• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2001.11b
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• pp.81-84
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• 2001

The effect of silver oxide (14 wt.%) addition to YBCO compounds and electrophoretic deposition of composite particles prepared by solid phase reaction have been investigated. The results were compared with those for as-processed samples with YBCO films on Ag wire substrate. Our experiments show that the adhesion, microstructure changes, superconducting properties of these films is sensitive to the silver content and sintering conditions. Adding a small amount of PEG tends to remove cracks in the YBCO and (YBCO + Ag) films, which develop during the heating process. An attempt has been made to explain the experimental observations regarding variation of critical current density with the YBCO and (YBCO + Ag) films.

• Proceedings of the Korean Institute of Building Construction Conference
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• 2018.05a
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• pp.261-262
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• 2018

In this study, the quality of recycled aggregate for concrete was investigated as the number of recycled aggregate crushing cycles, grinder and crusher, peeling and crushing. First, the quality of density, absorption ratio and solid content was improved as the separation distance decreased and the number of crushing increased, depending on the number of crushing of recycled aggregate and the distance between mantle and cone cave. The quality of density, absorption ratio and solid content was improved as the wire mesh used in striking plate and the number of hammers increased, depending on the type of striking plate and the number of hammers.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2001.11a
• /
• pp.81-84
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• 2001

The effect of silver oxide (14 wt.%) addition to YBCO compounds and electrophoretic deposition of composite particles prepared by solid phase reaction have been investigated. The results were compared with those for as-processed samples with YBCO films on Ag wire substrate. Our experiments show that the adhesion, microstructure changes, superconducting properties of these films is sensitive to the silver content and sintering conditions. Adding a small amount of PEG tends to remove cracks in the YBCO and (YBCO + Ag) films, which develop during the heating process. An attempt has been made to explain the experimental observations regarding variation of critical current density with the YBCO and (YBCO + Ag) films.

• Proceedings of the IEEK Conference
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• 1998.10a
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• pp.327-330
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• 1998

A 2watts MMIC(Monolithic Microwave Integrated Circuits) SSPA(Solid State Power Amplifiers) for 20GHz band communication systems has been designed, manufactured and measured. The 0.15um pHEMT technologywith the gate size of 400um for single device was used for the fabrication of MMIC Power Amplifier chips. The precision MIC patterns for the peripherals like power combiner/divider and microstrip lines were realized using hard substrate for gold wire/ribbon bonding. The measured data shows that this MMIC SSPA has the linear gain of 18dB, output power of 33.42dBm(2.2Watts)at 20~21GHz.

• 제어로봇시스템학회:학술대회논문집
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• 1991.10a
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• pp.704-706
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• 1991

In CAD/CAM system, many efforts are made to automate the converting process from drawling information to manufacturing Information. The most difficult step In this procedure is utilizing 2 dimensional drawing information In order to formulate 3 dimensional w&ling information. This paper emphasizes to mWe automatically series of convertirg steps which provide 3 dimensional wire frame, surface and solid modeling using feature recognition rules. With the standardization of design process and the recognition rule as preceding steps, it shows a good application tool to interface the design and manufacturing procedures in PC-Level CAD/CAM system.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2014.11a
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• pp.130-131
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• 2014

자동용접용 솔리드와이어를 위한 치환동도금층 밀착력 향상을 위해 착화제로 Alanine을 사용하였다. 테이프 시험결과 Alanine 첨가에 따라 밀착력이 현저히 증가하였다. 또한 도금층내에 혼입되는 H와 Fe 분석결과 Alanine을 첨가하지 않았을 때 도금층 전체 영역에서 H와 Fe의 검출강도가 높게 나타났으나, Alanine 10g/l추가시 도금층내에서 미량 검출되었다.

• Korean Journal of Materials Research
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• v.12 no.12
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• pp.941-946
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• 2002

Both Cu and Cu-oxide nanopowders have great potential as conductive paste, solid lubricant, effective catalysts and super conducting materials because of their unique properties compared with those of commercial micro-sized ones. In this study, Cu and Cu-oxide nanopowders were prepared by Pulsed Wire Evaporation (PWE) method which has been very useful for producing nanometer-sized metal, alloy and ceramic powders. In this process, the metal wire is explosively converted into ultrafine particles under high electric pulse current (between $10^4$ and $10^{ 6}$ $A/mm^2$) within a micro second time. To prevent full oxidations of Cu powder, the surface of powder has been slightly passivated with thin CuO layer. X-ray diffraction analysis has shown that pure Cu nanopowders were obtained at $N_2$ atmosphere. As the oxygen partial pressure increased in $N_2$ atmosphere, the gradual phase transformation occurred from Cu to $Cu_2$O and finally CuO nanopowders. The spherical Cu nanopowders had a uniform size distribution of about 100nm in diameter. The Cu-oxide nanopowders were less than 70nm with sphere-like shape and their mean particle size was 54nm. Smaller size of Cu-oxide nanopowders compared with that of the Cu nanopowders results from the secondary explosion of Cu nanopowders at oxygen atmosphere. Thin passivated oxygen layer on the Cu surface has been proved by XPS and HRPD.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.18 no.8
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• pp.67-73
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• 2019

An ultra-high pressure treatment device is a device used for increasing the shelf life of food by sterilizing it by applying hydrostatic pressure to solid or liquid food. The ultrahigh pressure treatment system developed in this study is a pressure vessel with a processing capacity of 100 L and a maximum pressure of 700 MPa. Pressure vessels for ultrahigh-pressure processing equipment are manufactured using wire-winding techniques. The design formula for making ultra-high pressure vessels with wire windings is given in ASME Section VIII - Division 3. In this study, the ratio of the cylinder to the winding area that can be applied in a wire-winding application was analyzed using a finite element analysis. Furthermore, the relationship between the variation of the residual stress in the vessel and the ratio of the winding area due to the variation of the winding tension was analyzed, and a design guide applicable to the actual product design was developed. Finally, the design equation was modified by presenting the coefficients to correct the difference between the finite element analysis and the design equation.

• Journal of the Architectural Institute of Korea Structure & Construction
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• v.34 no.1
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• pp.41-51
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• 2018

In case of evaluating the bond stress of a void deck plate using a wire steel, there is no standard formula considering both the influence on the void and the type of the reinforcing bar. Therefore we proposed a model equation considered the bond characteristics of the void deck plate. A total of 46 specimens was carried out a direct pull-out test and the test variables were the presence of a void body, type of reinforcing bar, the inner cover thickness according to the location of reinforcing bars and bond region. As a result of the comparison between the steel bar and steel wire, the bond stress of the steel wire with the relative rib area of 0.071 is 4.5 ~ 28.58% lower than that of the steel bar with 0.092 and the bond stress reduction rate increases when the inner cover thickness is insufficient. In the case of the inner cover thickness of $1.7d_b$ and $2.7d_b$, the bond stress was reduced to 48.7 ~ 68.4%. In the inner cover thickness was $4.9d_b$ and $5.2d_b$, the bond stresses were equivalent to those of the solid specimens. It was confirmed that the average bond stress and strain were affected by the inner cover thickness. Therefore the predicted model for one module of the void deck plate is proposed and verified by considering the bond characteristics of the void deck plate.

• Steel and Composite Structures
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• v.36 no.6
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• pp.671-687
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• 2020

The aim of this research is to analyze buckling and bending behavior of a sandwich Reddy beam with porous core and composite face sheets reinforced by boron nitride nanotubes (BNNTs) and shape memory alloy (SMA) wires resting on Vlasov's foundation. To this end, first, displacement field's equations are written based on the higher-order shear deformation theory (HSDT). And also, to model the SMA wire properties, constitutive equation of Brinson is used. Then, by utilizing the principle of minimum potential energy, the governing equations are derived and also, Navier's analytical solution is applied to solve the governing equations of the sandwich beam. The effect of some important parameters such as SMA temperature, the volume fraction of SMA, the coefficient of porosity, different patterns of BNNTs and porous distributions on the behavior of buckling and bending of the sandwich beam are investigated. The obtained results show that when SMA wires are in martensite phase, the maximum deflection of the sandwich beam decreases and the critical buckling load increases significantly. Furthermore, the porosity coefficient plays an important role in the maximum deflection and the critical buckling load. It is concluded that increasing porosity coefficient, regardless of porous distribution, leads to an increase in the critical buckling load and a decrease in the maximum deflection of the sandwich beam.