• Title/Summary/Keyword: Solid surface

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Investigation on Mechanical Property and Adhesion of Oxide Films Formed on Ni and Ni-Co Alloy in Room and High Temperature Environments

  • Oka, Yoshinori I.;Watanabe, Hisanobu
    • Corrosion Science and Technology
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    • v.7 no.3
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    • pp.145-151
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    • 2008
  • Material degradation such as high temperature oxidation of metallic material is a severe problem in energy generation systems or manufacturing industries. The metallic materials are oxidized to form oxide films in high temperature environments. The oxide films act as diffusion barriers of oxygen and metal ions and thereafter decrease oxidation rates of metals. The metal oxidation is, however, accelerated by mechanical fracture and spalling of the oxide films caused by thermal stresses by repetition of temperature change, vibration and by the impact of solid particles. It is therefore very important to investigate mechanical properties and adhesion of oxide films in high temperature environments, as well as the properties in a room temperature environment. The oxidation tests were conducted for Ni and Ni-Co alloy under high temperature corrosive environments. The hardness distributions against the indentation depth from the top surface were examined at room temperature. Dynamic indentation tests were performed on Ni oxide films formed on Ni surfaces at room and high temperature to observe fractures or cracks generated around impact craters. As a result, it was found that the mechanical property as hardness of the oxide films were different between Ni and Ni-Co alloy, and between room and high temperatures, and that the adhesion of Ni oxide films was relatively stronger than that of Co oxide films.

An Ultrathin Polymer Network through Polyion-Complex by Using Sodium Dioctadecyl Sulfate as Monolayer Template

  • Lee, Burm-Jong;Kim, Hee-Sang;Kim, Seong-Hoon;Son, Eun-Mi;Kim, Dong-Kyoo;Shin, Hoon-Kyu;Kwon, Young-Su
    • Bulletin of the Korean Chemical Society
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    • v.23 no.4
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    • pp.575-579
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    • 2002
  • Two-dimensionally cross-linked ultrathin films of poly(maleic acid-alt-methyl vinyl ether) (MA-MVE) and poly(allylamine) (PAA) were produced by using sodium dioctadecyl sulfate (2C18S) as the monolayer template for Langmuir-Blodgett (LB) depositio n. The template molecules were subsequently removed by thermal treatment followed by extraction. The polyion-complexed monolayers of three components, i.e., template 2C18S, co-spread PAA, and subphase MA-MVE, were formed at the air-water interface. Their monolayer properties were studied by the surface pressure-area isotherm. The monolayers were transferred on solid substrates as Y type. The polyion-complexed LB films and the resulting network films were characterized by FT-IR spectroscopy, X-ray photoelectron spectroscopy (XPS), and scanning electron microscopy (SEM). The cross-linking to form a polymer network was achieved by amide or imide formation through heat treatment under a vacuum. SEM observation of the film on a porous fluorocarbon membrane filter (pore diameter 0.1 ㎛) showed covering of the pores by four layers in the polyion complex state. Extraction by chloroform followed by heat treatment produced hole defects in the film.

Design and Optimization of Glow Discharge Atomic Absorption Spectrometry System (글로우방전 원자흡수시스템의 구성 및 최적화에 관한 연구)

  • Kim, Hyo Jin;Jang, Hye Jin;Lee, Gae Ho;Jo, Jeong Hwan
    • Journal of the Korean Chemical Society
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    • v.38 no.3
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    • pp.214-220
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    • 1994
  • A glow discharge atomic absorption system for the direct analysis of conducting solid samples has been designed and constructed. An arrestor made of machinable ceramic which is a main component for confining the discharge between cathode and anode is modified to have a better stability in discharge. Discharge voltage or current, shape of arrestor, pressure, and gas flow rate can be controlled by an ADC/DAC board with a personal computer. The effect of discharge parameters such as discharge voltage, pressure, and gas flow rate on the sample loss rate, absorbance, and the surface morphology of sample by SEM has been studied to find optimum discharge conditions.

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Synthesis of Magnetic Nanoparticles of Fe3O4 and CoFe2O4 and Their Surface Modification by Surfactant Adsorption

  • Zhao, Shi Yong;Lee, Don-Geun;Kim, Chang-Woo;Cha, Hyun-Gil;Kim, Young-Hwan;Kang, Young-Soo
    • Bulletin of the Korean Chemical Society
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    • v.27 no.2
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    • pp.237-242
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    • 2006
  • $Fe_3O_4$ and $CoFe_2O_4$ magnetic nanoparticles have been synthesized successfully in aqueous solution and coated with oleic acid. The solid and organic solution of the synthesized nanoparticles was obtained. Self-assembled monolayer films were formed using organic solution of these nanoparticles. The crystal sizes determined by Debye-Scherre equation with XRD data were found close to the particle sizes calculated from TEM images, and this indicates that the synthesized particles are nanocrystalline. Especially, EDS, ED, FT-IR, TGA/DTA and DSC were used to characterize the nanoparticles and the oleic acid adsorption, and it was found that oleic acid molecule on the $Fe_3O_4$ nanoparticle is a bilayer adsorption, while that on $CoFe_2O_4$ nanoparticle is single layer adsorption. The superparamagnetic behavior of the nanoparticles was documented by the hysteresis loop measured at 300 K.

Optimization of Spray Drying Process for Manufacturing Dried Vinegar using Response surface methodology (분말식초제조를 위한 분무건조공정의 최적화)

  • 황성희;정용진;윤광섭
    • Food Science and Preservation
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    • v.9 no.2
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    • pp.194-199
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    • 2002
  • This study was conducted to develop processing method for vinegar powder from natural vinegar for encapsulation applications. To optimize the spray drying process, experiment was designed by central composition method to find optimal conditions for manufacturing vinegar powder. The acidity, water absorption, solid content and heat stability of vinegar powder were selected as response variables. The optimal concentration of inclusion complex which was made with vinegar and ${\beta}$-cyclodextrin was determined on 30。bx. On increasing the concentration of ${\beta}$-cyclodextrin as a wall material, the quality of the vinegar was decreased. The optimum conditions of spray drying process for manufacturing vinegar powder were 188∼192$^{\circ}C$ and 500∼600 Lh$\^$ -1/ as inlet temperature and flow rate, respectively.

Temperature Behavior in Dissimilar Butt Joint During TIG Assisted Friction Stir Welding (TIG-FSW 하이브리드 용접을 이용한 이종재 맞대기 용접부의 온도 분포 특성)

  • Bang, Hee-Seon;Bijoy, M.S.
    • Journal of Welding and Joining
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    • v.29 no.5
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    • pp.63-71
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    • 2011
  • Three-dimensional finite element analysis is performed to study the temperature distribution phenomenon of TIG assisted friction stir welding (TAFSW) between dissimilar plates (Al 6061-T6 and stainless steel 304). TAFSW is a solid-state welding process that integrates TIG (Tungsten Inert Gas) into a friction stir welding (FSW), to preheat the harder material ahead of FSW tool during welding. In order to facilitate the industrial application of welding, 3D numerical modeling of heat transfer has been carried out applying Finite Element Method (FEM). The temperature distribution due to heat generation during TAFSW on dissimilar materials joint is analysed using in-house solver. Moving heat source along with frictional heat between the work specimens and tool surface is considered to calculate the heat input. The analytical model used predicts successfully the maximum welding temperatures that occur on the dissimilar materials during TAFSW. Comparison with the infra red camera and thermocouple measurement results shows that the results from the current numerical simulation have good agreement with the measured data.

Prevention of Back Side Humping in Laser Welding of Al 5J32 Alloy by Using Laser Power Modulation (Al 5J32 합금의 레이저 용접에서 레이저출력 모듈레이션을 이용한 이면 험핑 비드의 안정화)

  • Ahn, Do-Chang;Kim, Cheol-Hee;Kim, Jae-Do
    • Journal of Welding and Joining
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    • v.29 no.4
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    • pp.80-84
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    • 2011
  • In the 5xxx series Al-Mg alloy, magnesium addition can increase the strength of aluminum alloy by solid solution strengthening but it has a relatively low melting and boiling temperature. During full -penetration laser welding of the Al-Mg alloys, its low boiling point and high vapor pressure brings about the spiky humping bead on the bottom side. Under back-side shielding, the spiking of back bead can be reduced but it restraints the process flexibility. In this study, a square pulse waveform modulation was employed to stabilize keyhole and back bead surface without back-side shielding. By using an experimental design, the bead shapes were evaluated for various process parameters such as the focal position, welding velocity and waveform parameters and the smooth back bead shape could be achieved.

Numerical Simulation of Transport Phenomena for Laser Full Penetration Welding

  • Zhao, Hongbo;Qi, Huan
    • Journal of Welding and Joining
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    • v.35 no.2
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    • pp.13-22
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    • 2017
  • In laser full penetration welding process, full penetration hole(FPH) is formed as a result of force balance between the vapor pressure and the surface tension of the surrounding molten metal. In this work, a three-dimensional numerical model based on a conserved-mass level-set method is developed to simulate the transport phenomena during laser full penetration welding process, including full penetration keyhole dynamics. Ray trancing model is applied to simulate multi-reflection phenomena in the keyhole wall. The ghost fluid method and continuum method are used to deal with liquid/vapor interface and solid/liquid interface. The effects of processing parameters including laser power and scanning speed on the resultant full penetration hole diameter, laser energy distribution and energy absorption efficiency are studied. The model is validated against experimental results. The diameter of full penetration hole calculated by the simulation model agrees well with the coaxial images captured during laser welding of thin stainless steel plates. Numerical simulation results show that increase of laser power and decrease of welding speed can enlarge the full penetration hole, which decreases laser energy efficiency.

A Study on the Nano Alloy Powders Synthesized by Simultaneous Pulsed Wire Evaporation (S-PWE) method II - Synthesis of Ee-Al Nano Alloy Powders (동시 전기 폭발법에 의한 나노 합금 분말 제조에 관한 연구 II - Fe-Al alloy 분말 제조)

  • ;;;O. M.;Yu. A. Kotov
    • Journal of Powder Materials
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    • v.11 no.2
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    • pp.105-110
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    • 2004
  • In this study the possibility to obtain a homogeneous mixture and to produce solid solutions and intermetallic compounds of Fe and Al nano particles by simultaneous pulsed wire evaporation (S-PWE) have been investigated. The Fe and Al wires with 0.45 mm in diameter and 35 mm in length were continuously co-fed by a special mechanism to the explosion chamber and simultaneously exploded. The characteristics, e.g., phase composition, particle shape, and specific surface area of Fe-Al nano powders have been analyzed. The synthesized powders, beside for Al and $\alpha$-Fe, contain significant amount of a high-temperature phase of $\gamma$-Fe, Fe Al and traces of other intermetallics. The phase composition of powders could be changed over broad limits by varying initial explosion conditions, e.g. wire distance, input energy, for parallel wires of different metals. The yield of the nano powder is as large as 40 wt % and the powder may include up to 46 wt % FeAl as an intermetallic compound.

Wafer Level Bonding Technology for 3D Stacked IC (3D 적층 IC를 위한 웨이퍼 레벨 본딩 기술)

  • Cho, Young Hak;Kim, Sarah Eunkyung;Kim, Sungdong
    • Journal of the Microelectronics and Packaging Society
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    • v.20 no.1
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    • pp.7-13
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    • 2013
  • 3D stacked IC is one of the promising candidates which can keep Moore's law valid for next decades. IC can be stacked through various bonding technologies and they were reviewed in this report, for example, wafer direct bonding and atomic diffusion bonding, etc. As an effort to reduce the high temperature and pressure which were required for high bonding strength in conventional Cu-Cu thermo-compression bonding, surface activated bonding, solid liquid inter-diffusion and direct bonding interface technologies are actively being developed.