• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2003.11a
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• pp.128-132
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• 2003

무전해 Ni-P UBM과 3가지 경우의 무연 솔더간의 계면연구를 통해 Bi가 솔더의 합금원소로 들어감에 따라 계면반응에 어떠한 영향을 줄 수 있는 가를 연구했다. 3가지 다른 무연 솔더는 Bi가 각각 $0wt\%,\;4.8wt\%,\;58wt\%$들어간 Sn3.5Ag, Sn3.5Ag4.8Bi, Sn58Bi 이다. reflow를 수행한 후에 세 가지 솔더에서 나타나는 계면에서의 IMC는 $Ni_3Sn_4$로서 어떤 다른 솔더도 Bi를 함유한 IMC가 계면에선 관찰되지 않았다. 다만 SnAgBi 솔더의 경우 특이하게 솔더내에서 침상의 $Ni_3Sn_4$가 reflow후에 관찰되었다. 또한 반응속도의 척도가 되는 Ni-P UBM소모속도를 비교해 보면 reflow후의 SnAg와 SnAgBi의 경우에는 비슷하나 SnBi의 경우에는 알서 두 솔더에 비해 눈에 띠게 느림을 관찰하였다. 이러한 Ni-P UBM의 소모경향을 Bi의 함량, 그에 따른 Sn의 상대적인 함량의 관점에서 고찰하고자 한다.

• Korean Journal of Environmental Agriculture
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• v.31 no.2
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• pp.122-128
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• 2012

BACKGROUND: Mine drainage from metal mining districts is a well-recognized source of environmental contamination. Oxidation of metal sulfides in mines, mine dumps and tailing impoundments produces acidic, metal-rich waters that can contaminate the local surface water and soil. METHODS AND RESULTS: This experiment was carried out to investigate the pollution assessment of heavy metal on the water quality of mine drainage, paddy soils and sediment in lower watershed affected by mine drainage of the Sambo mine. The average concentrations of dissolved Cd (0.018~0.035 mg/L) in mine drainage discharged from the main waste rock dumps(WRD) was higher than the water quality standards (0.01 mg/L) for agricultural water in Korea. Also, the average concentrations of dissolved Zn, Fe and Mn were higher than those of recommended maximum concentrations (Zn 2.0, Fe 5.0, Mn 0.2 mg/L) of trace metal in irrigation water proposed by FAO (1994). The average contents of Pb and Zn in paddy soils was higher than those of standard level for soil contamination(Pb 200, Zn 300 mg/kg) in agricultural soil by Soil Environmental Conservation Act in Korea. Also, the concentrations of Cd, Pb and Zn in sediment were higher than those of standard level for soil contamination (Cd 10, Pb 400, Zn 600 mg/L) in waterway soil by Soil Environmental Conservation Act in Korea. The enrichment factor (EFc) of heavy metals in stream sediments were in the order as Cd>Pb>Zn> As>Cu>Cr>Ni. Also, the geoaccumulation index (Igeo) of heavy metals in stream sediments were in the order as Zn>Cd>Pb>Cu>As>Cr>Ni, specially, the geoaccumulation index (Igeo) of Zn (Igeo 3.1~6.2) were relatively higher than that of other metals in sediment. CONCLUSION(s): The results indicate that stream water and sediment were affected by mine drainage discharged from the Sambo mine at least to a distance of 1 km downstream (SN-1, SN-2) of the mine water discharge point.

• Korean Journal of Environmental Biology
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• v.25 no.4
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• pp.313-318
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• 2007

Monitoring for the quality of coastal water is necessary to improve its biological resources and to maintain healthy environments. We measured the concentrations of phenols, nine polychlorinated biphenyls (PCBs), tributyltin (TBT) in surface water at 5 stations and the concentrations of mercury (Hg), chromium (Cr (VI)), cadmium (Cd), lead (Pb) in surface water of 10 stations in Tongyeong marine ranching ground of Korea in August, 2003. The concentrations of analytes were determined as follows: phenols: 1.6$\sim$2.8 ppb, PCBs: not detected (ND), Hg: <0.1 ppb, Cr (VI): 0.01$\sim$5.32 ppb, Cd: ND$\sim$0.41 ppb and Pb: 0.43$\sim$2.60 ppb. These concentrations satisfied the standards of human health protection in coastal water by Ministry of Environment, Republic of Korea as follows: phenols; 5 ppb, PCBs: 0.5 ppb, Hg: 0.5 ppb, Cr (VI): 50 ppb, Cd: 10 ppb and Pb: 50 ppb. TBT was not listed in the standards. The concentrations of Sn in TBT analyzed in sea water of Tongyeong marine ranching ground were in the range of ND$\sim$0.0273 ppb which are similar with the values of 8$\sim$35 ng Sn $L^{-1}$ (0.008$\sim$0.035 ppb) in Chinhae Bay studied by Shim et al.. Therefore, the quality of sea water in Tongyeong marine ranching ground was safe enough to protect human health.

• Journal of the Microelectronics and Packaging Society
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• v.12 no.2 s.35
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• pp.167-174
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• 2005

Smaller size and higher integration of electronic components make smaller gap between metal conducting layers in electronic package. Under harsh environmental conditions (high temperature/humidity), electronic component respond to applied voltages by electrochemically ionization of metal and metal filament formation, which lead to short failure and this phenomenon is termed electrochemical migration(ECM). In this work, printed circuit board(PCB) is used for determination of ECM characteristics. Copper leads of PCB are soldered by eutectic solder alloys. Insulation breakdown time is measured at $85^{\circ}C,\;85{\%}RH$. CAF is the main mechanism of ECM at PCB. Pb is more susceptible to CAF rather than Sn, which corresponds well to the corrosion resistance of solder materials in aqueous environment. Polarization tests in chloride or chloride-free solutions fur pure metal and eutectic solder alloys are performed to understand ECM characteristics. Lifetime results show well defined log-normal distribution which resulted in biased voltage factor(n=2) by voltage scaling. Details on migration mechanism and lifetime statistics will be presented and discussed.

• Journal of the Microelectronics and Packaging Society
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• v.7 no.2
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• pp.55-62
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• 2000

The wetting balance test was performed in an attempt to estimate the wetting properties of the UBM-coated Si-wafer on one side to the Sn-Pb solder. The wetting curves of the one and both side-coated UBM layers had the similar shape and the parameters characterizing the curve shape showed the similar transition tendency to the temperature. The wetting property estimation was possible with the new wettability indices from the wetting curves of one side-coated specimen; $F_{min}$, $F_{s}t_{s}$ and $t_s$. For UBM of Si-chip, Au/Cu/Cr UBM was better than Au/Ni/Ti in the point of wetting time. The contact angle of the one side coated Si-plate to the Sn-Pb solder could be calculated from the force balance equation by measuring the static state force and the tilt angle.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.34 no.1
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• pp.43-48
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• 2010

The heat sink system for a main board in a network server computer is built on printed circuit board by an anchor structure, mounted by eutectic SnPb solder. The solder creeping is caused by a constant high temperature condition in the computer and it eventually makes fatal failures. The FE model is used to calculate the stress and predict the life of soldered anchor in the computer. In the model, Anand constitutive equation is employed to simulate creep characteristics of solder. The creep test is conducted to verify and calibrate the solder model. A special jig is designed to mitigate the flexure of printed circuit board and to get the creep deformation of solder only in the test. Test results are compared with analysis and calibration is conducted on Anand model's constants. Precise life prediction of soldered anchor in creep condition can be performed by this model.

• Journal of Conservation Science
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• v.17 s.17
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• pp.33-38
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• 2005

One piece of Haedong-Tongue(해동통보) minted at 1,102 A.D. was excavated from No.20 wooden coffin, Sinbong-dong, Cheongju. It was analyzed by micro-XRF and ICP and determined the concentrations of ten elements such as Cu, Pb, Sn, Zn, Fe, Mn, Sb, Co, As, Ag and Ni. The measurement of lead isotope ratios was also carried out in order to predict the provenance of raw materials used for minting of Haedong-Tongbo. It was found that Haedong-Tongbo was minted with three compositions of $Cu\;75.5\%,\;Pb\;13.3\%\;and\;Sn\;6.0\%$, which were different from the typical composition of Chosen-Tongbo and Sangpyung-Tongbo used in Chosen dynasty. Lead isotope ratios of Haedong-Tongbo showed that the provenance of lead used for minting of it suggested the possibility to be originated from Southern part of Korea.

• Journal of the Microelectronics and Packaging Society
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• v.17 no.3
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• pp.11-15
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• 2010

In this paper, we focused on the optimization of bonding conditions for the successful thermo-compression bonding of electrodes between the RPCB and FPCB with Sn-Pb solder. The peel strength was proportionally affected by the bonding conditions, such as pressure, temperature, and time. In order to figure out an optimized bonding condition, fracture energies were calculated through F-x (force-displacement) curves in the peel test. The optimum condition for the thermo-compression bonding of electrodes between the RPCB and FPCB was found to be temperature of $225^{\circ}C$ and time of 7 s, and its peel strength was 22 N/cm.

• Journal of Digital Convergence
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• v.18 no.5
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• pp.399-404
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• 2020

The purpose of this study is to find out the consumer's purchasing behavior and its factors when a convenience store brand is marketing new PB products online. For this study, we surveyed 2030 millennials about the purchase behavior of convenience store PB products and the paths to encounter PB products. As a result, consumers who purchase convenience store PB products were exposed to the product through SNS or YouTube, and they tended to join the trend by posting on SNS after purchase. In this study, we want to examine the consumption trends of millennials that have this type of consumption and the concept of online marketing that affects them. It is hoped that future consumer purchases will continue to be valuable consumption rather than relying on trends.

• Journal of the Microelectronics and Packaging Society
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• v.12 no.2 s.35
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• pp.121-128
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• 2005

Solder joints in microelectronic devices are frequently operated at an elevated temperature in service. They also experience plastic deformation caused by temperature excursion and difference in thermal expansion coefficients. Deformed solders can go through a recovery and recrystallization process at an elevated temperature, which would alter their microstructure and mechanical properties. In this study, to predict the changes in mechanical properties of Pb-free solder joints at high temperatures, the high temperature microhardness of several Pb-free and composite solders was measured as a function of temperature, deformation, and annealing condition. Solder alleys investigated include pure Sn, Sn-0.7Cu, Sn-3.5Ag, Sn-3.8Ag-0.7Cu, Sn-2.8Ag-7.0Cu (composite), and Sn-2.7Ag-4.9Cu-2.9Ni (composite). Numbers are all in wt.$\%$ unless specified otherwise. Solder pellets were cast at two cooling rates (0.4 and $7^{\circ}C$/s). The pellets were compressively deformed by $30\%$ and $50\%$ and annealed at $150^{\circ}C$ for 2 days. The microhardness was measured as a function of indentation temperature from 25 to $130^{\circ}C$. Their microstructure was also evaluated to correlate with the changes in microhardness.