• Economic and Environmental Geology
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• v.13 no.3
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• pp.167-184
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• 1980

The granitic plutons associated with Ogcheon geosynclinal zone can be grouped into three different subzones; SE-Subzone for the migmatitic and schistose granites of the southeast margin, 101-181m.y. old; NW-Subzone for those of the northwest margin, 112-163m. y. old; and C-Subzone for those of central part of the zone, 63-183m.y. old. The intrusives in C-Subzone are further subdivided into the older, adamellite to granodiorite (148-183m.y. old) and the younger, perthitic granites (63-106m,y. old). The metallogenic distribution of South Korea suggests that, in the Ogcheon Zone, it is possible to delineate an elongated polymetallogenic province in the general orientation of the zone intimately related with the migmatite and plutonic zones mentioned. Moreover, the mineralization in the province was basically controlled by the patterns of local geology involving country rocks and related igneous bodies, that permit subdivision of the province into the following three parts: Northeast (NE) Province consists dominantly of thick Paleozoic calcareous sediments; Middle (M) Province is characterized by predominant argillaceous and partly calcareous sediments of Precambrian to Late Paleozoic age; and Southwest (SW) Province consisting mainly of volcanic and arenaceous sediments of Mesozoic age. The three different plutonic zones with three different country rock provinces above mentioned make a combination which consists of nine classes. Each class can be assumed to be characterized by specific mineralization type. In order to classify the mineralization types, the present study sampled twenty six ore deposits and mineralized areas in Ogcheon zone as shown figure 2; eight ore deposits from plutonic SE-Subzone, ten from the plutonic NE-Subzone and eight from the plutonic C-Subzone. The characteristics of the classes are as follows: NE-SE is predominant in Au-Ag vein and Sn-migmatite of katazonal occurrence; NE-C is most productive in Pb-Zn and remarkable in Fe contact deposit in mesozone and partly Pb-Zn-Cu skarn in limestone and subordinate in mesozone and partly Pb-Zn pipes; M-SE is considerable in Au-Ag vein and rare elements (Nb, Ta, etc.) of pegmatite; M-C is predominant in F-veins in epizone and Mo-W, Fe, Cu veins occur in replacement type; M-NW is productive in Fe metamorphic and skarn types, partly remarkable in Cu, Pb-Zn contact; SW-SE is barren in mineralization related to Jurassic igneous rocks; SW-C is predominant in alunite and pyrophyllite in tuffs; and SW-NW is scarece in Pb-Zn, Cu, As and Au-Ag veins.

• Nuclear Engineering and Technology
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• v.55 no.3
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• pp.1061-1070
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• 2023

Over the last few years, lead-free inorganic metal perovskites have gained impressive ground in empowering satellites in space exploration owing to their material stability and performance evolution under extreme space environments. The present work has examined the versatility of eight such perovskites as space radiation shielding materials by computing their photon, charged particles and neutron interaction parameters. Photon interaction parameters were calculated for a wide energy range using PAGEX software. The ranges of heavy charged particles (H, He, C, N, O, Ne, Mg, Si and Fe ions) in these perovskites were estimated using SRIM software in the energy range 1 keV-10 GeV, and that of electrons was computed using ESTAR NIST software in the energy range 0.01 MeV-1 GeV. Further, the macroscopic fast neutron removal cross-sections were also calculated to estimate the neutron shielding efficiencies. The examined shielding parameters of the perovskites varied depending on the radiation type and energy. Among the selected perovskites, Cs₂TiI₆ and Ba₂AgIO₆ displayed superior photon attenuation properties. A 3.5 cm thick Ba₂AgIO₆-based shield could reduce the incident radiation intensity to half its initial value, a thickness even lesser than that of Pb-glass. Besides, CsSnBr₃ and La_0.8Ca_0.2Ni_0.5Ti_0.5O₃ displayed the highest and lowest range values, respectively, for all heavy charged particles. Ba₂AgIO₆ showed electron stopping power (on par with Kovar) better than that of other examined materials. Interestingly, La_0.8Ca_0.2Ni_0.5Ti_0.5O₃ demonstrated neutron removal cross-section values greater than that of standard neutron shielding materials - aluminium and polyethylene. On the whole, the present study not only demonstrates the employment prospects of eco-friendly perovskites for shielding space radiations but also suggests future prospects for research in this direction.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2004.09a
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• pp.93-99
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• 2004

At present, LG Electronics pushes ahead to eliminate the Pb(Lead) -a hazardous material- from all products. Especially, we have performed to select the optimum standard composition of lead free alloy for the application to products for about 3 years from 2000. These days, we have the chance for applying to the mass-production. This project constructed the system for applying the lead free solders on consumer electronic products, which is one of the major products of the LG Electronics. To select the lead free solders with corresponding to the product features, we have passed through the test and applied with Sn-3.0Ag-0.5Cu alloy system to our products, and for the application to the high melting temperature composition, we secured the thermal resistance of the many parts and substrate and optimized the processing conditions. We have operated the temperature cycling test and the high temperature storage test under the standards to confirm the reliability of the products. On these samples, we considered the consequence of our decision by the operating test. For the long life time of the product, we have operated the temperature cycling test at $-45^{\circ}C-+125^{\circ}C$, 1 cycle/hour, 1000 cycles. Also we have tested the tin whisker growth about lead free plating on lead finish. We have analyzed with the SEM, EDS and any other equipment for confirming the failure mode at the joint and the tin whisker growth on lead free finish.

• Journal of the Korean Society of Clothing and Textiles
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• v.37 no.6
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• pp.764-771
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• 2013

The metal component of Chinese and Korean traditional gold thread was analyzed nondestructively using P-XRF and classified morphologically. In the nondestructive analysis of 22 Chinese and Korean artifacts, there were 10 gold threads made up of Au in China and 7 in Korea; in addition, there were 4 silver threads made up of Ag in Korea and 1 copper thread made up of Cu in China. In the morphological classification, 7 gilt paper strips were confirmed in China and Korea and 4 wrapped threads were identified in China and Korea. Zn, Sn and Fe (minor components of the threads) were detected. These components were assumed to be transferred from the metal found in burial goods.

• Proceedings of the Korean Vacuum Society Conference
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• 2016.02a
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• pp.276.1-276.1
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• 2016

본 연구에서는 차세대 유연 투명 히터 (Flexible and transparent heater) 제작을 위한 ATO 나노입자-은 네트워크 하이브리드 투명 전극의 특성을 연구하였다. 최적화된 은 네트워크 (Self-assembled Ag network) 투명 전극 상에 20-30 nm의 직경을 가지는 ATO (Sb-doped $SnO_2$) 나노입자를 스프레이 방식으로 상압, 상온에서 코팅하여 인쇄형 ATO-은 네트워크 하이브리드 투명 전극을 구현하였다. 스프레이로 코팅된 투명 ATO 나노 입자는 은 네트워크 전극의 빈 공간을 매워 줌으로써 은 네트워크 간의 연결성 및 표면 조도를 낮춰주어 유연 투명 히터 작동 시 전류의 집중 현상을 막아줄 수 있다. ATO-은 네트워크 하이브리드 투명 전극의 최적화를 위해 스프레이 횟수에 따른 하이브리드 투명 전극의 전기적, 광학적, 표면 특성을 분석하였으며, 최적의 조건에서 14 Ohm/square의 면저항과 66%의 투과도를 가지는 하이브리드 투명 전극을 구현하였다. 또한 FESEM 분석을 통해 ATO-은 네트워크 하이브리드 전극의 표면 및 계면 구조를 연구하고 ATO 코팅이 은 네트워크 전극의 특성에 미치는 영향을 규명하였다. 최적화된 ATO-은 네트워크 하이브리드 투명 전극을 이용하여 유연 투명 히터를 제작하고 전압에 따른 히터의 온도의 변화를 측정하여 차세대 유연 투명 히터용 투명 전극으로 인쇄기반 ATO-은 네트워크 하이브리드 투명 전극의 가능성을 확인하였다.

• Proceedings of the KSME Conference
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• 2004.11a
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• pp.244-249
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• 2004

In this paper, shielding effectiveness(SE) of the shielding paint of electromagnetic(EM) waves was investigated with actual experiments. The shielding paint used in this study were made of powder of conductive materials - Ag, Cu, Al, Sn, Ni. Cr, Graphite and Charcoal etc. with a solubility in oil and water. Also, the paper was used as a base sheet. The experiment was carried out by using a shielding evaluator(Shielding box) TR17302 with an ADVANTEST spectrum analyzer, model R3361C. It was found from the experimental results that silver, copper, nickel were good candidates as a shielding material against the EM waves with increasing the SE as the composite was laminated. The characteristics of the SE against the EM waves depended on a mode of preparation of specimen. The effects of density of particles on the SE were studied about the EM shielding paint. The SE strongly depended on the electric resistance by density of painting particles. SE increased as the density of particles was increasing.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.23 no.3
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• pp.237-242
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• 2014

Recently much research are has been done into the compositions of lead-free solders. As a result, there has been a rapid increase in the number of new compositions. In the past, the properties of these new compositions were determined and verified through drop-impact tests. However, these drop tests were expensive and it took a long time to obtain a result. The main goal of this study was to establish an analytical method capable of predicting the impact life-time of a new solder composition for board-level flip chips though the application of drop simulations using LS-DYNA. Based on the reaction load obtain with LS-DYNA, the drop-impact fracture cycles were predicted. The study was performed using a Sn-3.0Ag-0.5Cu solder (305 composition). To verify the reliability of the proposed analytical method, the results of the drop-impact tests and life-time analysis were compared, and were found to be in good agreement. Thus, the new analytical method was shown to be very useful and effective.

• Journal of Applied Biological Chemistry
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• v.42 no.1
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• pp.7-11
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• 1999

An extracellular chitinase of the selected strong antifungal microorganism, Serratia sp. 3095, was purified by salting out, affinity adsorption, Sepadex G-100 gel fitration, Sepadex G-75 gel fitration and DEAE Sepadex A-50 chromatography. The molecular weight of the purified chitinase was estimated to be 62,000 dalton by SDS-PAGE. Optimal pH and temperature of the chitinase were pH 7.5 and 45, respectively. The enzyme retained more than 80% of the activity between pH 5.5 and pH 10.5, and below $50^{\circ}C$ but was unstable above $60^{\circ}C$, below pH 5.0. The activity of the chitinase was inhibited about 60% by $Sn^{2+}$, 40% by $Hg^{2+}$ and $Ag^+$, 70% by AHA, 40% by iodoacetate, 35% by thiourea and p-CMB, but stabilized by SDS. $K_m$ value of the purified chitinase was 3.68 mg/ml for colloidal chitin. The chitinase from Serratia sp. 3095 showed antifungal activity to Fusariurm solani.

• Journal of the Microelectronics and Packaging Society
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• v.18 no.4
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• pp.1-9
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• 2011

Understanding the void characterization in the solder joints has become more important because of the application of lead free solder materials and its reliability in electronic packaging technology. According to the JEDEC 217 standard, it describes void types formed in the solder joints, and divides into some categories depending on the void position and formation cause. Based on the previous papers and the standards related to the void, reliability of the BGA solder joints is determined by the size of void, as well as the location of void inside the BGA solder ball. Prior to reflow soldering process, OSP(organic surface preservative) finished Cu electrode was exposed under $85^{\circ}C$/60%RH(relative humidity) for 168 h. Voids induced by the exposure of $85^{\circ}C$/60%RH became larger and bigger with increasing aging times. The void position has more influence on mechanical strength property than the amount of void growth does.

• Transactions of the Korean Society of Machine Tool Engineers
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• v.16 no.5
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• pp.134-139
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• 2007

This paper presents a computer-based analysis on the thermal shock characteristics of Pb-free solder joints and UBM in flip chip assemblies. Among four types of popular UBM systems, TiW/Cu system with 95.5Sn-3.9Ag-0.6Cu solder joints was chosen for simulation. A simple 3D finite element model was first created only including silicon die, mixture between underfill and solder joints, and substrate. The displacements due to CTE mismatch between silicon die and substrate was then obtained through FE analysis. Finally, the obtained displacements were applied as mechanical loads to the whole 2D FE model and the characteristics of flip chip assemblies were analyzed. In addition, based on the hyperbolic sine law, the accumulated creep strain of Pb-free solder joints was calculated to predict the fatigue life of flip chip assemblies under thermal shock environments. The proposed method for fatigue life prediction will be evaluated through the cross check of the test results in the future work.