinking process at the time of successful and unsuccessful problem solving? The following results were obtained by analyzing the success or failure in problem solving based on the characteristics of thinking process and similarity composition. Successful problem solving can be based on pseudo-analytical thought and analytical thought. The former is the rule applied in the process of applying closed formulas that is constructed structural similarity not related with the situations described in the text. The latter means that control and correction occurred in all stages of problem solution. The knowledge needed for solutions was applied with the formulation of open-end formulas that is constructed structural similarity in which memory and modification with the related principles or concepts. In conclusion, the student's perception on the principles involved in a solution is very important in solving algebraic word problems.

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Implementation of a BPMS-based Virtual Enterprise in the Port Logistics Industry (BPMS 기반 항만물류 가상기업의 구현)

  • Han, Yong-Ho
    • Korean Management Science Review
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    • v.25 no.3
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    • pp.73-85
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    • 2008
  • First we provide an overview of how virtual enterprise works, including the lifecycle of a virtual enterprise, expected benefits from a virtual enterprise, and various types of collaborative networks. Next we focus on a problem encountered in the port logistics industry and suggest that implementation of a virtual enterprise can be a good solution to the problem. Then we suggest a prototype of the virtual enterprise in the port logistics industry and a freight transportation process as a business process in the prototype. And then we introduce major functions of the business process management system (BPMS) which, in general, can be regarded as a tool to create the virtual enterprise. Finally by adopting a specific BPMS, we illustrate how to design and implement the freight transportation process in the prototype.

Rigid-Plastic Finite Element Analysis of Multi-Stage Automatic Cold Forging Processes by Combined Analyses of Two-Dimensional and Three-Dimensional Approaches (2차원 및 3차원 연계해석을 통한 다단 자동냉간단조 공정의 강소성 유한요소해석)

  • Lee, M.C.;Joun, M.S.
    • Transactions of Materials Processing
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    • v.17 no.3
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    • pp.155-160
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    • 2008
  • We analyzed a sequence of multi-stage automatic cold forging processes composed of four axisymmetric processes followed by a non-axisymmetric process using rigid-plastic finite element based forging simulators. The forging sequence selected for an example involves a piercing process and a heading process accompanying folding or overlapping, which all make it difficult to simulate the processes. To reduce computational time and to enhance the solution reliability, only the non-symmetric process was analyzed by the three-dimensional approach after the axisymmetric processes were analyzed by the two-dimensional approach. It has been emphsized that this capability is very helpful in simulating the multi-stage automatic forging processes which are next to axisymmetric or involve several axisymmetric processes.

Rigid-Plastic Finite Element Analysis of Multi-Stage Automatic Cold Forging Processes by Combined Analyses of Two-Dimension and Three-Dimensional Approaches (2차원 및 3차원 연계해석을 통한 다단 자동냉간단조 공정의 강소성 유한요소해석)

  • Lee, M.C.;Joun, M.S.
    • Proceedings of the Korean Society for Technology of Plasticity Conference
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    • 2007.10a
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    • pp.195-200
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    • 2007
  • We analyzed a sequence of multi-stage automatic cold forging processes composed of four axisymmetric processes followed by a non-axisymmetric process using rigid-plastic finite element based forging simulators. The forging sequence selected for an example involves a piercing process and a heading process accompanying folding or overlapping, which all make it difficult to simulate the processes. To reduce computational time and to enhance the solution reliability, only the non-symmetric process was analyzed by the three-dimensional approach after the axisymmetric processes were analyzed by the two-dimensional approach. It has been emphsized that this capability is very helpful in simulating the multi-stage automatic forging processes which are next to axisymmetric.

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Optimization of Process Variables in Copper Infiltration of Low and High Density Ferrous Structural Parts

  • Joys, Jessu;Luk, Sydney
    • Proceedings of the Korean Powder Metallurgy Institute Conference
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    • 2006.09b
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    • pp.826-827
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    • 2006
  • Copper infiltration is demonstrated as a viable solution to achieve higher mechanical properties by filling the interconnected porosities of a ferrous structure with copper infiltrant. This paper will present the results of a design of experiments study based on the selected processing variables in the copper infiltration process. The variables are the following: Infiltrating temperatures, infiltrating time at pre-heat zone and hot zone, the green density of iron part, the migration of copper into the iron part at different processing conditions. The results show the flexibility of the infiltration process to attain certain mechanical properties by changing the processing conditions.

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Robust Design of Springback in Sheet Metal Forming (박판 성형 공정에서 스프링백의 강건 설계)

  • Kim, Kyung-Mo;Yin, Jeong-Je
    • Journal of the Korean Society of Manufacturing Process Engineers
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    • v.12 no.2
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    • pp.41-48
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    • 2013
  • Springback is a very typical dimensional discrepancy phenomenon, which occurs usually on the final stamping parts after the tool loading is removed. Variation of springback leads to amplified variations and problems during assembly of the stamped components, in turn, resulting in quality issues. The variations in the properties of the incoming material and process parameters are the main causes of springback variation. In this research, a robust design methodology which combines orthogonal array based experimental design and design space reduction skim to reduce the springback variation for advanced high strength steel parts in sheet metal forming is suggested. The concept of design space reduction is adapted in the experimental design setup to improve the quality of the obtained solution. The effectiveness of the proposed procedures is illustrated through a robust design of springback in metal forming process of a cross member of auto body.

Design of Cellular Manufacturing System with Alternative Process Plans under Uncertain Demand (수요가 불확실한 환경에서 대체공정계획을 고려한 셀형제조시스템 설계)

  • Ko, Chang-Seong;Lee, Sang-Hun;Lee, Yang-Woo
    • Journal of Korean Institute of Industrial Engineers
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    • v.24 no.4
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    • pp.559-569
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    • 1998
  • Cellular manufacturing system (CMS) has been recognized as an alternative to improve manufacturing productivity in conventional batch-type manufacturing systems through reducing set-up times, work-in-process inventories and throughput times by means of group technology. Most of the studies on the design of CMS assumed that each part has a unique process plan, and that its demand is known as a deterministic value despite of the probabilistic nature of the real world problems. This study suggests an approach for designing CMS, considering both alternative process plans and uncertain demand. A mathematical model is presented to show how to minimize the expected amortized and operating costs satisfying these two relaxations. Four heuristic algorithms are developed based on tabu search which is well suited for getting an optimal or near-optimal solution. Example problems are carried out to illustrate the heuristic algorithms and each of them is compared with the deterministic counterpart.

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Large Area Wafer-Level High-Power Electronic Package Using Temporary Bonding and Debonding with Double-Sided Thermal Release Tape (양면 열박리 테이프 기반 임시 접합 공정을 이용한 대면적 웨이퍼 레벨 고출력 전자패키지)

  • Hwang, Yong-Sik;Kang, Il-Suk;Lee, Ga-Won
    • Journal of Sensor Science and Technology
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    • v.31 no.1
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    • pp.36-40
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    • 2022
  • High-power devices, such as LEDs and radars, inevitably generate a large amount of heat, which is the main cause of shortening lifespan, deterioration in performance, and failure of electronic devices. The embedded IC process can be a solution; however, when applied to large-area substrates (larger than 8 in), there is a limit owing to the difficulty in the process after wafer thinning. In this study, an 8-in wafer-level high-power electronic package based on the embedded IC process was implemented with temporary bonding and debonding technology using double-sided thermal release tape. Good heat-dissipation characteristics were demonstrated both theoretically and experimentally. These findings will advance the commercialization of high-power electronic packaging.

Process design for solution growth of SiC single crystal based on multiphysics modeling (다중물리 유한요소해석에 의한 SiC 단결정의 용액성장 공정 설계)

  • Yoon, Ji-Young;Lee, Myung-Hyun;Seo, Won-Seon;Shul, Yong-Gun;Jeong, Seong-Min
    • Journal of the Korean Crystal Growth and Crystal Technology
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    • v.26 no.1
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    • pp.8-13
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    • 2016
  • A top-seeded solution growth (TSSG) is a method of growing SiC single crystal from the Si melt dissolved the carbon. In this study, multiphysics modeling was conducted using COMSOL Multiphysics, a commercialized finite element analysis package, to get analytic results about electromagnetic analysis, heat transfer and fluid flow in the Si melt. Experimental results showed good agreements with simulation data, which supports the validity of the simulation model. Based on the understanding about solution growth of SiC and our set-up, crystal growth was conducted on off-axis 4H-SiC seed crystal in the temperature range of $1600{\sim}1800^{\circ}C$. The grown layer showed good crystal quality confirmed with optical microscopy and high resolution X-ray diffraction, which also demonstrates the effectiveness of the multiphysics model to find a process condition of solution growth of SiC single crystal.