• Journal of Welding and Joining
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• 제32권3호
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• pp.60-67
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• 2014

The ability of electronic packages and assemblies to resist solder joint failure is becoming a growing concern. This paper reports on a study of high speed shear energy of Sn-4.0wt%Ag-0.5wt%Cu (SAC405) solder with different electroless Ni-P thickness, with $HNO_3$ vapor's status, and with various pre-conditions. A high speed shear testing of solder joints was conducted to find a relationship between the thickness of Ni-P deposit and the brittle fracture in electroless Ni-P deposit/SAC405 solder interconnection. A focused ion beam (FIB) was used to polish the cross sections to reveal details of the microstructure of the fractured pad surface with and without $HNO_3$ vapor treatment. A scanning electron microscopy (SEM) and an energy dispersive x-ray analysis (EDS) confirmed that there were three intermetallic compound (IMC) layers at the SAC405 solder joint interface: $(Ni,Cu)_3Sn_4$ layer, $(Ni,Cu)_2SnP$ layer, and $(Ni,Sn)_3P$ layer. The high speed shear energy of SAC405 solder joint with $3{\mu}m$ Ni-P deposit was found to be lower in pre-condition level#2, compared to that of $6{\mu}m$ Ni-P deposit. Results of focused ion beam and energy dispersive x-ray analysis of the fractured pad surfaces support the suggestion that the brittle fracture of $3{\mu}m$ Ni-P deposit is the result of Ni corrosion in the pre-condition level#2 and the $HNO_3$ vapor treatment.

• 한국주조공학회지
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• 제20권2호
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• pp.116-121
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• 2000

Interfacial reaction and mechanical properties between Sn-Zn-X ternary alloys(X : 3wt.%In, 4wt.%Bi) and Cu-substrate were studied. Cu/solder joints were subjected to aging treatments for up to 50days to see interfacial reaction at $100^{\circ}C$ and then were examined changes of microstructure and interfacial compound by optical microscopy, SEM and EDS. Cu/solder joints were aged to 30days and then loaded to failure at cross head speed of 0.3 mm $min^{-1}$ to measure tensile strength. According to the results of the solderability test, additions of In and Bi in the Sn-9wt.%Zn solder improve the wetting characteristics of the alloy and lower the melting temperature. Through the EDS and XRD analysis of Cu/Sn-9wt.%Zn solder joint, it was concluded that the intermetallic compound was the ${\gamma}-Cu_5Zn_8$ phase. Cu-Zn intermetallics at Cu/solder interfaces played an important role in both the microstructure evolution and failure of solder joints. Cu/solder joint strength was decreased by aging treatment, and those phenomenon was closely related to the thickening of intermetallic layer at Cu/solder joints.

• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 2005년도 춘계학술발표대회 개요집
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• pp.25-27
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• 2005

Sn-9Zn solder balls were bonded to Cu and ENIG (Electroless Nickel/Immersion Gold) pads, and the effect of aging on their joint reliability was investigated. The interfacial products were different from the general reaction layer formed in a Sn-base solder. The intermetallic compounds formed in the solder/Cu joint were $Cu_{5}Zn_{8}$ and $Cu_{6}Sn_{5}$. After aging treatment, voids formed irregularly at the bottom side of the solder because of Sn diffusion into the $Cu_{5}Zn_{8}$ IMC. In the case of the solder/ENIG joint, $AuZn_{3}$ IMCs were formed at the interface. In the case of the Sn-9Zn/ENIG, the shear strength remained nearly constant in spite of aging for 1000 hours at $150^{\circ}C$. On the other hand, in the case of the Sn-9Zn/Cu, the shear strength significantly decreased after aging at $150^{\circ}C$ for 100hours and then remained constant by further prolonged aging. Therefore, the protective plating layer such as ENIG must be used to ensure the mechanical reliability of the Sn-9Zn/Cu joint.

• Journal of Welding and Joining
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• 제20권2호
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• pp.77-81
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• 2002

Many kinds of Pb-free solder have been investigated because of the environmental concerns. Sn-Ag-Cu system is well blown as most competitive Pb-free solder. However, since Sn-Ag-Cu system has relatively high melting point compared to Sn-Pb eutectic, it may a limitation, the some application. In this study, Bi and In contained solder of $Sn_3Ag_8Bi_5In$ which has relatively lower melting point, $188~204^{\circ}C$, was investigated. $Sn_3Ag_8Bi_5In$ solder ball of $500\mu\textrm{m}$ diameter was set on the Ni/Cu/Cr-UBM and reflow soldered in the range of $220~240^{\circ}C$ for 5~15s. The maximum shear strength of the solder ball was around 170mN by reflowing at $240^{\circ}C$ for 10s. Intermetallic compound formed on the UBM of Si-wafer was analysed by SEM(scanning electron microscope) and XRD(X-ray diffractometer).

• 제어로봇시스템학회:학술대회논문집
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• 제어로봇시스템학회 1997년도 한국자동제어학술회의논문집; 한국전력공사 서울연수원; 17-18 Oct. 1997
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• pp.36-39
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• 1997

In this paper, we described an approach to design of precision optical system for visual inspection of solder joint defects of SMC(surface mount components) on PCBs(Printed Circuit Board). The illumination system, consisting of three tiered LED lamps and one main camera and four side view camera, is implemented to generated iso-contour on the solder joint according to gradient of the soldered surface. We analyze LED design parameter such as incident angle, diameter of LED ring, and so on to acquire uniform illumination.

• 전자공학회논문지B
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• 제33B권11호
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• pp.53-61
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• 1996

In this paper, efficient techniques for solder joint inspection have been described. Using three layers of ring shaped LED's with different illumination angles, three frames of images are sequentially obtained. From these images the regions of interest (soldered regions) are segmented, and their characteristic features including the average gray level and the percentage of highlights - refereed to as 2D features - are extracted. Based on the backpropagation algorithm of neural networks, each solder joint is classified intor one of the pre-defined types. If the output value is not in the confidence interval, the distribution of tilt angles-referred to as 3D features - is claculated, and the solder joint is classified based on the bayes classfier. The second classifier requires more computation while providing more information and better performance. The proposed inspection system has been implemented and tested with various types of solder joints in SMDs. The experimental results have verified the validity of this scheme in terms of speed and recognition rate.

• Journal of Welding and Joining
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• 제18권6호
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• pp.42-47
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• 2000

The object of this study is to estimate Sn-Ag-Bi-Ga solder alloy as a substitute for Sn-37Pb alloy. For Sn-Ag-Bi-Ga alloys, Ag, Bi and Ga contents are varied. (Ag : 1~5%, Ga : 3%, Bi : 3~6%) Comparing to Sn-37Pb alloy Sn-Ag-Bi-Ga alloys have wider melting temperature range up to max. $18.7^{\circ}C$. With increasing Ag, Bi contents, the wettability of the alloys increased up to max. 6.6 mN. The vickers hardness of the alloys was max. 46.4 Hv. The ultimate tensile stress of the alloys was max. 60.3 MPa and the elongation was max. 1.2%. The joint strength between circuit board and solder was max. 55.5 N and the joint strength between connector and solder was max. 176.1 N. There were no cracks in this alloys after thermal shock test.

• 한국정밀공학회지
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• 제15권7호
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• pp.26-35
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• 1998

This paper presents a visual inspection algorithm looking for solder joint defects of IC chips on PCBs (Printed Circuit Boards). In this algorithm, seven features are proposed in order to categorize the solder joints into four classes such as normal, insufficient, excess, and no solder, and optimal back-propagation network is determined by error evaluation which depend on the number of neurons in hidden and out-put layers and selection of the features. In the end, a good accuracy of classification performance, an optimal determination of network structure and the effectiveness of chosen seven features are examined by experiment using proposed inspection algorithm.

• Journal of Welding and Joining
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• 제16권4호
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• pp.117-124
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• 1998

During the reflow process in SMT, the molten solder has been observed to move upward and solidify along the gullwing lead, which is called the wicking phenomenon. In this paper, possible causes of the wicking are investigated, and its effects on the solder joint profile are quantitatively estimated by introducing the wicking constant. The free energy reduction by intermetallic formation between the copper and tin seems to be the major source of wicking action. The joint profiles of the gullwing lead are calculated using the previous finite element formulation incorporated with the wicking constant. The calculated results show reasonably good agreements with the experimental data when the wicking effects are considered.

• 마이크로전자및패키징학회지
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• 제30권1호
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• pp.17-29
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• 2023

본 논문에서는 전자제품의 소형화와 고성능화에 따라 패키징 기술에서 핵심적인 역할을 하는 솔더 조인트의 신뢰성 평가 방법을 소개한다. 우선, 다양한 합금 조성과 제품 형태에 따른 솔더의 특성을 설명하고, 여러 패키지에서의 솔더 조인트 구조에 대한 개요를 제시한다. 그 다음 솔더 합금의 조성과 미시구조가 솔더의 열적 및 기계적 특성에 미치는 영향을 분석하며, 솔더 크리프 거동에 대해 간략히 소개한다. 이어서, 신뢰성 평가를 위한 크리프 모델과 피로 모델 등을 고려한 분석 기법들을 소개하고, 솔더 조인트의 신뢰성을 향상시킬 수 있는 방안에 대해 논의한다. 본 연구는 반도체 패키징 기술 분야에서 솔더 조인트의 신뢰성 평가와 개선에 유익한 정보를 제공할 것으로 기대된다.