• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.06a
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• pp.18-18
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• 2007

지난 수년 동안 Sn-3.0Ag-0.5Cu 합금은 전자산업의 표준 무연솔더 조성으로 전자제품의 제작에 사용되어져 왔으며, 그 신뢰성도 충분히 검증되어 대표적인 무연 솔더 조성으로의 입지를 굳혀왔다. 그러나 전자제품의 mobile화에 따른 내충격 신뢰성에 대한 요구와 최근의 급격한 Ag 가격의 상승은 Ag 함량의 축소에 의한 원가절감을 요청하게 되었으며, 이에 따라 소량의 Ag를 함유하는 솔더 조성 개발에 대한 연구가 산업 현장을 중심으로 절실히 요청되고 있다. Sn-Ag-Cu의 3원계 함긍에서 Ag는 합금의 융점을 낮추고, 강도와 같은 합금의 기계적 특성을 증가시키는 한편, 모재에 대한 합금의 젖음성을 향상시키는데 필수적인 원소로 인식되고 있다. 따라서 Sn-Ag-Cu의 3원계 함금에서 Ag의 함량을 감소시키게 되면, 합금액 액상선 온도와 고상선 온도가 벌어져 pasty range(또는 mush zone)가 증가하게 되고, wettability도 감소하게 되어 솔더 합금으로서의 요구 특성을 많이 상실하게 된다. 또한 Ag 함량을 감소시키게 되면 합금의 elongation이 향상되면서 내 impact 수명이 향상되는 효과를 볼 수 있으나, 합금의 creep 특성 및 기계적인 강도는 감소하면서 열싸이클링 수명은 감소하는 경향을 나타내게 된다. 따라서 솔더 합금의 내 impact 수명과 열싸이클링 수명을 동시에 만족시키지 위해서는 Ag 함량을 최적화하기 위한 고려가 필요하며, 합금원소에 대한 연구가 요청된다고 하겠다. 한편 Ag의 함량을 3wt.% 이상으로 첨가할 경우에도 비교적 느린 응고 속도에서는 조대한 판상의 $Ag_3Sn$ 상을 형성하는 경향이 있어 외관 물량을 야기 시킬 가능성이 매우 커지는 현상도 보고되고 있다. 따라서 Ag의 첨가량을 최적화 하면서 솔더 재료로서의 특성을 계속적으로 유지하기 위해서는 제 4 원소의 함유가 필수적이라고 할 수 있다. 본 연구에서는 Sn-Ag-Cu계에 첨부하는 제 4원소로서 In을 선택하였다. 비록 In은 Ag보다 고가이기 때문에 산업적인 적용을 위한 솔더 합금 원소로는 거의 각광받지 못했으나, 본 연구의 결과로는 In은 매우 소량 첨가할 경우에도 Sn-Ag-Cu계 합금, 특히 소량의 Ag를 함유하는 Sn-Ag-Cu계 합금의 wettabilty와 기계적 특성 향상에 매우 효과적임을 알 수 있었다. 결론적으로 본 연구를 통해 구현된 Sn-Ag-Cu-In계 최적 솔더 조성의 경우 Sn-3.0Ag-0.5Cu의 표준 조성에 비하여 약 18%의 원자재 가격 절감을 도모할 수 있을 것으로 예상되는 한편. Sn-3.0Ag-0.5Cu에 유사하거나 우수한 wettability 특성을 나타내었고. Sn-1.0Ag-0.5Cu 또는 Sn-l.2Ag-0.5Cu-0.05Ni 조성보다는 월등히 우수한 wettability 특성을 나타내었다. 더구나 Sn-Ag-Cu-In계 최적 솔더 조성은 합금의 강도 저하는 최소화 시키면서 합금의 elongation은 극적으로 향상시켜 합금의 toughness 값이 매우 우수한 특성을 가짐을 알 수 있었다. 이렇게 우수한 toughness 값은 솔더 조인트의 대표적 신뢰성 요구 특성인 열싸이클링 수명과 내 impact 수명을 동시에 향상시킬 수 있을 것으로 예상된다. 요컨대 본 연구를 통해 구현된 Sn-Ag-Cu-In계 솔더 조성은 최적 솔더 조성에서 요구되는 4가지 인자, 즉, 저렴한 원재료 가격, 우수한 wettability 특성, 합금 자체의 높은 toughness, 안정하고 낮은 성장 속도의 계면 반응층 생성을 모두 만족시키는 특징을 가짐으로서 기존 무연솔더 조성의 새로운 대안으로 자리 잡을 것으로 기대된다.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.20 no.2
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• pp.187-192
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• 2011

UBM(Under Bump Metallurgy) is very important for successful realization of Flip-Chip technology. In this study, it is investigated the interfacial reactions between various Sn-Ag solder alloys and Ni-P/Au UBM and Cu plate finish. It is also evaluated the shear strength by using the micro shear-punch test method for Sn-37Pb alloy, binary and ternary alloys of environment-friendly Pb-free solder alloys which are applied in the electronic packages. In terms of interfacial microstructure, the Pb-free solder joints have thicker IMCs than the Sn-Pb solder joints. The thickness of IMC is related to Reflow time. The IMC has been observed to grow with the increase in Reflow time. As a result of the shear test, in case of Max. shear strength, Pb-free solder showed the highest strength value and Sn-37Pb showed the lowest strength value 10 be generally condition of Reflow time.

• Proceedings of the KIEE Conference
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• 2003.10a
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• pp.273-275
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• 2003

본 실험은 고출력 반도체 레이저의 p-side-down 마운팅용 솔더로서 AuSn 합금 솔더(80wt%:20wt%)의 적합성에 대해 연구하였다. $1{\mu}m$이하의 균일도로 폴리싱 된 Cu heat sink의 표면에 두께 $1{\mu}m$의 Ni로 코팅을 한다음, AuSn 다층박막은 e-beam 증착기로 AuSn 합금 솔더는 열증착기로 각각 증착하였다. 열처리는 산화 방지를 위해 $N_2$ 분위기에서 행하였으며, 동일한 압력으로 마운팅을 하였다. 표면의 거칠기와 형상은 AFM(Atomic Force Microscope)과 SEM(Scanning Electron Microscopy)으로 그리고 Au와 Sn의 성분비는 AES(Auger Electron Spectroscopy) 로 비교하였다. 또한 CW(연속발진)을 통한 L-I(Light-Current)측정을 통해 본딩상태를 비교하였다.

• Journal of Powder Materials
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• v.20 no.1
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• pp.33-36
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• 2013

A bulk metallic glass-forming alloy, $Ni_{59}Zr_{20}Ti_{16}Si_2Sn_3$ metallic glass powders was used for good commercial availability and good formability in supercooled liquid region. In this study, the Ni-based metallic glass was synthesized using by high pressure gas atomized metallic glass powders. In order to create a bulk metallic glass sample, the $Ni_{59}Zr_{20}Ti_{16}Si_2Sn_3$ metallic glass powders with ball-milled Ni-based amorphous powder with 40%vol brass powder and Cu powder for 20 hours. The composite specimens were prepared by Spark Plasma Sintering for the precursor. The SPS was performed at supercooled liquid region of Ni-based metallic glass. The amorphous structure of the final sample was characterized by SEM, X-ray diffraction and DSC analysis.

• Proceedings of the Korean Powder Metallurgy Institute Conference
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• 2006.09b
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• pp.936-936
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• 2006

Bulk amorphous materials have been intensively studied to apply for various advanced industry fields due to their high mechanical, chemical and electrical properties. These materials have been produced by several techniques such as mechanical alloying, melt spinning and gas atomization, etc. Among them, the atomization is the most potential technique for commercialization due to high cooling rate during solidification of the melt and mass productivity. However, the amorphous powders still have some limitations because of their low ductility and toughness. Therefore, intensive efforts have to be carried out to increase the ductility and toughness. In this study, the Ni-based amorphous powder was produced by the gas atomization process. And in order to increase the ductile toughness, ductile Cu phase was coated on the Ni amorphous powder by spray drying process. The characteristics of the as-synthesis powders have been examined and briefly mentioned. The master alloy with $Ni_{57}Zr_{20}Ti_{16}Si_2Sn_3$ was prepared by vacuum induction melting furnace with graphite crucible and mold. The atomization was conducted at $1450^{\circ}C$ under the vacuum of $10^{-2}$ torr. The gas pressure during atomization was varied from 35 to 50 bars. After making the Ni amorphous powders, the spray drying was processed to produce the Cu -coated Ni amorphous composite powder. The amorphous powder and Cu nitrate solution were mixed together with a small amount of binder and then it was sprayed at temperature of $130^{\circ}C$ and rotating speed of 15,000 R.P.M.

• Archives of design research
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• v.17 no.4
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• pp.241-250
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• 2004

In this research, the copper alloy plates C2200, C5210, C7701, C8113 were selected to make datum and to identify further usage of metal craft experimentation. For its experimentation, the general welding and TIG welding methods were researched; for 2nd experimentation, the Reticulation and Electroforming skill's differences in color and temperature were researched. With these methods 3 different kinds of works are introduced for sample studies. For this research, Dr. Lee, Dong-Woo who works in Poongsan Metal Co, supported 4 kinds of copper alloy metals. Which are Commercial bronze (Cu-Zn), Deoxidiged Copper(Cu-Sn-P), Nickel Silver (Cu-Ni-Zn), and White Bronze (Cu-Ni); they were applied partly and wholly by the method of Laminatin, Reticulation, Fusing, and Electroforming skills. In case of C2200, the brass, the A. C. TIG welding method is better under 2mm slight plate; the D.C. TIG welding is better upper 2mm plate; and 250~300$^{\circ}C$ is recommended for remain heat treatment. In case of C5210, not having Hydrogen in high temperature return period, doesn't need Oxygen in high temperature and hardening in comparative high temperature neither, it is good for welding. It contains Sn 2-9% ad P 0.03-0.4% generally; and in accordance with the growth rate of Sn contain amount, the harden temperature boundary become broad. In case of cold moment after welding, they are recommended that higher speed TIG welding, smaller melting site and less than 200$^{\circ}C$ for pre-heating temperature. In case of C7701, the 10-20% Ni, 15-30% Zn are widely used.. If it is upper 30% Zn, it become (${\alpha}+{\beta}$) system and adhesive power rate become lower, and the productivity become lower in low temperature but the productivity become higher in high temperature. Nickel Silver's resistance of electricity is well; and the heatproof and incorrodibility is good, too. Lastly, in case of C8113, good at persistence in salty and grind; high in strength of high temperature. In case of white brass, contain 10-30% Nickel and hardened in high temperature and become single phrase. For these reason, the crystallization particles easily become large, if the resistance become higher small amount of Pb, P, S separation rate become higher.

• Journal of Powder Materials
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• v.11 no.5
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• pp.412-420
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• 2004

The purpose of the present study is to determine an optimum composition using cheaper powders keeping with high performance of hard rock cutting diamond saw blade. With 50Fe-20(Cu . Sn)-30Co specimen, a part of Co was replaced by Ni(5%, 10%, and 15%, respectively). These specimens were hot pressed and sintered for predetermined time at various temperature. Sintering is performed by two different methods of temperature controlled method and specimen dimension controlled method. In order to determine the property of the sintered diamond saw blade, 3 point bending tester, X-ray diffractometer, and SEM were used. As the Co in the bond alloy was replaced by Ni, the hardness of the specimen increased. Thus the 50Fe-20(CuㆍSn)-15Co-15Ni specimen showed the maximum hardness of 104(HRB). The results of 3 point bending test showed that flexure strength decreased along with increase in Ni content. This is attributed to the formation of intermetallic compound(Ni$_{x}$Sn) determined by X-ray diffraction. The fracture surface after 3 point bending test showed that diamond was fractured in the specimen containing 0%, 5%, and 10%Ni, and the fracture occurred at the interface between diamond and matrix in the specimen containing 15%Ni. The cutting ability test showed that the abrasive property was not changed in the specimen containing 0%, 5%, and 10%Ni. The optimum composition determined in this study is 50Fe-20(CuㆍSn)-20Co-10Ni.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.24 no.5
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• pp.224-228
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• 2014

Recently, the demands for separation/recovery of valuable metals such as nickel or tin from copper based alloys has been attracting much attention from the viewpoints of environmental protection and resource utilization. In this report, experimental results on concentration increasement of nickel and tin compared to the previous report are investigated. Ni is successfully separated by a organic solvent and reduced to the metal powder whose concentration is over 98 %. Sn is separated by a selective solution method and its concentration is increased to 97.5 % by three consecutive solution and reduction process. Crystal structure, surface morphology and microstructure of the separated samples are studied.

• Proceedings of the KWS Conference
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• 2002.10a
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• pp.439-449
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• 2002

This paper reviews our recent research works on the interconnection technologies in electronic packaging and assembly. At the aspect of advanced joining methods, laser-ultrasonic fluxless soldering technology was proposed. The characteristic of this technology is that the oxide film was removed through the vibration excitated by high frequency laser change in the molten solder droplet. Application researches of laser soldering technology on solder bumping of BGA packages were carried out. Furthermore, interfacial reaction between SnPb eutectic solder and Au/Ni/Cu pad during laser reflow was analyzed. At the aspect of soldered joints' reliability, the system for predicting and analyzing SMT solder joint shape and reliability(PSAR) has been designed. Optimization design method of soldered joints' structure was brought forward after the investigation of fatigue failure of RC chip devices and BGA packages under temperature cyclic conditions with FEM analysis and experimental study. At the aspect of solder alloy design, alloy design method based on quantum was proposed. The macroproperties such as melting point, wettability and strength were described by the electron parameters. In this way, a great deal of the experimental investigations was replaced, so as to realize the design and research of any kinds of solder alloys with low cost and high efficiency.

• Journal of Powder Materials
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• v.9 no.6
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• pp.394-408
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• 2002

Nanostructured high strength metastable Al-, Mg- and Ti-based alloys containing different amorphous, quasicrystalline and nanocrystalline phases are synthesized by non-equilibrium processing techniques. Such alloys can be prepared by quenching from the melt or by powder metallurgy techniques. This paper focuses on one hand on mechanically alloyed and ball milled powders containing different volume fractions of amorphous or nano-(quasi)crystalline phases, consolidated bulk specimens and, on the other hand. on cast specimens containing different constituent phases with different length-scale. As one example. $Mg_{55}Y_{15}Cu_{30}$- based metallic glass matrix composites are produced by mechanical alloying of elemental powder mixtures containing up to 30 vol.% $Y_2O_3$ particles. The comparison with the particle-free metallic glass reveals that the nanosized second phase oxide particles do not significantly affect the glass-forming ability upon mechanical alloying despite some limited particle dissolution. A supercooled liquid region with an extension of about 50 K can be maintained in the presence of the oxides. The distinct viscosity decrease in the supercooled liquid regime allows to consolidate the powders into bulk samples by uniaxial hot pressing. The $Y_2O_3$ additions increase the mechanical strength of the composites compared to the $Mg_{55}Y_{15}Cu_{30}$ metallic glass. The second example deals with Al-Mn-Ce and Al-Cu-Fe composites with quasicrystalline particles as reinforcements, which are prepared by quenching from the melt and by powder metallurgy. $Al_{98-x}Mn_xCe_2$ (x =5,6,7) melt-spun ribbons containing a major quasicrystalline phase coexisting with an Al-matrix on a nanometer scale are pulverized by ball milling. The powders are consolidated by hot extrusion. Grain growth during consolidation causes the formation of a micrometer-scale microstructure. Mechanical alloying of $Al_{63}Cu_{25}Fe_{12}$ leads to single-phase quasicrystalline powders. which are blended with different volume fractions of pure Al-powder and hot extruded forming $Al_{100-x}$$(Al_{0.63}Cu_{0.25}Fe_{0.12})_x$ (x = 40,50,60,80) micrometer-scale composites. Compression test data reveal a high yield strength of ${\sigma}_y{\geq}$700 MPa and a ductility of ${\varepsilon}_{pl}{\geq}$5% for than the Al-Mn-Ce bulk samples. The strength level of the Al-Cu-Fe alloys is ${\sigma}_y{\leq}$550 MPa significantly lower. By the addition of different amounts of aluminum, the mechanical properties can be tuned to a wide range. Finally, a bulk metallic glass-forming Ti-Cu-Ni-Sn alloy with in situ formed composite microstructure prepared by both centrifugal and injection casting presents more than 6% plastic strain under compressive stress at room temperature. The in situ formed composite contains dendritic hcp Ti solid solution precipitates and a few $Ti_3Sn,\;{\beta}$-(Cu, Sn) grains dispersed in a glassy matrix. The composite micro- structure can avoid the development of the highly localized shear bands typical for the room temperature defor-mation of monolithic glasses. Instead, widely developed shear bands with evident protuberance are observed. resulting in significant yielding and homogeneous plastic deformation over the entire sample.