• 한국문화재보존과학회:학술대회논문집
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• 한국문화재보존과학회 2004년도 제20회 발표논문집
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• pp.137-153
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• 2004

We have analyzed the ingredients of 17 pieces of Bronze Age bronze ware, and an additional 22 pieces of Koryo and Chosun dynasty bronze ware. We have also conducted analysis of the extraction sites where these bronze ware items were found. For analyzing the main ingredient the bronze ware items have been divided into 3 groups - Cu-Sn(70?75:20), Cu-Pb-Sn(70:10:10), Cu-Pb-Sn(60:10:20) type respectively. In tile cases of the Cu-Pb-Sn groups the division comes down to differences in the Cu content as the main component, and elements such as Ni, Fe, Co contribute as a micro ingredient. The geographical and periodic characteristics of ancient bronze ware items show that theircompositional element changes from Cu:Sn to Cu:Pb:Sn and the Cu content decreases with the period,while the Pb content increases with the period. Bronze ware items from Suchon Ri, Gongju (that were used in 3 B.C.) form very different categories from 3rd ${\~}$ 2nd B.C.. They additionally formed very different categories from those bronze ware items analyzed in this research. These bronze ware itemsare shown to be geographically close and periodically overlapped, but made of a new elemental composition. This shows an inflow of a production technical culture present in the new bronze wares. The main component content of Cu is lower, and the Co and Fe contents (as microelements) are much higher than that of other bronze ware items. Such facts showthat those bronze ware items used completely different materials from bronze ware items in other cultural areas, or that there were differences in smelting techniques In the places where ancient bronze ware items have been extracted, it is presumed that the materials originated from the southern parts of Korea andnorthern parts and southern parts of China. .As more bronze ware scientific research is compiled one can conclude that that there will be enough scientific evidence to study the Bronze Age culture of Koreasystematically.

• 대한기계학회논문집B
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• 제21권2호
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• pp.264-274
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• 1997

A numerical analysis on condensation and coagulation of the metallic species with fly ash particles pre-existing in an incinerator was performed. Waste was simplified as a mixture of methane, chlorine, and small amounts of Pb and Sn. Vapor-phase amounts of Pb- and Sn -compounds were first calculated assuming a thermodynamic equilibrium state. Then theories on vapor-to-particle conversion, vapor condensation onto the fly ash particles, and particle-particle interaction were examined and incorporated into equations of aerosol dynamics and vapor continuity. It was assumed that the particles followed a log-normal size distribution and thus a moment model was developed in order to predict the particle concentration and the particle size distribution simultaneously. Distributions of metallic vapor concentration (or vapor pressure) were also obtained. Temperature drop rate of combustion gas, fly ash concentration and its size were selected as parameters influencing the discharged amount of metallic species. In general, the coagulation between the newly formed metal particles and the fly ash particles was much greater than that between the metal particles themselves or between the fly ash particles themselves. It was also found that the amount of metallic species discharged into the atmosphere was increased due to coagulation. While most of PbO vapors produced from the combustion were eliminated due to combined effect of condensation and coagulation, the highly volatile species, PbCl$_{2}$ and SnCl$_{4}$ vapors tended to discharge into the atmosphere without experiencing either the condensation or the coagulation. For Sn vapors the tendency was between that of PbO vapors and that of PbCl$_{2}$ or SnCl$_{4}$. To restrain the discharged amount of hazardous metallic species, the coagulation should be restrained, the number concentration and the size of pre-existing fly ash particles should be increased, and the temperature drop rate of combustion gas should be kept low.

• Journal of Welding and Joining
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• 제15권2호
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• pp.36-42
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• 1997

In this paper, stability of initial strength at solder joint with lead free solders, such as Sn-In (52-48%) and Sn-Ag (96.5-3.5wt%) was studied. To obtain at solder joint with high quality, it is very important to control the temperature at the interface of solder joints. It is found that the thermal EMF (electro motive force) occurs betwee lead frame and copper pad on a substrate during reflow soldering process using heated tip. As a result of control the temperature at interface of solder joints, variation of initial strength at solder joint decreases from about $\pm40%$ to $\pm20%$, and it is realized Pb free soldering process using Sn/In and Sn-Ag solder paste.

• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 2005년도 추계학술발표대회 개요집
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• pp.228-230
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• 2005

Sn-8wt%Zn-3wt%Bi (이하, Sn-8Zn-3Bi) 솔더의 장기 신뢰성을 평가하기 위하여 고용고습시험을 행하였다. 고온 고습 시험은 $85^{\circ}C$/85RH 조건에서 1000 시간 동안 하였다. 접합 기판으로는 각각 OSP (Organic Solderability Preservative), Sn 그리고 Ni/Au 처리를 한 PCB(Printed Circuit Board) 패드를 사용하였다. 접합에 사용한 부품은 1608Chip 으로 MLCC(Multi Layer Ceramic Capacitor 이하, 1608C) 와 Chip Resister(이하, 1608R)을 사용하였으며, 이 두 부품의 전극부위에 Sn-10wt%Pb(이하 Sn-l0PB), Sn을 각각 도금하였다. 솔더링 후 1608C 와 1608R의 전단 접합 강도와 솔더링부에서 Zn상의 변화를 관찰하였다. 측정결과, Sn-8Zn-3Bi 솔더의 초기 전단 접합 강도는 기판의 표면처리에 상관없이 약 40N 이었다. 그러나 고온 고습 시험 1000 시간 후에는 기판의 표면처리에 상관없이 약 30N 까지 감소하였다. 하지만 이는 reference인 Sn-37Pb 솔더의 강도값과 거의 유사하며, 이는 Sn-8Bi-3Zn 솔더의 고온 고습 시험 후 전단강도 특성은 기존 유연솔더와 비교하여 동등이상이라고 평가할 수 있다.

• 대한금속재료학회지
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• 제47권3호
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• pp.202-208
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• 2009

The effects of aging time on the microstructure and shear strength of the Low Temperature Co-fired Ceramic (LTCC)/Ag pad/Electroless Nickel Immersion Gold (ENIG)/BGA solder joints were investigated through isothermal aging at $150^{\circ}C$ for 1000 h with conventional Sn-37Pb and Sn-3Ag-0.5Cu. $Ni_3Sn_4$ intermetallic compound (IMC) layers was formed at the interface between Sn-37Pb solder and LTCC substrate as-reflowed state, while $(Ni,Cu)_3Sn_4$ IMC layer was formed between Sn-3Ag-0.5Cu solder and LTCC substrate. Additional $(Cu,Ni)_6Sn_5$ layer was found at the interface between the $(Ni,Cu)_3Sn_4$ layer and Sn-3Ag-0.5Cu solder after aging at $150^{\circ}C$ for 500 h. Thickness of the IMC layers increased and coarsened with increasing aging time. Shear strength of both solder joints increased with increasing aging time. Failure mode of BGA solder joints with LTCC substrate after shear testing revealed that shear strength of the joints depended on the adhesion between Ag metallization and LTCC. Fracture mechanism of Sn-37Pb solder joint was a mixture of ductile and pad lift, while that of Sn-3Ag-0.5Cu solder joint was a mixture of ductile and brittle $(Ni,Cu)_3Sn_4$ IMC fracture morphology. Failure mechanisms of LTCC/Ag pad/ENIG/BGA solder joints were also interpreted by finite element analyses.

• 한국공작기계학회논문집
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• 제16권5호
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• pp.151-156
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• 2007

In this paper, the creep characteristics of lead and lead-free solder joint were investigated using the QFP(Quad Flat Package) creep test. Two kind of solder pastes(Sn-3Ag-0.5Cu, Sn-0.2Sb-0.4Ag-37.4Pb) were applied to the QFP solder joints and each specimen was checked the external and internal failures(i.e., wetting failure, void, pin hole, poor-heel fillet) by digital microscope and X-ray inspection. The creep test was conducted at the temperatures of $100^{\circ}C$ and $130^{\circ}C$ under the load of 15$\sim$20% of average pull strength in solder joints. The creep characteristics of each solder joints were compared using the creep strain-time curve and creep strain rate-stress curves. Through the comparison, the Sn-3Ag-0.5Cu solder joints have higher creep resistance than that of Sn-0.3Sb-0.4Ag-37.4Pb. Also, the grain boundary sliding in the fracture surface and the necking of solder joint were observed by FE-SEM.

• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 2006년도 춘계 학술대회 개요집
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• pp.215-217
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• 2006

• 한국세라믹학회:학술대회논문집
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• 한국세라믹학회 2000년도 추계총회,초청강연,특별강연,연구발표회
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• pp.110.1-110
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• 2000

• 한국재료학회:학술대회논문집
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• 한국재료학회 2001년도 추계 학술발표강연 및 논문개요집
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• pp.186-186
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• 2001

• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 2004년도 춘계 학술발표대회 개요집
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• pp.81-83
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• 2004

최근 대두되고 있는 환경오염문제로 인해 전자산업에서는 전 세계적으로 Pb 솔더에 관한 규제가 진행중에 있다. 이에 Pb free 솔더에 관한 연구가 활발히 진행 중에 있으며 그 중 Sn-Ag계 solder는 유력한 대체 solder로 대두되고 있다. (중략)