• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2001년도 Proceedings of 6th International Joint Symposium on Microeletronics and Packaging
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• pp.45-47
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• 2001

Due to pressure from threatened legislation in Europe, consumer and governmental pressure in Japan, and glob머 market considerations in the US, there is a rapidly growing interest in lead-free solderinger, Although the move to lead free soldering seems inevitable, many problems will arise in production assembly. It is generally acknowledged that the lead-free solders available offer a much s smaller process window than lead/tin, related mainly to the higher soldering temperatures which naturally result from increases of liquidus temperatures of at least 300 C. However, raising reflow temperatures from the current 220-2300 C to 250 2600 C will lead to problems with the boards and components as well as i increasing oxidation effects. There is a need to keep reflow temperatures low without reducing solderablity. Some results on benefits of inert atmospheres are discussed in this paper. For example, testing in a nitrogen atmosphere, with 300 ppm oxygen, by the N National Physical Laboratory (NPU has revealed clear benefits for ine$\pi$mg lead-free alloys, by restoring the solderability to lead/tin levels, by enabling lower soldering temperatures. However, there has been little testing over a range of oxygen levels in nitrogen and this is an important issue in determining n nitrogen supply and oven costs. Some results are reported here from work by NPL conducted for BOC in w which solderability was evaluated for tin기ead and tin/silver/copper eutectic a alloys in a wetting balance over a range of oxygen levels form 10 ppm to 21% ( (air). The studies confirm that acceptable wetting times occur in inert atmospheres a at soldering temperatures 20 to 300 C lower than are possible in air.

• 마이크로전자및패키징학회지
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• 제17권1호
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• pp.1-7
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• 2010

본 연구에서는 $430^{\circ}C$에서 Bi-10Cu-20Sb-0.3Ni 조성의 솔더 합금과 Cu간의 리플로루 솔더링 시 생성되는 계면 반응층을 분석하였고, 솔더링 시간에 따른 계면 반응층의 성장 속도를 측정하였다. 리플로우 솔더링 후 Bi-10Cu-20Sb-0.3Ni/Cu의 계면 반응층을 분석한 결과, $(Cu,Ni)_2Sb$ 및 $Cu_4Sb$ 금속간 화합물층, 그리고 Bi 조성과 $Cu_4Sb$ 상이 주기적으로 존재하는 아지랑이 형상층이 연속적으로 생성되었다. 또한 120 s까지의 솔더링 시간 영역에서는 계면 반응층의 총 두께가 솔더링 시간에 대해 직선적으로 증가하는 경향이 관찰되었다. 합금원소로 첨가된 Ni은 가장 두꺼운 $Cu_4Sb$ 반응층의 형성에 참여하지 않아 계면 금속간 화합물의 성장 속도를 억제시키는 작용을 나타내지 못했다.

• 마이크로전자및패키징학회지
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• 제26권3호
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• pp.63-69
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• 2019

전자부품에 대한 보드실장은 아직까지 솔더를 이용한 접합기술을 주로 이용하고 있다. 그러나, 솔더의 크? 및 피로특성으로 인한 접합부 내구한계로, 자동차 전장모듈에서는 반영구적인 접합기술인 프레스 핏(Press-fit) 접합기술 적용을 확대하고 있다. 프레스 핏 접합은 프레스 핏 금속단자를 보드내 쓰루 홀(Through hole)에 기계적으로 삽입하여 체결하는 접합기술로써, 적절한 금속단자의 소성변형으로 쓰루 홀 내부 표면접합을 밀착시킴으로써 강건한 접합을 유도한다. 본 논문에서는 보드내 쓰루 홀 크기 및 표면처리에 따른 프레스 핏 접합 특성 및 신뢰성을 솔더링과 함께 비교하기 위해, 보드 쓰루 홀 크기에 따른 삽입강도 및 삽발강도를 평가하였으며, 열충격 시험을 통한 실시간 저항변화를 통해 프레스 핏 및 솔더링 접합부의 저항변화를 관찰하였다. 또한, 각 접합부위 분석을 통한 프레스 핏 및 솔더링 접합열화를 분석하여 주요 파손모드를 고찰하고자 하였다.

• Current Photovoltaic Research
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• 제7권3호
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• pp.65-70
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• 2019

As a demand of higher power photovoltaic modules, shingled, multi-busbar, half-cell, and bifacial techniques are developed. Multi-busbar module has advantage for large amount of light havesting. And, half-cell is high power module for reducing resistive losses and higher shade tolerance. Recently, researches on multi-busbar is focused on reliability according to adhesion and intermetallic compound between Sn-Pb solder and Ag electrode. And half-cell module is researched to comparing with full-sized cell module for structure difference. In this study, we investigated the factors affecting to efficiency and adhesion of multi-wires half-cell module according to wire thickness, solder thickness, and flux. The results of solar simulator and peel test was that peel strength and efficiency of soldered cell is not related. But samples with flux including high solid material showed high efficiency. The results of FE-SEM and EDX line scan on cross-section between wire and Ag electrode for different flux showed thickness of solder joint between wire and Ag electrode is increasing through solid material increasing. Flux including high solid material would affect to solder behavior on Ag electrode. Higher solid material occurred lower growth of IMC layer because solder permeate to sider of wire ribbon than Ag electrode. And it increased fill factor for high efficiency. In soldering process, amount of solid material in flux and solder thickness are the factor related with characteristic of soldered photovoltaic cell.

• 실천공학교육논문지
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• 제16권2호
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• pp.179-184
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• 2024

인쇄회로기판(PCB)은 전자 제품 생산에 널리 적용되는 요소부품으로 지속적으로 양적인 성장은 물론 집적도와 같은 질적인 발전도 묵과할 수 없다. 제조현장에서 보편적으로 웨이브 솔더링 장비가 사용되고 있으나 선행 연구 및 시제품 개발 단계에서는 각 PCB 제원에 맞는 전용 장비 환경을 구성할 수 없고, 범용의 고정 장비 환경에서 정해진 시간 내에 장비의 설정 조건만 변경하여 다양한 제품 군을 생산할 수밖에 없는 것이 일반적이다. 본 연구에서는 위와 같이 제한된 환경 내에서 최적의 공정 조건을 선택할 수 있도록 PCB 팔레트 도입 사례를 소개한다. 또한 현재 범용 장비에서 생산 가능 여부를 미리 판단할 수 있는 판별식을 제시하여 범용 웨이브 솔더링 장비 환경의 한계로 인해 발생할 수 있는 문제점을 사전에 파악하고 대응하도록 하고 궁극적으로 개발기간 단축 및 생산성 향상을 기대할 수 있도록 한다.

• 마이크로전자및패키징학회지
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• 제6권1호
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• pp.59-64
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• 1999

본 연구에서는 솔더링(soldering)공정 전, 기판의 최적의 건조 시간과 PCB기판에 묻은 수분이 솔더링에 미치는 영향에 대하여 조사하고자 하였다. 실험결과, 솔더링 중 건조시간이 증가할수록 솔더링성(solderabillity)이 향상됨을 알 수 있었다. 즉, 건조된 시편이 함습한 시편에 비해 젖음 시간(wetting time)이 약 0.2초 짧고 젖음력(wetting force)이 2~4mN증가되었다. 338k에서 30분 이상 건조시켰을 때 최소 미납 결함과 리드와 기판의 최고 인장강도가 얻어 졌다. 또, 건조시간을 45분가지 증가시킬 때, 건조시간 증가에 따라 솔더볼 발생 양이 감소하였다.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2009년도 하계학술대회 논문집
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• pp.371-371
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• 2009

For the application of superconducting wires to fault current limiting devices, it is required that they have a high rated voltage when a fault occurs. Stabilizer-free coated conductors, particularly, shows a good performance for the high rated voltage, which is beyond 0.6 V/cm. In this study, using the stabilizer-free coated conductors, we made fault current limiting devices and examined their characteristics. Fault current limiting devices were fabricated with a shape of the cylinder of a mono-filar coil winding. Stabilizer-free coated conductors were wound along the mono-filar coil line and the terminal parts between the wire and metal were soldered using In solder. Two kinds of devices were fabricated by a different method in the terminal joint, one was made by a soldering and the other was made by a soldering-free joint. Critical currents and resistance at the joint parts were measured. In addition, long-time current flowing tests were also carried out for the characterization of the fault current limiting devices.

• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 2002년도 Proceedings of the International Welding/Joining Conference-Korea
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• pp.439-449
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• 2002

This paper reviews our recent research works on the interconnection technologies in electronic packaging and assembly. At the aspect of advanced joining methods, laser-ultrasonic fluxless soldering technology was proposed. The characteristic of this technology is that the oxide film was removed through the vibration excitated by high frequency laser change in the molten solder droplet. Application researches of laser soldering technology on solder bumping of BGA packages were carried out. Furthermore, interfacial reaction between SnPb eutectic solder and Au/Ni/Cu pad during laser reflow was analyzed. At the aspect of soldered joints' reliability, the system for predicting and analyzing SMT solder joint shape and reliability(PSAR) has been designed. Optimization design method of soldered joints' structure was brought forward after the investigation of fatigue failure of RC chip devices and BGA packages under temperature cyclic conditions with FEM analysis and experimental study. At the aspect of solder alloy design, alloy design method based on quantum was proposed. The macroproperties such as melting point, wettability and strength were described by the electron parameters. In this way, a great deal of the experimental investigations was replaced, so as to realize the design and research of any kinds of solder alloys with low cost and high efficiency.

• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 2002년도 Proceedings of the International Welding/Joining Conference-Korea
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• pp.475-480
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• 2002

The reliability of the solder joint is affected by type and extent of the interfacial reaction between solder and substrates. Therefore, understanding of intermetallic compounds produced by soldering in electronic packaging is essential. In-based alloys have been favored bonding devices that demand low soldering temperatures. For photonic and fiber optics packaging, m-based solders have become increasingly attractive as a soldering material candidate due to its ductility. In the present work, the interfacial reactions between indium solder and bare Cu Substrate are investigated. For the identification of intermetallic compounds, both Scanning Electron Microscopy(SEM) and X-Ray Diffraction(XRD) were employed. Experimental results showed that the intermetallic compounds, such as Cu$_{11}$In$_{9}$ was observed for bare Cu substrate. Additionally, the growth rate of these intermetallic compounds was increased with the reaction temperature and time. We found that the growth of the intermetallic compound follows the parabolic law, which indicates that the growth is diffusion-controlled.d.

• 대한치과기공학회지
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• 제30권1호
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• pp.131-139
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• 2008

It's very important to find the most appropriate adhesion technique available, taking into consideration factors such as biocompatibility, non-corrosiveness, mechanical stability, etc. Laser welding is the best choice you can make because from a mechanical viewpoint, a laser welded surface has better particle structure than does a casted particle structure. Furthermore, it requires no additional material and the same metal alloy which is used when casting can be used. Therefore, the resulting mixture will consist of a single alloy, instead of utilizing different alloy combinations. Another benefit is the low economic cost. The most beneficial aspects of laser welding is that it is biologicallly friendlly, doesn't require soldering, can fuse different metal alloys together, and can weld on heat-sensitive spots(E.g. around resin or ceramic). A consistent strong pulse is possible. This technique is capable of welding on master models and creates accurate welds. It is capable of due to its stronger, non-corrosive microscope, which allows 25times magnification during the soldering process. This is possible because of its high stability from the tiny particle structure.