Journal of the Architectural Institute of Korea Structure & Construction (대한건축학회논문집:구조계)

Architectural Institute of Korea (대한건축학회)
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Bond Stress-Strain Predict Model with Inner Cover Thickness of Steel Wire Used in Void Deck Plate

중공 데크플레이트에 사용된 철선의 내부피복두께에 따른 부착응력-변형률 예측모델

  • 김희현 (한양대학교 대학원 건축공학과) ;
  • 최창식 (한양대학교 건축공학부)
  • Received : 2017.09.25
  • Accepted : 2017.11.30
  • Published : 2018.01.30
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Abstract

In case of evaluating the bond stress of a void deck plate using a wire steel, there is no standard formula considering both the influence on the void and the type of the reinforcing bar. Therefore we proposed a model equation considered the bond characteristics of the void deck plate. A total of 46 specimens was carried out a direct pull-out test and the test variables were the presence of a void body, type of reinforcing bar, the inner cover thickness according to the location of reinforcing bars and bond region. As a result of the comparison between the steel bar and steel wire, the bond stress of the steel wire with the relative rib area of 0.071 is 4.5 ~ 28.58% lower than that of the steel bar with 0.092 and the bond stress reduction rate increases when the inner cover thickness is insufficient. In the case of the inner cover thickness of $1.7d_b$ and $2.7d_b$, the bond stress was reduced to 48.7 ~ 68.4%. In the inner cover thickness was $4.9d_b$ and $5.2d_b$, the bond stresses were equivalent to those of the solid specimens. It was confirmed that the average bond stress and strain were affected by the inner cover thickness. Therefore the predicted model for one module of the void deck plate is proposed and verified by considering the bond characteristics of the void deck plate.

Keywords

Acknowledgement

Supported by : 한국연구재단

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