• Journal of the Microelectronics and Packaging Society
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• v.29 no.2
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• pp.33-41
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• 2022

Recent necessities of research have emerged about soft interconnection technologies for stable electric connections in flexible electronics. Mechanical failure in conventional metal solder interconnection can be solved as soft interconnections based on a small elastic modulus and a thin thickness. To enable stable electric connection while improving mechanical properties, highly conductive materials be thinned or mixed with a material that has a small elastic modulus. Representative soft interconnection technologies such as thin-film metallization, flexible conductive adhesives, and liquid metal interconnections are presented in this paper, and be focused on mechanical/electric properties improving strategies and their applications.

• International Journal of Fuzzy Logic and Intelligent Systems
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• v.11 no.3
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• pp.184-189
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• 2011

Generalized intuitionistic fuzzy soft set theory, proposed by Park et al. [Journal of Korean Institute of Intelligent Systems 21(3) (2011) 389-394], has been regarded as an effective mathematical tool to deal with uncertainties. In this paper, we prove that certain De Margan's law hold in generalized intuitionistic fuzzy soft set theory with respect to union and intersection operations on generalized intuitionistic fuzzy soft sets. We discuss the basic properties of operations on generalized intuitionistic fuzzy soft sets such as necessity and possibility. Moreover, we illustrate their interconnections between each other.

• The Transactions of the Korean Institute of Electrical Engineers C
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• v.51 no.7
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• pp.311-315
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• 2002

Chemical mechanical polishing (CMP) process was required for the global planarization of inter-metal dielectric(IMD), inter-level dielectric (ILD) layers of multi-layer interconnections. In this paper, we studied the characteristics of polishing pad, which can apply shallow trench isolation (STI)-CMP process for global planarization of multi-level interconnection structure. Also, we investigated the effects of different sets of polishing pad, such as soft and hard pad. As an experimental result, hard pad showed center-fast type, and soft pad showed edge-fast type. Totally, the defect level has shown little difference, however, the counts of scratch was detected less than 2 on JR111 pad. Through the above results, we can select optimum polishing pad, so we can expect the improvements of throughput and device yield.