• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.16 no.12
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• pp.1142-1149
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• 2003

The strength and characteristics of the soldering interface of the power semiconductor chip in a power module has been firstly surveyed by the peel strength measurement method. A power module is combined with several power chips which generally has 30∼400$\textrm{mm}^2$ chip area to allow several tens or bigger amps in current rating, so that the traditional methods for interface characterization like shear test could not be applied to high power module. In this study power diode modules were fabricated by using lead-tin solder with 10${\times}$10$\textrm{mm}^2$ or 7${\times}$7$\textrm{mm}^2$ soldering interface. The peel strengths of soldered interfaces were measured and then the microscopic investigation on the fractured surfaces were followed. The peel test indicated that the crack propagated either through the bulk of the soft lead-tin solder which has 55-60 kgf/cm peel strength or along the interface between the solder and the plated nickel layer which has much lower 22 kgf/cm strength. This study showed that the peel test would be a useful method to quantify the solderability as well as to recognize which is the worst interface or the softest material in a power module with a large soldering area.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.61 no.3
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• pp.472-478
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• 2012

The inspection machine in PCB (printed circuit board) assembly line checks assembly errors by inspecting the images inside of the component inspection region. The component inspection region consists of region of component package and region of soldering. It is necessary to extract the regions automatically for auto-teaching system of the inspection machine. We propose an image segmentation method to extract the component inspection regions automatically from images of PCB. The acquired image is transformed to HSI color model, and then segmented by several regions by clustering method. We develop a modified K-means algorithm to increase the accuracy of extraction. The heuristics generating the initial clusters and merging the final clusters are newly proposed. The vertical and horizontal projection is also developed to distinguish the region of component package and region of soldering. The experimental results are presented to verify the usefulness of the proposed method.

• Proceedings of the KWS Conference
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• 2003.05a
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• pp.224-227
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• 2003

The longitudinal thermosonic bonding method is investigated in this work for its application to the soldering process for electronic packaging. The effect of the ultrasonic is analyzed through lumped modeling, and the material properties of a viscoelastic model are measured experimentally. The thermosonic bonding method is verified by inserting the Cu pin and Au bump into solder block. As the solder thickness decreases, temperature of the solder is calculated to increase rapidly because of larger strain. Localized heating due to ultrasonic vibration is observed to melt the solder near the pin, which is adequate to the high density electronic package and Pb-free solder having high melting temperature.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2005.07a
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• pp.544-545
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• 2005

This paper describes the long duration withstand current characteristics of ZnO varistors. Two ZnO varistors were manufactured with general ceramic production methods and three abroad varistors were also prepared to be compared. During long duration withstand test, sample 1 was destroyed at 4th impulse current but the rest passed test. Before and After the test, the residual voltage variation of varistors passed was below 5%. According to the test results, it is thought that the manufacturing process such as insulating coating, sintering condition and soldering method should be improved.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.17 no.2
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• pp.325-333
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• 2016

This paper proposes controller design algorithms for a ceramic soldering iron temperature control system, and reports their effectiveness in a control experiment. Because the responses of the ceramic soldering iron temperature to the control input are non-linear and very slow, precise modeling and controller design is difficult. In this study, the temperature characteristics of a ceramic soldering iron are represented by TSK fuzzy models consisting of TSK fuzzy rules. In the fuzzy rules, the premise variable is the control input and the consequences are the transfer functions. The transfer functions in the fuzzy model were obtained from the step input responses. As the responses of the ceramic soldering iron temperature are very slow, it is difficult to obtain the complete step input responses. This paper proposes a genetic algorithm to obtain the transfer functions from an incomplete step input responses, and showed its effectiveness in examples. This paper also reports a fuzzy controller design method from the TSK fuzzy model and examples. The proposed methods were applied to the temperature control experiments of ceramic iron. The TSK fuzzy model consisted of 7 TSK fuzzy rules, and the consequences were PI controllers. The experimental results of the proposed fuzzy PI controller were superior to the linear controller and were as good as in previous studies using a fuzzy PID controller.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.19 no.10
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• pp.31-36
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• 2018

Fuses are used to protect electric circuits or devices from excess current. Glass-tube fuses are typically used, but problems have arisen due to the mandated switch from conventional solder to lead-free solder. This study used CFD to simulate the phenomenon of molten solder being poured out of a fuse during the soldering process for a fuse cap and fuse element. In addition, a method is proposed to prevent solder from overflowing, and its effectiveness was verified based on the analysis results. The results show that a sufficient increase of the temperature inside the glass tube before soldering and gravity can help to prevent the solder from overflowing.

• Journal of the Microelectronics and Packaging Society
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• v.26 no.3
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• pp.63-69
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• 2019

Soldering technology has been used in electronic industry for a long time. However, due to solder fatigue characteristics, automotive electronics are searching the semi-permanent interconnection technology such as press-fit method. Press fit interconnection is a joining technology that mechanically inserts a press fit metal terminal into a through hole in a board, and induces a strong bonding by closely contacting the inner surface joining of the through hole by plastic deformation of press-fit terminal. In this paper, the bonding properties of press-fit interconnection are investigated with PCB hole size and surface finishes. In order to compare interconnection reliability between the press fit and soldering, the change in resistance of the press-fit and soldering joints was observed during thermal shock test. After thermal cycling, the failure modes are investigated to reveal the degradation mechanism both press-fit and soldering technology.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.11 no.3
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• pp.866-872
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• 2010

In this paper, we developed a digital soldering station based on PID controller, which supply stable power by controlling the current of heater of soldering iron. The proposed system designed PID controller to converge quickly to the set up temperature by user, and regain the lost of heat by external factors quickly. PID controller, designed by Ziegler-Nichols' tuning method, decides triac's trigger timing using setting temperature and present temperature to control the phase of AC 24V power that supply to the heater. Also, we give the function that shows present temperature and setting temperature of iron, and working time by graphic LCD. And during the rest time, we decided the power saving and extension of iron tip by dropping to the optimal temperature. Two experiments had implemented in $25^{\circ}C$ laboratory to confirm the performance of proposed method. The first experiment took 12sec, 13sec, 16sec, 18sec, reaching to $200^{\circ}C$, $300^{\circ}C$, $400^{\circ}C$, $480^{\circ}C$ respectively which result showed shorten of rising time than previous method. In the loading experiment of $300^{\circ}C$, $400^{\circ}C$, $480^{\circ}C$ steady state showed temperature drop of $3.8^{\circ}C$, $4.1^{\circ}C$, $4.5^{\circ}C$ which result showed the low temperature deviation than previous method.

• Journal of Surface Science and Engineering
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• v.35 no.2
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• pp.129-137
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• 2002

The purpose of solderability assessment is to predict the effectiveness of soldering process. It is important for companies pursuing zero defects manufacturing because poor solderability is the major cause of two third of soldering failures. The most versatile solderability method is wetting balance method. However, there exist so many indices for wettability in the wetting balance test e.g. time to reach 2/3 values of maximum wetting force, tine to reach zero wetting force, maximum withdrawal force. In this study, three solderability assessment methods, which were the maximum withdrawal force, the wetting balance and the dynamic contact angle (DCA), were evaluated by comparing each other. The wetting balance technique measures the solderability by recording the forces exerted from the specimen after being dipped into the molten solder. Then the force at equilibrium state can be used to calculate a contact angle, which is known as static contact angles. The DCA measures contact angles occurred during advancing and withdrawing of the specimen and the contact angles are known as dynamic contact angles. The maximum withdrawal force uses the maximum force during withdrawal movement and then a contact angle can be calculated. In this study, the maximum withdrawal force method was found to be an objective index for measuring the solderability and the experiment results indicated good agreement between the maximum withdrawal force and the wetting balance method.

• Journal of Conservation Science
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• v.26 no.1
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• pp.13-24
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• 2010

This study examined each handiwork method of 4 filigree artifacts from Neungsan-ri temple site in Buyeo, Korea through material characteristic and microstructure analysis. As a result, it was indicated that all of the artifacts have comparatively higher purity than 22.7K and some of filigree artifacts showed that gold is alloyed with silver at a certain ratio. Gold thread that decorates surface showed thickness of 0.2~0.8mm and displayed various forms of section. Gold granule indicated that 2 or 3 granules are adhered together and they are 0.3~0.8mm in diameter. Trace of soldering was observed from gold thread and gold granule joints on surface and it confirmed a possibility of being soldering using gold solder through componential analysis. Also, it reveals a surface decorated with pigments such as cinnabar(HgS) and black.