• Corrosion Science and Technology
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• v.8 no.5
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• pp.184-187
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• 2009

The trend of the microjoining technology by the laser-soldering process has been reviewed. Among the production technologies, joining technology plays an important role in the fabrication of electronic components. This has led to an increasing attention towards the use of modern microjoining technology such as micro-resistance spot joining, micro-soldering, micro-friction stir joining and laser-soldering, etc. This review covers the recent technical trends of laser-soldering collected from the COMPENDEX DB analysis of published papers, research subject and research institutes.

• Laser Solutions
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• v.2 no.1
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• pp.38-42
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• 1999

As very large scale integration technology has been developed, much more accurate, reliable technology is needed for outer lead bonding. Laser soldering has been researched as an alternative for fine pitch device bonding. This study is focused on how to select optimal laser soldering variables with which solder wets parent material, the microstructural results of laser soldering and the reliability test One of popular packages, QFP100 was soldered successfully with two kinds of solder. The inspection of the joint for reliability was carried out by optical microscope, SEM, EDAX and pull test, which demonstrated the superiority of laser soldering.

• The Journal of Korean Academy of Prosthodontics
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• v.37 no.3
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• pp.358-374
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• 1999

This study measured the relative displacements of the five-unit fixed partial dentures as cast with the same fixed partial dentures sectioned and assembled by investment-soldering, solder-ing stand-soldering, and cast-joining techniques A total of fifteen specimens using a type IV gold alloy were one-piece cast as control and then sectioned and assembled five test specimens for each method were prepared. A computerized three dimensional coordinate measuring machine and specially designed cylinder for this study were used. Displacement was defined by six displacement variables for the each of cylinders incorporated in each casting: three component displacements(${\Delta}Lx,\;{\Delta}Ly,\;and\;{\Delta}Lz$) and rotational displacements(${\Delta}{\theta}x,\;{\Delta}{\theta}y,\;{\Delta}{\theta}z$). The global displacement was computed using the mathematical formula ${\Delta}R$ = Global displacement =$\sqrt{{(x'-x)}^2+{(y'-y)}^2+{(z'-z)}^2}$ Under the conditions of this study, the following conclusions were drawn: 1. The investment-soldering group showed the largest mean value of final global displacements, followed by stand-soldering group, cast-joining group and one-piece cast group. However, between the mean values of final global displacement for the cast-joining group and one-piece cast group, there was no significant difference. 2. For investment-soldering and stand-soldering groups, the greater global displacements were recorded in soldering phase than in indexing or investing phase. 3. For one-piece cast group, the displacements occured mostly in the casting phase. And for cast-joining group, there was no significant difference in global displacements among the fabricating procedures. 4. Intercentroidal distance decreased in framework-patterning, solder-indexing, solder-standing, and soldering phases, but increased in investment block-investing and casting phases. 5 Specially designed cylinder for touch-trigger type coordinate measuring machine was validated.

• Journal of Technologic Dentistry
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• v.36 no.4
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• pp.239-246
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• 2014

Purpose: The purpose of this study was to compare the tensile strength and mechanical properties of orthodontic wire joints made by gas soldering and laser welding, with and without filling material, to identify the effectiveness and potential clinical application of laser welded orthodontic wires. Methods: Three joint configurations of orthodontic wire were used: diameter 0.9 to 0.9 mm wire, diameter 0.9 to 0.5 wire and diameter 0.9 mm wire to band. The joints were made using three different methods: gas soldering, laser welding with and without filling material. For each kind of joint configuration or connecting method 7 specimens were carefully produced. The tensile strengths were measured with a universal testing machine (Zwick/Roell, Instron, USA). The hardness measurements were carried out with a hardness tester(Future-Tech Co. Tokyo, Japan). Data were analyzed by AVOVA(p= .05) and Turkey HD test(p= .05). Results: In all cases, gas soldering joints were ruptured on a low level on tensile bonding strength. Significant differences between laser welding and gas soldering(p< .05) were found in each joint configuration. The highest tensile strength means were observed for laser welding, with filling material, of 0.9 to 0.9 mm wire joint. Conclusion: In conclusion, the elastic modulus and tensile strength means of laser soldering with filling material were the highest, and the tensile strength means of laser soldering were higher than those of gas soldering.

• Journal of Welding and Joining
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• v.22 no.1
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• pp.65-70
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• 2004

A soldering process with longitudinal ultrasonic is conducted in this work using the Au bump and substrate. Localized heating of the solder is achieved and the stirring action due to the ultrasonic is found to influence the bond strength and microstructure of the eutectic solder The acceptable bonding condition is determined from the tensile strength. Since the multiple bonds can be formed simultaneously with localized heating, the proposed ultrasonic soldering method appears to be applicable to the high-density electronic package.

• Korean Journal of Materials Research
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• v.22 no.4
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• pp.169-173
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• 2012

Recently, various attempts to produce a heat sink made of Al 6xxx alloys have been carried out using die-casting. In order to apply die-casting, the Al alloys should be verified for die-soldering ability with die steel. It is generally well known that both Fe and Mn contents have effects on decreasing die soldering, especially with aluminum alloys containing substantial amounts of Si. However, die soldering has not been widely studied for the low Si aluminum (1.0~2.0wt%) alloys. Therefore, in this study, an investigation was performed to consider how the soldering phenomena were affected by Fe and Mn contents in low Si aluminum alloys. Each aluminum alloy was melted and held at $680^{\circ}C$. Then, STD61 substrate was dipped for 2 hr in the melt. The specimens, which were air cooled, were observed using a scanning electron microscope and were line analyzed by an electron probe micro analyzer. The SEM results of the dipping soldering test showed an Al-Fe inter-metallic layer in the microstructure. With increasing Fe content up to 0.35%, the Al-Fe inter-metallic layer became thicker. In Al-1.0%Si alloy, the additional content of Mn also increased the thickness of the inter-metallic layer compared to that in the alloy without Mn. In addition, EPMA analysis showed that Al-Fe inter-metallic compounds such as $Al_2Fe$, $Al_3Fe$, and $Al_5Fe_2$ formed in the die soldering layers.

• 한국태양에너지학회:학술대회논문집
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• 2011.11a
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• pp.303-306
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• 2011

Although PV module manufacturing and its structure are simple, the semi-permanent products can be used out doors for more than twenty years. Therefore it is need to choose proper materials and optimize manufacturing process. This paper suggest that factors of degradation need to be studied to achieve a more understanding of PV module Degradation rates and material failure. Nowadays durability of the PV Module is very important to sustain output safety for obtaining reliability. This paper is about the experiment that soldering uniformity of soldering process and to make least void from soldering process. From This study soldering flux residue and soldering method is main factor to form void blocked soldering uniformity and by using this.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.14 no.1
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• pp.45-50
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• 2013

The reflector of infrared lamp is designed to the optimal circular shape through the analyses of lumination distributions with a triangular, rectangular and circular configurations of infrared lamps respectively by using Photopia. PLC is used to compare and amplify the difference between soldering temperature profile and feedback value. It is fed to IR lamp controller which adjusts the soldering temperature of PV cell. The soldering temperature measured using an infrared temperature sensor is then fed back to the PLC. The closed control loop of soldering temperature on a PV cell is implemented. The noncontact soldering device of PV cells using infrared lamp which is easily operated by HMI operation panel and controlled robustly by PLC and IR lamp controller is developed.

• 제어로봇시스템학회:학술대회논문집
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• 1988.10a
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• pp.295-298
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• 1988

For the automation of the manual soldering process through robot technology, two main tasks have to be achieved: Control of various soldering parameters and realization of flexible tool movements like human hands. In this paper a method for attaining these tasks is presented and analyzed.

• 제어로봇시스템학회:학술대회논문집
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• 1990.10a
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• pp.47-51
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• 1990

In the system of contemporary factory, the frequent generation of robot program reduces the efficiency of robot working. In this study, the SIOPS (Soldering and Insertion Offline Programming System) that automatically generates the robot program is presented. The system can change the parameter about soldering and insertion interactively and generate the robot tool path.